KR970052889A - 반도체 제조장치 - Google Patents
반도체 제조장치 Download PDFInfo
- Publication number
- KR970052889A KR970052889A KR1019950059235A KR19950059235A KR970052889A KR 970052889 A KR970052889 A KR 970052889A KR 1019950059235 A KR1019950059235 A KR 1019950059235A KR 19950059235 A KR19950059235 A KR 19950059235A KR 970052889 A KR970052889 A KR 970052889A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- air
- photoresist
- semiconductor manufacturing
- inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Coating Apparatus (AREA)
Abstract
Description
Claims (2)
- 공기를 유입하고 그리고 감광액분사노즐이 이송되는 유입구(15)와, 유입된 공기와 파티클을 배출시키는 유출구(16)를 구비하고, 스핀척(11)에 의해서 고정되고 그리고 따라 회전되는 웨이퍼(12)상에 감광액(13)을 도포하는 구조를 갖는 반도체 제조장치에 있어서, 상기 유입구(15)를 통하여 상기 웨이퍼(12)의 중앙으로 공기를 분사시키는 에어공급노즐(17)을 포함하는 것을 특징으로 하는 반도체 제조장치.
- 제1항에 있어서, 상기 에어공급노즐(17)은 상기 웨이퍼(12)의 직경보다 작은 직경을 갖는 것을 특징으로 하는 반도체 제조장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950059235A KR970052889A (ko) | 1995-12-27 | 1995-12-27 | 반도체 제조장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950059235A KR970052889A (ko) | 1995-12-27 | 1995-12-27 | 반도체 제조장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970052889A true KR970052889A (ko) | 1997-07-29 |
Family
ID=66618722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950059235A Withdrawn KR970052889A (ko) | 1995-12-27 | 1995-12-27 | 반도체 제조장치 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970052889A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990070781A (ko) * | 1998-02-24 | 1999-09-15 | 윤종용 | 스핀 도포 방법 및 장치 |
-
1995
- 1995-12-27 KR KR1019950059235A patent/KR970052889A/ko not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990070781A (ko) * | 1998-02-24 | 1999-09-15 | 윤종용 | 스핀 도포 방법 및 장치 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5887605A (en) | Apparatus for cleaning semiconductor wafers | |
| US6548110B1 (en) | Process liquid dispense method and apparatus | |
| KR950006970A (ko) | 웨이퍼 및 판형태의 물체에 액상의 화학약품을 회전도포하기 위한 장치 및 방법 | |
| KR960008999A (ko) | 현상처리장치 및 현상처리방법 | |
| JPH04124812A (ja) | 帯状液体ノズル及び液処理装置及び液処理方法 | |
| KR970052889A (ko) | 반도체 제조장치 | |
| KR20070036865A (ko) | 노즐 세정 장치 | |
| KR100454637B1 (ko) | 매엽식 반도체 웨이퍼용 약액 분사노즐 | |
| JPS57110674A (en) | Surface treating device | |
| US6992023B2 (en) | Method and system for drying semiconductor wafers in a spin coating process | |
| KR970017949A (ko) | 감광막의 도포방법 및 이에 사용되는 감광막도포장치 | |
| KR100232192B1 (ko) | 반도체소자 제조를 위한 감광막 도포 공정용 기포 발생장치 | |
| KR20040000933A (ko) | 포토레지스트 현상공정에 사용되는 초순수를 이용한초음파 가습식 프리웨팅 장치 | |
| KR970049043A (ko) | 감광액도포장치 | |
| JPS55108741A (en) | Resist coating device | |
| KR0172269B1 (ko) | 공정액 분사노즐 조립체 | |
| KR970077103A (ko) | 반도체 웨이퍼의 포토레지스터 도포장치 | |
| JP2004134448A (ja) | 半導体製造用現像装置 | |
| KR20000007993U (ko) | 감광막 현상 장치 | |
| KR960002595A (ko) | 현상액 공급방법 | |
| JPS59100524A (ja) | レジスト塗布方法 | |
| KR970063412A (ko) | 포토레지스트 도포장치 | |
| KR20000024739A (ko) | 웨이퍼형 노즐을 포함하는 현상액 도포장치 | |
| KR940015445A (ko) | 진공 건조 장치 및 그 장치를 사용한 건조 방법 | |
| JPH04321216A (ja) | スピンコータ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PC1203 | Withdrawal of no request for examination |
St.27 status event code: N-1-6-B10-B12-nap-PC1203 |
|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid | ||
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |