KR910001830A - 고체 전해 콘덴서의 제조 방법 - Google Patents
고체 전해 콘덴서의 제조 방법 Download PDFInfo
- Publication number
- KR910001830A KR910001830A KR1019900009000A KR900009000A KR910001830A KR 910001830 A KR910001830 A KR 910001830A KR 1019900009000 A KR1019900009000 A KR 1019900009000A KR 900009000 A KR900009000 A KR 900009000A KR 910001830 A KR910001830 A KR 910001830A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- electrolytic
- forming metal
- polymerization
- dielectric oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/025—Solid electrolytes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
- H01G9/0036—Formation of the solid electrolyte layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Abstract
Description
Claims (8)
- 알루미늄이나 탄탈등의 막 작용을 갖고 있는 피막 형성성 금속의 표면에 절연성 유전체 산화 피막을 형성하고, 피롤, 티오펜, 아닐린, 푸란등의 도전성 물질이 용해된 전해액 중에 상기 피막 형성성 금속과 전해 중화용 대극 적극을 침지하며, 교류 전류에 정(+)직류 바이어스 전류를 중첩한 전류원, 또는 교류 전류를 전단한 전류원을 상기 피막 형성성 금속과 상기 전해 중합용 대극 전극사이에 접속하고, 상기 피막 형성성 금속측으로 부전압이 인가되지 않은 상태에서, 상기 전해액 및 상기 절연성 유전체 산화 피막을 통해 통전하여 전해 중합을 행하고, 상기 유전체 산화 피막 상기 피롤, 티오펜, 아닐린, 푸란 등의 도전성 고분자층을 형성하는 것을 특징으로 하는 고체 전해 콘덴서의 제조 방법.
- 제1항에 있어서, 피막 형성성 금속 표면에 절연성의 유전체 산화 피막을 형성후, 상기 유전체 산화 피막상에 화학 산화 중합에 의해 화학산화 중합 도전성 고분자 막을 형성하고, 상기 전해 중합에 의해 도전성 고분자층을 형성하는 것을 특징으로 하는 고체 전해 콘덴서의 제조방법.
- 제1항에 있어서, 상기 피막 형성성 금속에 접속되어 있는 전극 인출용 리드선을 통해 전해 중합의 급전을 행하는 것을 특징으로 하는 고체 전해 콘덴서의 제조 방법.
- 알루미늄이나 탄탈 등의 막 작용을 갖고 있는 피막 형성성 금속의 표면에 절연성 유전체 산화 피막을 형성하고, 피롤, 티오펜, 아닐린, 푸란등의 도전성 물질이 용해된 전해액에 상기 피막 형성성 금속과 전해 중합용 대극 전극을 침지하며, 주기적으로 또는 단속적으로 흐르는 직류 전류원을 상기 피막 형성성 금속과 전해 중합용 대극 전극 사이에 접속하여, 상기 피막 형성성 금속측에 부전압이 인가되지 않은 상태에서, 상기 전해액 및 상기 절연성의 유전체 산화 피막을 통해 통전하여, 전해 중합을 행하고, 상기 유전체 산화 피막상에 상기 피롤, 티오펜, 이닐린, 푸란등의 도전성 고분자층을 형성하는 것을 특징으로 하는 고체 전해 콘덴서의 제조방법.
- 제4항에 있어서, 피막 형성성 금속 표면에 절연성의 유전체 산화피막을 형성한 후, 상기 유전체 산화 피막상에 화학 산화 중합에 의해 화학산화 중합 도전성 고분자 막을 형성하고, 상기 전해 중합에 의해 도전성 고분자층을 형성하는 것을 특징으로 하는 전해 콘덴서의 제조 방법.
- 제4항에 있어서, 상기 피막 형성성 금속에 접속되어 있는 전극 인출용 리드선을 통해 전해 중합의 급전을 행하는 것을 특징으로 하는 고체전해 콘덴서의 제조방법.
- 알루미늄이나 탄탈등의 도전체 표면에 유전체 산화 피막과 같은 절연성 박막을 형성하고, 피롤, 티오펜, 이닐린, 푸란 등의 도전성 물질이 용해된 전해액에 상기 도전체와 전해 중합용 대극 전극을 침지하고, 교류 전류에 정(+) 직류 바이어스 전류를 중첩한 전류원, 또는 주기적으로 또는 단속적으로 흐르는 직류 전류원을 상기 도전체와 상기 전해 중합용 대극 전극사이에 접속하여, 상기 도전체측으로 부전압이 인가되지 않은 상태에서 상기 전해액 및 상기 절연성 박막을 통해 통전하여, 전해 중합을 행하고, 상기 절연성 박막상에 상기 피롤, 티오펜, 아닐린, 푸란등의 도전성 고분자의 박막층을 형성하는 것을 특징으로 하는 절연 박막이 형성된 도전체에로의 전해 코팅방법.
- 제7항에 있어서, 알루미늄이나 탄탈등의 도전체 표면에 유전체 산화피막과 같은 절연성 박막을 형성한 후, 이 절연성 박막상에 화학 산화 중합에 의해 화학 산화 중합 도전성 고분자막을 형성하고, 상기 전해 중합에 의해 도전성 고분자층을 형성하는 것을 특징으로 하는 절연 박막이 형성된 도전체에로의 전해 코팅방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1-157399 | 1989-06-20 | ||
| JP1157399A JP2810418B2 (ja) | 1989-06-20 | 1989-06-20 | 固体電解コンデンサの製造方法 |
| JP1-185598 | 1989-07-18 | ||
| JP18559889A JPH0350712A (ja) | 1989-07-18 | 1989-07-18 | 絶縁薄膜の形成された導電体への電解コーティング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR910001830A true KR910001830A (ko) | 1991-01-31 |
| KR0184637B1 KR0184637B1 (ko) | 1999-05-15 |
Family
ID=26484867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019900009000A Expired - Fee Related KR0184637B1 (ko) | 1989-06-20 | 1990-06-19 | 고체 전해 콘덴서의 제조 방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5017272A (ko) |
| EP (1) | EP0408913B1 (ko) |
| KR (1) | KR0184637B1 (ko) |
| DE (1) | DE69029614T2 (ko) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0471242A3 (en) * | 1990-08-13 | 1992-03-18 | Siemens Aktiengesellschaft | Solid electrolytic capacitor |
| JP3036027B2 (ja) * | 1990-08-31 | 2000-04-24 | 日本電気株式会社 | 固体電解コンデンサの製造方法 |
| US5223120A (en) * | 1990-11-22 | 1993-06-29 | Matsushita Electric Industrial Co., Ltd. | Method for fabricating solid electrolytic capacitors using an organic conductive layer |
| DE4136739A1 (de) * | 1991-11-05 | 1993-05-06 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | Elektropolymerisationsverfahren |
| US5672377A (en) * | 1992-12-17 | 1997-09-30 | Nec Corporation | Method of forming a solid electrolytic capacitor |
| GB9412633D0 (en) * | 1994-06-23 | 1994-08-10 | Aromascan Plc | Semiconducting organic polymers |
| US5980723A (en) * | 1997-08-27 | 1999-11-09 | Jude Runge-Marchese | Electrochemical deposition of a composite polymer metal oxide |
| US6674635B1 (en) | 2001-06-11 | 2004-01-06 | Avx Corporation | Protective coating for electrolytic capacitors |
| JP3906043B2 (ja) * | 2001-08-20 | 2007-04-18 | 三洋電機株式会社 | 固体電解コンデンサの製造方法 |
| US6671168B2 (en) | 2001-11-30 | 2003-12-30 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor and method for manufacturing the same |
| US6864147B1 (en) | 2002-06-11 | 2005-03-08 | Avx Corporation | Protective coating for electrolytic capacitors |
| EP1665301B1 (en) * | 2003-09-26 | 2018-12-12 | Showa Denko K.K. | Production method of a capacitor |
| JP4610382B2 (ja) * | 2005-03-17 | 2011-01-12 | 三洋電機株式会社 | 固体電解コンデンサおよびその製造方法 |
| US20080232038A1 (en) * | 2005-09-04 | 2008-09-25 | Cerel (Ceramic Technologies) Ltd. | Method For Electrophoretic Deposition Of Conductive Polymer Into Porous Solid Anodes For Electrolyte Capacitor |
| US7483259B2 (en) * | 2007-03-21 | 2009-01-27 | Avx Corporation | Solid electrolytic capacitor containing a barrier layer |
| US7515396B2 (en) * | 2007-03-21 | 2009-04-07 | Avx Corporation | Solid electrolytic capacitor containing a conductive polymer |
| US7460358B2 (en) * | 2007-03-21 | 2008-12-02 | Avx Corporation | Solid electrolytic capacitor containing a protective adhesive layer |
| JP5838448B2 (ja) * | 2009-08-07 | 2016-01-06 | イーメックス株式会社 | 導電性高分子複合構造体、導電性高分子複合構造体の製造方法、及び、アクチュエータ素子 |
| EP2618351A4 (en) * | 2010-09-17 | 2017-01-18 | Showa Denko K.K. | Solid electrolytic capacitor element, method for producing same, and tool for producing said solid electrolytic capacitor element |
| US11270847B1 (en) | 2019-05-17 | 2022-03-08 | KYOCERA AVX Components Corporation | Solid electrolytic capacitor with improved leakage current |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4780796A (en) * | 1987-01-13 | 1988-10-25 | The Japan Carlit Co., Ltd. | Solid electrolytic capacitor |
| JPS63249323A (ja) * | 1987-04-06 | 1988-10-17 | 松下電器産業株式会社 | 固体電解コンデンサ |
| KR910005752B1 (ko) * | 1987-04-07 | 1991-08-02 | 니쯔꼬 가부시끼가이샤 | 고체 전해 콘덴서 및 그 제조방법 |
| JPH0267708A (ja) * | 1988-09-02 | 1990-03-07 | Nitsuko Corp | 有機半導体固体電解コンデンサの製造方法 |
-
1990
- 1990-06-19 US US07/540,061 patent/US5017272A/en not_active Expired - Lifetime
- 1990-06-19 KR KR1019900009000A patent/KR0184637B1/ko not_active Expired - Fee Related
- 1990-06-20 EP EP90111692A patent/EP0408913B1/en not_active Expired - Lifetime
- 1990-06-20 DE DE69029614T patent/DE69029614T2/de not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US5017272A (en) | 1991-05-21 |
| KR0184637B1 (ko) | 1999-05-15 |
| DE69029614D1 (de) | 1997-02-20 |
| DE69029614T2 (de) | 1997-07-10 |
| EP0408913B1 (en) | 1997-01-08 |
| EP0408913A1 (en) | 1991-01-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR910001830A (ko) | 고체 전해 콘덴서의 제조 방법 | |
| US4552927A (en) | Conducting organic polymer based on polypyrrole | |
| BR9811735B1 (pt) | processo de anodização para a formação de uma pelìcula composta em um substrato metálico ou um substrato de silìcio. | |
| EP1357612A4 (en) | "CONDUCTIVE ORGANIC THIN FILM, PROCESS FOR ITS MANUFACTURE, ELECTRONIC COMPONENT THEREOF, ELECTRICAL CABLE, ELECTRODE, PYRROLYL CONNECTION AND THEIENYL CONNECTION" | |
| US3421195A (en) | Capacitor and method of making same | |
| JPH04112519A (ja) | 固体電解コンデンサの製造方法 | |
| Yamamoto et al. | Solid electrolytic capacitors using an aluminum alloy electrode and conducting polymers | |
| US3959090A (en) | Continuous electrolyte coloring of a pre-anodised aluminum foil or strip | |
| CN1860566B (zh) | 电容器的制备方法 | |
| JPS6432619A (en) | Manufacture of solid electrolytic capacitor | |
| US3726783A (en) | Apparatus for producing an aluminum foil or band with an electrically insulating or decorative coating thereon | |
| JPH0467767B2 (ko) | ||
| JPH05234823A (ja) | 固体電解コンデンサの製造方法 | |
| JPH0794369A (ja) | 固体電解コンデンサ | |
| JP2640866B2 (ja) | 固体電解コンデンサの製造方法 | |
| US2802256A (en) | Electric condensers | |
| JPH0350712A (ja) | 絶縁薄膜の形成された導電体への電解コーティング方法 | |
| JP2776113B2 (ja) | コンデンサの製造方法 | |
| US3471378A (en) | Method of manufacturing elemental part for dry type electrolytic condenser | |
| JPH0346212A (ja) | コンデンサ | |
| JP2902429B2 (ja) | 固体電解コンデンサ | |
| JP2940017B2 (ja) | 固体電解コンデンサの製造方法 | |
| JPH10125558A (ja) | 導電性機能高分子膜を固体電解質とする固体コンデンサ | |
| KR950009763A (ko) | 전도성 고분자 화합물을 음극으로 사용한 고체 전해 콘덴서 및 그의 제조법 | |
| KR940016311A (ko) | 무극성 탄탈륨 고체 전해 콘덴서 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| FPAY | Annual fee payment |
Payment date: 20081202 Year of fee payment: 11 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20091222 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20091222 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |