KR970053679A - 리드노출형 반도체 패키지 - Google Patents

리드노출형 반도체 패키지 Download PDF

Info

Publication number
KR970053679A
KR970053679A KR1019950067335A KR19950067335A KR970053679A KR 970053679 A KR970053679 A KR 970053679A KR 1019950067335 A KR1019950067335 A KR 1019950067335A KR 19950067335 A KR19950067335 A KR 19950067335A KR 970053679 A KR970053679 A KR 970053679A
Authority
KR
South Korea
Prior art keywords
lead
substrate connection
semiconductor chip
connection lead
semiconductor package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019950067335A
Other languages
English (en)
Other versions
KR0179803B1 (ko
Inventor
송치중
이주화
Original Assignee
문정환
Lg 반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, Lg 반도체 주식회사 filed Critical 문정환
Priority to KR1019950067335A priority Critical patent/KR0179803B1/ko
Priority to US08/701,949 priority patent/US5770888A/en
Priority to CN96109458A priority patent/CN1065662C/zh
Priority to TW085110298A priority patent/TW344887B/zh
Priority to JP34529096A priority patent/JP2992814B2/ja
Publication of KR970053679A publication Critical patent/KR970053679A/ko
Application granted granted Critical
Publication of KR0179803B1 publication Critical patent/KR0179803B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/415—Leadframe inner leads serving as die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

본 발명은 패키지의 상하면으로 제1 및 제2 기판접속리드가 노출되도록 몰딩시켜 패키지를 형성하므로써 다수개의 패키지를 적층시켜 용량확장이 가능하도록 된 리드노출형 반도체 패키지에 관한 것으로, 그 구성은 다수개의 본드패드가 다수개의 본드패드가 그의 하면에 형성된 반도체칩(21)과, 그의 상면에 상기 반도체칩(21)을 지지하는 제1 기판연결리드(22a)와 상기 제1 기판연결리드(22a)로부터 소정높이(h)를 가지도록 연장형성된 제2 기판연결리드(22b)를 포함하여 구성된 리드프레임(22)과, 상기 제1 기판연결리드(22a)와 상기 반도체칩(21) 사이에 개재되어 상기 반도체칩(21)을 상기 제1 기판연결리드(22a)의 상면에 고정시키는 접착부재(23)와, 상기 반도체칩(21)의 하면에 형성된 다수개의 본드패드와 상기 제2 기판연결리드(22b)의 하면을 전기적으로 연결시키는 금속와이어(24)와, 상기 반도체칩(21)과, 상기 제1 및 제2 기판연결리드(22a, 22b)를 포함하는 소정체적을 패키지의 하면 및 상면으로 상기 제1 기판연결리드(22a)의 하면과 제2 기판연결리드(22b)의 상면이 노출되도록 밀봉하는 수지(26)를 포함하여 구성된다.

Description

리드노출형 반도체 패키지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명에 따른 리드노출형 반도체 패키지의 제1실시예를 나타낸 단면도.

Claims (11)

  1. 다수개의 본드패드가 그의 하면에 형성된 반도체칩(21)과, 그의 상면에 상기 반도체칩(21)을 지지하는 제1 기판연결리드(22a)와 상기 제1 기판연결리드(22a)로부터 소정높이(h)의 단차를 가지도록 연장형성된 제2 기판연결리드(22b)를 포함하여 구성된 리드프레임(22)과, 상기 제1 기판연결리드(22a)와 상기 반도체칩(21) 사이에 개재되어 상기 반도체칩(21)을 상기 제1 기판연결리드(22a)의 상면에 고정시키는 접착부재(23)와, 상기 반도체칩(21)의 하면에 형성된 다수개의 본드패드와 상기 제2 기판연결리드(22b)의 하면을 전기적으로 연결시키는 금속와이어(24)와, 상기 반도체칩(21)과, 상기 제1 및 제2 기판연결리드(22a, 22b)를 포함하는 소정체적을 패키지의 하면 및 상면으로 상기 제1 기판연결리드(22a)의 하면과 제2 기판연결리드(22b)의 상면이 노출되도록 밀봉하는 수지(26)를 포함하여 구성된 것을 특징으로 하는 리드노출형 반도체 패키지.
  2. 제1항에 있어서, 상기 반도체칩(21)의 다수개의 본드패드와 제2 기판연결리드(22b)는 지그재그(zig-zag)형태로 금속와이어(24)에 의해 전기적으로 연결된 것을 특징으로 하는 리드노출형 반도체 패키지.
  3. 제1항에 있어서, 상기 접착부재(23)는 절연성 양면테이프인 것을 특징으로 하는 리드노출형 반도체 패키지.
  4. 제1항에 있어서, 상기 접착부재(23)는 절연성 페이스트 접착제인 것을 특징으로 하는 리드노출형 반도체 패키지.
  5. 제1항에 있어서, 상기 접착부재(23)는 에폭시계 테이프인 것을 특징으로 하는 리드노출형 반도체 패키지.
  6. 제1항에 있어서, 상기 접착부재(23)는 폴리이미드계 테이프인 것을 특징으로 하는 리드노출형 반도체 패키지.
  7. 다수개의 본드패드가 그의 하면에 형성된 반도체칩(21)과, 그의 상면에 상기 반도체칩(21)을 지지하는 제1 기판연결리드(22a)와 상기 제1 기판연결리드(22b)로부터 소정높이(h)의 단차를 가지고 연장형성된 제2 기판연결리드(22b)를 포함항 구성된 리드드레임(22)과, 상기 제1 기판연결리드(22a)와 상기 반도체칩(21)의 사이에 개재되어 상기 반도체칩(21)을 상기 제1 기판연결리드(22a)의 상면에 고정시키는 접착부재(23)와, 상기 제1 기판연결리드(22a)의 상면에 형성되어 상기 반도체칩(21)의 하면에 형성된 다수개의 본드패드와 전기적으로 연결시키는 솔더범프(25)와, 상기 반도체칩(21)과, 상기 제1 및 제2 기판연결리드(22a, 22b)를 포함하는 소정체적을 패키지의 하면 및 상면으로 상기 제1 기판연결리드(22a)의 하면과 제1 기판연결리드(22b)의 상면이 노출되도록 밀봉하는 수지(26)를 포함하여 구성된 것을 특징으로 하는 리드노출형 반도체 패키지.
  8. 제7항에 있어서, 상기 접착부재(23)는 절연성 양면테이프인 것을 특징으로 하는 리드노출형 반도체 패키지.
  9. 제7항에 있어서, 상기 접착부재(23)는 절연성 페이스트 접착제인 것을 특징으로 하는 리드노출형 반도체 패키지.
  10. 제7항에 있어서, 상기 접착부재(23)는 에폭시계 테이프인 것을 특징으로 하는 리드노출형 반도체 패키지.
  11. 제7항에 있어서, 상기 접착부재(23)는 폴리이미드계 테이프인 것을 특징으로 하는 리드노출형 반도체 패키지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950067335A 1995-12-29 1995-12-29 리드노출형 반도체 패키지 Expired - Fee Related KR0179803B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1019950067335A KR0179803B1 (ko) 1995-12-29 1995-12-29 리드노출형 반도체 패키지
US08/701,949 US5770888A (en) 1995-12-29 1996-08-23 Integrated chip package with reduced dimensions and leads exposed from the top and bottom of the package
CN96109458A CN1065662C (zh) 1995-12-29 1996-08-23 半导体芯片封装及其制造方法
TW085110298A TW344887B (en) 1995-12-29 1996-08-23 An improved integrated chip package with reduced dimensions
JP34529096A JP2992814B2 (ja) 1995-12-29 1996-12-25 半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950067335A KR0179803B1 (ko) 1995-12-29 1995-12-29 리드노출형 반도체 패키지

Publications (2)

Publication Number Publication Date
KR970053679A true KR970053679A (ko) 1997-07-31
KR0179803B1 KR0179803B1 (ko) 1999-03-20

Family

ID=19447662

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950067335A Expired - Fee Related KR0179803B1 (ko) 1995-12-29 1995-12-29 리드노출형 반도체 패키지

Country Status (5)

Country Link
US (1) US5770888A (ko)
JP (1) JP2992814B2 (ko)
KR (1) KR0179803B1 (ko)
CN (1) CN1065662C (ko)
TW (1) TW344887B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100370851B1 (ko) * 1999-12-30 2003-02-05 앰코 테크놀로지 코리아 주식회사 반도체패키지

Families Citing this family (153)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260538A (ja) * 1996-03-27 1997-10-03 Miyazaki Oki Electric Co Ltd 樹脂封止型半導体装置及び製造方法とその実装構造
US5731244A (en) 1996-05-28 1998-03-24 Micron Technology, Inc. Laser wire bonding for wire embedded dielectrics to integrated circuits
KR100237051B1 (ko) * 1996-12-28 2000-01-15 김영환 버텀리드 반도체 패키지 및 그 제조 방법
KR100214544B1 (ko) * 1996-12-28 1999-08-02 구본준 볼 그리드 어레이 반도체 패키지
KR100242994B1 (ko) * 1996-12-28 2000-02-01 김영환 버텀리드프레임 및 그를 이용한 버텀리드 반도체 패키지
KR100214561B1 (ko) * 1997-03-14 1999-08-02 구본준 버틈 리드 패키지
JP2954110B2 (ja) * 1997-09-26 1999-09-27 九州日本電気株式会社 Ｃｓｐ型半導体装置及びその製造方法
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US7030474B1 (en) 1998-06-24 2006-04-18 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6168975B1 (en) * 1998-06-24 2001-01-02 St Assembly Test Services Pte Ltd Method of forming extended lead package
US7112474B1 (en) 1998-06-24 2006-09-26 Amkor Technology, Inc. Method of making an integrated circuit package
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US7332375B1 (en) 1998-06-24 2008-02-19 Amkor Technology, Inc. Method of making an integrated circuit package
KR100293815B1 (ko) * 1998-06-30 2001-07-12 박종섭 스택형 패키지
DE19844966A1 (de) * 1998-09-30 2000-01-13 Siemens Ag Halbleiterbauteil sowie dieses umfassender Chipkartenmodul
US6448633B1 (en) 1998-11-20 2002-09-10 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
KR100319616B1 (ko) * 1999-04-17 2002-01-05 김영환 리드프레임 및 이를 이용한 버텀리드 반도체패키지
US6265761B1 (en) * 1999-05-07 2001-07-24 Maxim Integrated Products, Inc. Semiconductor devices with improved lead frame structures
US6420779B1 (en) 1999-09-14 2002-07-16 St Assembly Test Services Ltd. Leadframe based chip scale package and method of producing the same
KR100344927B1 (ko) * 1999-09-27 2002-07-19 삼성전자 주식회사 적층 패키지 및 그의 제조 방법
KR20010037247A (ko) 1999-10-15 2001-05-07 마이클 디. 오브라이언 반도체패키지
KR100379089B1 (ko) 1999-10-15 2003-04-08 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지
KR100403142B1 (ko) 1999-10-15 2003-10-30 앰코 테크놀로지 코리아 주식회사 반도체패키지
US6580159B1 (en) 1999-11-05 2003-06-17 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
JP3602997B2 (ja) * 1999-12-15 2004-12-15 松下電器産業株式会社 半導体装置及び半導体装置の製造方法
KR100421774B1 (ko) * 1999-12-16 2004-03-10 앰코 테크놀로지 코리아 주식회사 반도체패키지 및 그 제조 방법
KR100583494B1 (ko) 2000-03-25 2006-05-24 앰코 테크놀로지 코리아 주식회사 반도체패키지
US7042068B2 (en) 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
KR20020058209A (ko) 2000-12-29 2002-07-12 마이클 디. 오브라이언 반도체패키지
JP4637380B2 (ja) * 2001-02-08 2011-02-23 ルネサスエレクトロニクス株式会社 半導体装置
US6545345B1 (en) 2001-03-20 2003-04-08 Amkor Technology, Inc. Mounting for a package containing a chip
US6967395B1 (en) 2001-03-20 2005-11-22 Amkor Technology, Inc. Mounting for a package containing a chip
KR100369393B1 (ko) 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
KR100393448B1 (ko) 2001-03-27 2003-08-02 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
US6603196B2 (en) * 2001-03-28 2003-08-05 Siliconware Precision Industries Co., Ltd. Leadframe-based semiconductor package for multi-media card
US7045883B1 (en) 2001-04-04 2006-05-16 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7064009B1 (en) 2001-04-04 2006-06-20 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
JP4598316B2 (ja) * 2001-07-06 2010-12-15 パナソニック株式会社 樹脂封止型半導体装置およびその製造方法
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
DE10147375B4 (de) * 2001-09-26 2006-06-08 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip und Verfahren zur Herstellung desselben
DE10147376B4 (de) * 2001-09-26 2009-01-15 Infineon Technologies Ag Elektronisches Bauteil und Systemträger sowie Verfahren zur Herstellung derselben
US6630726B1 (en) 2001-11-07 2003-10-07 Amkor Technology, Inc. Power semiconductor package with strap
US6608366B1 (en) 2002-04-15 2003-08-19 Harry J. Fogelson Lead frame with plated end leads
US6818973B1 (en) 2002-09-09 2004-11-16 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US6919620B1 (en) 2002-09-17 2005-07-19 Amkor Technology, Inc. Compact flash memory card with clamshell leadframe
US7361533B1 (en) 2002-11-08 2008-04-22 Amkor Technology, Inc. Stacked embedded leadframe
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US6905914B1 (en) 2002-11-08 2005-06-14 Amkor Technology, Inc. Wafer level package and fabrication method
US7723210B2 (en) 2002-11-08 2010-05-25 Amkor Technology, Inc. Direct-write wafer level chip scale package
US20040124508A1 (en) * 2002-11-27 2004-07-01 United Test And Assembly Test Center Ltd. High performance chip scale leadframe package and method of manufacturing the package
US8129222B2 (en) * 2002-11-27 2012-03-06 United Test And Assembly Test Center Ltd. High density chip scale leadframe package and method of manufacturing the package
US6798047B1 (en) 2002-12-26 2004-09-28 Amkor Technology, Inc. Pre-molded leadframe
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US6750545B1 (en) 2003-02-28 2004-06-15 Amkor Technology, Inc. Semiconductor package capable of die stacking
US6927483B1 (en) 2003-03-07 2005-08-09 Amkor Technology, Inc. Semiconductor package exhibiting efficient lead placement
US7001799B1 (en) 2003-03-13 2006-02-21 Amkor Technology, Inc. Method of making a leadframe for semiconductor devices
US6794740B1 (en) 2003-03-13 2004-09-21 Amkor Technology, Inc. Leadframe package for semiconductor devices
US20060201709A1 (en) * 2003-04-07 2006-09-14 Mciver Chandler H Low profile small outline leadless semiconductor device package
US6879034B1 (en) 2003-05-01 2005-04-12 Amkor Technology, Inc. Semiconductor package including low temperature co-fired ceramic substrate
US7095103B1 (en) 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US6897550B1 (en) 2003-06-11 2005-05-24 Amkor Technology, Inc. Fully-molded leadframe stand-off feature
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US7138707B1 (en) 2003-10-21 2006-11-21 Amkor Technology, Inc. Semiconductor package including leads and conductive posts for providing increased functionality
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US7568059B2 (en) * 2004-07-08 2009-07-28 Asocs Ltd. Low-power reconfigurable architecture for simultaneous implementation of distinct communication standards
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
US7217991B1 (en) 2004-10-22 2007-05-15 Amkor Technology, Inc. Fan-in leadframe semiconductor package
JP2006190972A (ja) * 2004-12-08 2006-07-20 Mitsubishi Electric Corp 電力用半導体装置
US20090327546A1 (en) * 2005-03-03 2009-12-31 Gaby Guri System for and method of hand-off between different communication standards
KR100630741B1 (ko) * 2005-03-04 2006-10-02 삼성전자주식회사 다중 몰딩에 의한 적층형 반도체 패키지 및 그 제조방법
US7968377B2 (en) * 2005-09-22 2011-06-28 Stats Chippac Ltd. Integrated circuit protruding pad package system
US7507603B1 (en) 2005-12-02 2009-03-24 Amkor Technology, Inc. Etch singulated semiconductor package
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US7385299B2 (en) * 2006-02-25 2008-06-10 Stats Chippac Ltd. Stackable integrated circuit package system with multiple interconnect interface
US7902660B1 (en) 2006-05-24 2011-03-08 Amkor Technology, Inc. Substrate for semiconductor device and manufacturing method thereof
US7968998B1 (en) 2006-06-21 2011-06-28 Amkor Technology, Inc. Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
US7683461B2 (en) * 2006-07-21 2010-03-23 Stats Chippac Ltd. Integrated circuit leadless package system
US7687892B2 (en) * 2006-08-08 2010-03-30 Stats Chippac, Ltd. Quad flat package
US7687893B2 (en) 2006-12-27 2010-03-30 Amkor Technology, Inc. Semiconductor package having leadframe with exposed anchor pads
US7829990B1 (en) 2007-01-18 2010-11-09 Amkor Technology, Inc. Stackable semiconductor package including laminate interposer
US7982297B1 (en) 2007-03-06 2011-07-19 Amkor Technology, Inc. Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same
US7977774B2 (en) 2007-07-10 2011-07-12 Amkor Technology, Inc. Fusion quad flat semiconductor package
US7687899B1 (en) 2007-08-07 2010-03-30 Amkor Technology, Inc. Dual laminate package structure with embedded elements
US7868471B2 (en) * 2007-09-13 2011-01-11 Stats Chippac Ltd. Integrated circuit package-in-package system with leads
US7777351B1 (en) 2007-10-01 2010-08-17 Amkor Technology, Inc. Thin stacked interposer package
US8089159B1 (en) 2007-10-03 2012-01-03 Amkor Technology, Inc. Semiconductor package with increased I/O density and method of making the same
JP2009094118A (ja) * 2007-10-04 2009-04-30 Panasonic Corp リードフレーム、それを備える電子部品及びその製造方法
US7847386B1 (en) 2007-11-05 2010-12-07 Amkor Technology, Inc. Reduced size stacked semiconductor package and method of making the same
US7977782B2 (en) * 2007-11-07 2011-07-12 Stats Chippac Ltd. Integrated circuit package system with dual connectivity
US7956453B1 (en) 2008-01-16 2011-06-07 Amkor Technology, Inc. Semiconductor package with patterning layer and method of making same
US7723852B1 (en) 2008-01-21 2010-05-25 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8063474B2 (en) * 2008-02-06 2011-11-22 Fairchild Semiconductor Corporation Embedded die package on package (POP) with pre-molded leadframe
US8067821B1 (en) 2008-04-10 2011-11-29 Amkor Technology, Inc. Flat semiconductor package with half package molding
US7768135B1 (en) 2008-04-17 2010-08-03 Amkor Technology, Inc. Semiconductor package with fast power-up cycle and method of making same
US7808084B1 (en) 2008-05-06 2010-10-05 Amkor Technology, Inc. Semiconductor package with half-etched locking features
US8125064B1 (en) 2008-07-28 2012-02-28 Amkor Technology, Inc. Increased I/O semiconductor package and method of making same
US8184453B1 (en) 2008-07-31 2012-05-22 Amkor Technology, Inc. Increased capacity semiconductor package
US7847392B1 (en) 2008-09-30 2010-12-07 Amkor Technology, Inc. Semiconductor device including leadframe with increased I/O
US7989933B1 (en) 2008-10-06 2011-08-02 Amkor Technology, Inc. Increased I/O leadframe and semiconductor device including same
US8008758B1 (en) 2008-10-27 2011-08-30 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe
US8089145B1 (en) 2008-11-17 2012-01-03 Amkor Technology, Inc. Semiconductor device including increased capacity leadframe
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US7875963B1 (en) 2008-11-21 2011-01-25 Amkor Technology, Inc. Semiconductor device including leadframe having power bars and increased I/O
US7982298B1 (en) 2008-12-03 2011-07-19 Amkor Technology, Inc. Package in package semiconductor device
US8487420B1 (en) 2008-12-08 2013-07-16 Amkor Technology, Inc. Package in package semiconductor device with film over wire
CN101764127B (zh) * 2008-12-23 2012-01-04 日月光封装测试(上海)有限公司 无外引脚的半导体封装体及其堆迭构造
US8680656B1 (en) 2009-01-05 2014-03-25 Amkor Technology, Inc. Leadframe structure for concentrated photovoltaic receiver package
US20170117214A1 (en) 2009-01-05 2017-04-27 Amkor Technology, Inc. Semiconductor device with through-mold via
US8058715B1 (en) 2009-01-09 2011-11-15 Amkor Technology, Inc. Package in package device for RF transceiver module
US8026589B1 (en) 2009-02-23 2011-09-27 Amkor Technology, Inc. Reduced profile stackable semiconductor package
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8575742B1 (en) 2009-04-06 2013-11-05 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including power bars
US8383457B2 (en) 2010-09-03 2013-02-26 Stats Chippac, Ltd. Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
USRE48111E1 (en) 2009-08-21 2020-07-21 JCET Semiconductor (Shaoxing) Co. Ltd. Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
US8169058B2 (en) * 2009-08-21 2012-05-01 Stats Chippac, Ltd. Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
US9391005B2 (en) * 2009-10-27 2016-07-12 Alpha And Omega Semiconductor Incorporated Method for packaging a power device with bottom source electrode
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US8324511B1 (en) 2010-04-06 2012-12-04 Amkor Technology, Inc. Through via nub reveal method and structure
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8440554B1 (en) 2010-08-02 2013-05-14 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
JP2012069764A (ja) 2010-09-24 2012-04-05 On Semiconductor Trading Ltd 回路装置およびその製造方法
US8487445B1 (en) 2010-10-05 2013-07-16 Amkor Technology, Inc. Semiconductor device having through electrodes protruding from dielectric layer
US8791501B1 (en) 2010-12-03 2014-07-29 Amkor Technology, Inc. Integrated passive device structure and method
US8390130B1 (en) 2011-01-06 2013-03-05 Amkor Technology, Inc. Through via recessed reveal structure and method
US8648450B1 (en) 2011-01-27 2014-02-11 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands
TWI557183B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 矽氧烷組成物、以及包含其之光電裝置
BRPI1103019A2 (pt) * 2011-06-21 2013-07-16 Whirlpool Sa conector para compressores hermÉticos
US8552548B1 (en) 2011-11-29 2013-10-08 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
CN103187381B (zh) * 2011-12-30 2015-09-16 联咏科技股份有限公司 导线架封装结构
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
KR101486790B1 (ko) 2013-05-02 2015-01-28 앰코 테크놀로지 코리아 주식회사 강성보강부를 갖는 마이크로 리드프레임
KR101563911B1 (ko) 2013-10-24 2015-10-28 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
JP6262086B2 (ja) * 2014-07-04 2018-01-17 アルプス電気株式会社 圧力検出装置
CN104600045B (zh) * 2015-01-30 2017-06-06 无锡中感微电子股份有限公司 电路系统、芯片封装及其封装方法
US9917041B1 (en) * 2016-10-28 2018-03-13 Intel Corporation 3D chip assemblies using stacked leadframes
FR3104315B1 (fr) 2019-12-04 2021-12-17 St Microelectronics Tours Sas Procédé de fabrication de puces électroniques
FR3104317A1 (fr) * 2019-12-04 2021-06-11 Stmicroelectronics (Tours) Sas Procédé de fabrication de puces électroniques
FR3123148A1 (fr) 2021-05-18 2022-11-25 Stmicroelectronics (Tours) Sas Fabrication de puces électroniques
FR3126540A1 (fr) 2021-08-31 2023-03-03 Stmicroelectronics (Tours) Sas Procédé de fabrication de puces électroniques

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6089945A (ja) * 1983-10-24 1985-05-20 Matsushita Electric Works Ltd 封止半導体装置
JPH071793B2 (ja) * 1985-07-23 1995-01-11 松下電器産業株式会社 ハイブリツド光ｉｃ装置
US4857989A (en) * 1986-09-04 1989-08-15 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JPS63182845A (ja) * 1987-01-23 1988-07-28 Nec Ic Microcomput Syst Ltd 半導体装置
JPH01232753A (ja) * 1988-03-14 1989-09-18 Matsushita Electron Corp 半導体装置
JP2530056B2 (ja) * 1989-09-14 1996-09-04 株式会社東芝 樹脂封止型半導体装置及びその製造方法
JPH03250657A (ja) * 1990-02-28 1991-11-08 Hitachi Ltd 表裏両面実装可能な樹脂封止型半導体装置
US5157480A (en) * 1991-02-06 1992-10-20 Motorola, Inc. Semiconductor device having dual electrical contact sites
FR2673042A1 (fr) * 1991-02-18 1992-08-21 Em Microelectronic Marin Sa Module electronique resistant aux deformations mecaniques pour carte a microcircuits.
JPH04284661A (ja) * 1991-03-13 1992-10-09 Toshiba Corp 半導体装置
US5214307A (en) * 1991-07-08 1993-05-25 Micron Technology, Inc. Lead frame for semiconductor devices having improved adhesive bond line control
KR930014916A (ko) * 1991-12-24 1993-07-23 김광호 반도체 패키지
JP3124381B2 (ja) * 1992-07-07 2001-01-15 株式会社日立製作所 半導体装置及び実装構造体
KR0128251Y1 (ko) * 1992-08-21 1998-10-15 문정환 리드 노출형 반도체 조립장치
KR960005042B1 (ko) * 1992-11-07 1996-04-18 금성일렉트론주식회사 반도체 펙케지
US5406124A (en) * 1992-12-04 1995-04-11 Mitsui Toatsu Chemicals, Inc. Insulating adhesive tape, and lead frame and semiconductor device employing the tape
KR0152901B1 (ko) * 1993-06-23 1998-10-01 문정환 플라스틱 반도체 패키지 및 그 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100370851B1 (ko) * 1999-12-30 2003-02-05 앰코 테크놀로지 코리아 주식회사 반도체패키지

Also Published As

Publication number Publication date
KR0179803B1 (ko) 1999-03-20
US5770888A (en) 1998-06-23
CN1065662C (zh) 2001-05-09
JPH09326452A (ja) 1997-12-16
JP2992814B2 (ja) 1999-12-20
CN1153997A (zh) 1997-07-09
TW344887B (en) 1998-11-11

Similar Documents

Publication Publication Date Title
KR0179803B1 (ko) 리드노출형 반도체 패키지
US6261865B1 (en) Multi chip semiconductor package and method of construction
KR100226737B1 (ko) 반도체소자 적층형 반도체 패키지
US5637828A (en) High density semiconductor package
KR100277438B1 (ko) 멀티칩패키지
KR970067781A (ko) 반도체 장치와 그의 제조방법 및 집합형 반도체 장치
KR970067783A (ko) LOC(lead on chip)유형의 적층 칩 패키지
KR940012549A (ko) 반도체 펙케지
KR920001690A (ko) 수지봉지형 반도체장치
US6501161B1 (en) Semiconductor package having increased solder joint strength
JP2881733B2 (ja) ボトムリード型半導体パッケージ
US4278991A (en) IC Package with heat sink and minimal cross-sectional area
US6677662B1 (en) Clamp and heat block assembly for wire bonding a semiconductor package assembly
KR100708050B1 (ko) 반도체패키지
KR100216065B1 (ko) 멀티 리드 온 칩 패키지
KR100218335B1 (ko) 칩 사이즈 패키지
KR200156932Y1 (ko) 스택 모듈형 칩 사이즈 패키지
US20070267756A1 (en) Integrated circuit package and multi-layer lead frame utilized
KR940010298A (ko) 반도체 패키지 및 그의 제조방법
KR20000040218A (ko) 멀티 칩 패키지
KR200286322Y1 (ko) 반도체패키지
KR100250148B1 (ko) 비지에이 반도체 패키지
KR100567045B1 (ko) 반도체 패키지
KR970024081A (ko) 리드프레임을 적용한 칩 스케일 패키지(chip scale package)
KR980012325A (ko) 내부리드 말단에 칩접착 단차부가 형성된 칩 온 리드용 리드프레임 및 그를 이용한 반도체 칩 패키지

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

FPAY Annual fee payment

Payment date: 20111024

Year of fee payment: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

FPAY Annual fee payment

Payment date: 20121022

Year of fee payment: 15

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20131129

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20131129

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000