KR900007108A - 압접형 반도체장치 - Google Patents

압접형 반도체장치

Info

Publication number
KR900007108A
KR900007108A KR1019890015033A KR890015033A KR900007108A KR 900007108 A KR900007108 A KR 900007108A KR 1019890015033 A KR1019890015033 A KR 1019890015033A KR 890015033 A KR890015033 A KR 890015033A KR 900007108 A KR900007108 A KR 900007108A
Authority
KR
South Korea
Prior art keywords
press
semiconductor device
type semiconductor
type
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019890015033A
Other languages
English (en)
Other versions
KR930007517B1 (ko
Inventor
히데오 마츠다
마사미 이와사키
미츠히코 기타가와
요시오 요코다
가즈오 와타누키
다카시 후지와라
Original Assignee
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 도시바 filed Critical 가부시키가이샤 도시바
Publication of KR900007108A publication Critical patent/KR900007108A/ko
Application granted granted Critical
Publication of KR930007517B1 publication Critical patent/KR930007517B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/482—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes for individual devices provided for in groups H10D8/00 - H10D48/00, e.g. for power transistors
    • H10W20/484—Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
KR1019890015033A 1988-10-19 1989-10-19 압접형 반도체장치 Expired - Fee Related KR930007517B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63-263455 1988-10-19
JP63263455A JP2739970B2 (ja) 1988-10-19 1988-10-19 圧接型半導体装置

Publications (2)

Publication Number Publication Date
KR900007108A true KR900007108A (ko) 1990-05-09
KR930007517B1 KR930007517B1 (ko) 1993-08-12

Family

ID=17389752

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890015033A Expired - Fee Related KR930007517B1 (ko) 1988-10-19 1989-10-19 압접형 반도체장치

Country Status (4)

Country Link
US (1) US4996586A (ko)
EP (1) EP0365007A3 (ko)
JP (1) JP2739970B2 (ko)
KR (1) KR930007517B1 (ko)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3258200B2 (ja) * 1995-05-31 2002-02-18 株式会社東芝 圧接型半導体装置
US5210601A (en) * 1989-10-31 1993-05-11 Kabushiki Kaisha Toshiba Compression contacted semiconductor device and method for making of the same
JP2755761B2 (ja) * 1990-01-26 1998-05-25 株式会社東芝 半導体装置
JP3137375B2 (ja) * 1990-09-20 2001-02-19 株式会社東芝 圧接型半導体装置
GB9109542D0 (en) * 1991-05-02 1991-06-26 Semitron Ind Ltd Semiconductor device assembly
JP2804216B2 (ja) * 1993-06-22 1998-09-24 株式会社日立製作所 ゲートターンオフサイリスタ
JP3471880B2 (ja) * 1994-02-23 2003-12-02 三菱電機株式会社 圧接型半導体装置
JPH08242009A (ja) * 1994-12-02 1996-09-17 Eurec Europ G Fur Leistungshalbleiter Mbh & Co Kg パワー半導体デバイス
JP3588503B2 (ja) * 1995-06-20 2004-11-10 株式会社東芝 圧接型半導体装置
US5652467A (en) * 1995-07-27 1997-07-29 Hitachi, Ltd. Semiconductor device and package structure therefore and power inverter having semiconductor device
JPH09135023A (ja) * 1995-11-08 1997-05-20 Toshiba Corp 圧接型半導体装置
JP3018971B2 (ja) * 1995-12-18 2000-03-13 富士電機株式会社 半導体装置
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
US6521916B2 (en) * 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
DE10041112B4 (de) * 2000-08-22 2006-05-24 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Isolierelement
JP3954314B2 (ja) * 2001-01-23 2007-08-08 株式会社東芝 圧接型半導体装置
US6639360B2 (en) 2001-01-31 2003-10-28 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
US7075112B2 (en) * 2001-01-31 2006-07-11 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
EP1298733A1 (en) * 2001-09-28 2003-04-02 ABB Schweiz AG Turn-off high-power semiconductor device
JP2005116355A (ja) 2003-10-08 2005-04-28 Nec Microwave Inc マイクロ波管システム及びマイクロ波管
US8070329B1 (en) 2005-02-11 2011-12-06 Gentex Corporation Light emitting optical systems and assemblies and systems incorporating the same
DE102014005879B4 (de) * 2014-04-16 2021-12-16 Infineon Technologies Ag Vertikale Halbleitervorrichtung
US9455253B2 (en) * 2014-07-23 2016-09-27 Stmicroelectronics (Tours) Sas Bidirectional switch
US10181445B2 (en) * 2014-12-29 2019-01-15 Mitsubishi Electric Corporation Power module
WO2022043033A2 (en) * 2020-08-31 2022-03-03 Hitachi Energy Switzerland Ag Electronic device, package and semiconductor chip therefore

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4099201A (en) * 1977-04-11 1978-07-04 General Electric Company Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc
JPS5591151U (ko) * 1978-12-19 1980-06-24
JPS57100737A (en) * 1980-12-16 1982-06-23 Toshiba Corp Semiconductor device
JPS5871658A (ja) * 1981-10-23 1983-04-28 Toshiba Corp 圧接型半導体装置
JPS594033A (ja) * 1982-06-30 1984-01-10 Toshiba Corp 圧接型半導体装置
JPS5986260A (ja) * 1982-11-10 1984-05-18 Hitachi Ltd ゲ−トタ−ンオフサイリスタ
DE3308661A1 (de) * 1983-03-11 1984-09-20 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterelement
JPS60154629A (ja) * 1984-01-25 1985-08-14 Hitachi Ltd 圧接型半導体装置
JPS60133648U (ja) * 1984-02-16 1985-09-06 株式会社　富士電機総合研究所 半導体装置
JPS6197933A (ja) * 1984-10-19 1986-05-16 Hitachi Ltd 全圧接型半導体装置
JPH065686B2 (ja) * 1985-09-04 1994-01-19 株式会社日立製作所 圧接型半導体装置
JPH081914B2 (ja) * 1987-03-31 1996-01-10 株式会社東芝 圧接型半導体装置

Also Published As

Publication number Publication date
JPH02110944A (ja) 1990-04-24
JP2739970B2 (ja) 1998-04-15
KR930007517B1 (ko) 1993-08-12
EP0365007A2 (en) 1990-04-25
US4996586A (en) 1991-02-26
EP0365007A3 (en) 1991-01-23

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