KR970053766A - 반도체 패키지용 폼 캠다이 - Google Patents

반도체 패키지용 폼 캠다이 Download PDF

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Publication number
KR970053766A
KR970053766A KR1019950067199A KR19950067199A KR970053766A KR 970053766 A KR970053766 A KR 970053766A KR 1019950067199 A KR1019950067199 A KR 1019950067199A KR 19950067199 A KR19950067199 A KR 19950067199A KR 970053766 A KR970053766 A KR 970053766A
Authority
KR
South Korea
Prior art keywords
foam
forming
cam
lead
cam die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019950067199A
Other languages
English (en)
Inventor
이환용
Original Assignee
황인길
아남산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황인길, 아남산업 주식회사 filed Critical 황인길
Priority to KR1019950067199A priority Critical patent/KR970053766A/ko
Publication of KR970053766A publication Critical patent/KR970053766A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)

Abstract

반도체 패키지용 폼 캠다이에 관한 것으로서, 패키지 성형 완료된 반도체 패키지의 자재를 폼 장치에서리드(L)을 3차 제이(J) 포밍시킬 수 있는 캠다이(D)에 있어서, 상기 캠다이(D)의 베이스(B) 상부에 반도체 패키지의 리드(L)방향에 따라 윤활성을 갖는 포밍부(F)를 형성하므로서, 윤활성을 갖는 캠다이의 포밍부 롤러에 의해 리드의 3차 포밍을 균일하게 할 수 있고, 틴버와 메커니컬버와 틴빌드업 발생을 방지하여 반도체 패키지 제품의 제이(J)폼 성형불량을 방지하며, 캠펀치의 파손 및 손상을 방지하여 캠다이의 정비시간을 단축시키고, 리드의 4차폼 성형 생산성을 향상시킬 수 있는 효과가 있다.
선택도 : 제5도

Description

반도체 패키지용 폼 캠다이
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명이 적용된 상태이 구조도.

Claims (2)

  1. 패키지 성형 완료된 반도체 패키지의 자재를 폼 장치에서 리드(L)을 3차 제이(J)포밍시킬 수 있는 캠다이(D)에 있어서, 상기 캠다이(D)의 베이스(B) 상부에 반도체 패키지의 리드(L)방향에 따라 윤활성을 갖는 포밍부(F)를 형성한 것을 특징으로 하는 반도체 패키지용 폼 캠다이.
  2. 제1항에 있어서, 상기 포밍부(F)는 롤러(R)를 설치한 것을 특징으로 하는 반도체 패키지용 폼 캠다이.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950067199A 1995-12-29 1995-12-29 반도체 패키지용 폼 캠다이 Ceased KR970053766A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950067199A KR970053766A (ko) 1995-12-29 1995-12-29 반도체 패키지용 폼 캠다이

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950067199A KR970053766A (ko) 1995-12-29 1995-12-29 반도체 패키지용 폼 캠다이

Publications (1)

Publication Number Publication Date
KR970053766A true KR970053766A (ko) 1997-07-31

Family

ID=66637796

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950067199A Ceased KR970053766A (ko) 1995-12-29 1995-12-29 반도체 패키지용 폼 캠다이

Country Status (1)

Country Link
KR (1) KR970053766A (ko)

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