KR970063473A - Thermostats and semiconductor processing equipment for semiconductor equipment - Google Patents

Thermostats and semiconductor processing equipment for semiconductor equipment Download PDF

Info

Publication number
KR970063473A
KR970063473A KR1019960003586A KR19960003586A KR970063473A KR 970063473 A KR970063473 A KR 970063473A KR 1019960003586 A KR1019960003586 A KR 1019960003586A KR 19960003586 A KR19960003586 A KR 19960003586A KR 970063473 A KR970063473 A KR 970063473A
Authority
KR
South Korea
Prior art keywords
fluid
cooling water
heat exchanger
semiconductor
thermostats
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019960003586A
Other languages
Korean (ko)
Other versions
KR0176125B1 (en
Inventor
박인협
차훈
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960003586A priority Critical patent/KR0176125B1/en
Publication of KR970063473A publication Critical patent/KR970063473A/en
Application granted granted Critical
Publication of KR0176125B1 publication Critical patent/KR0176125B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Weting (AREA)

Abstract

냉각수를 이용한 신규한 반도체설비용 온도조절장치가 개시되어 있다.A novel temperature control device for semiconductor equipment using cooling water is disclosed.

본 발명은, 온도를 조절하고자 하는 가공설비에 연결되며, 외부에서 냉각수를 공급받아 상기 가공설비의 공정챔버 내에 순환되는 유체로부터 상기 냉각수로 공정에너지를 간접 열전달방식에 의해 이동시키는 열교환기로 이루어진다.The present invention comprises a heat exchanger connected to a processing facility for controlling the temperature and for transferring the process energy from the fluid circulated in the processing chamber of the processing facility to the cooling water by an indirect heat transfer method.

따라서, 프레온 가스를 사용하지 않아 환경파괴에 대응할 수 있으며, 단순한 구조로써 생산성 향상을 도모할 수 있다는 효과가 있다.Therefore, it is possible to cope with environmental destruction without using the freon gas, and it is possible to improve the productivity by a simple structure.

Description

반도체설비용 온도조절장치 및 반도체 가공설비Thermostats and semiconductor processing equipment for semiconductor equipment

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제2도는 본 발명에 따른, 반도체 건식식각설비의 공정챔버 온도를 조절하기 위한 온도조절장치의 개략적인 구조도이다.FIG. 2 is a schematic structural view of a temperature control device for controlling a process chamber temperature of a semiconductor dry etching facility according to the present invention. FIG.

Claims (6)

온도를 조절하고자 하는 가공설비에 연결되며, 외부에서 냉각수를 공급받아 상기 가공설비의 공정챔버 내에 순환되는 유체로부터 상기 냉각수로 공정에너지를 간접 열전달방식에 의해 이동시키는 열교환기를 구비하여 이루어진 것을 특징으로 하는 반도체설비용 온도조절장치.And a heat exchanger connected to the processing facility for controlling the temperature and adapted to receive the cooling water from the outside and to transfer the process energy from the fluid circulated in the processing chamber of the processing facility to the cooling water by the indirect heat transfer method Thermostats for semiconductor equipment. 제1항에 있어서, 상기 열교환기는 상기 냉각수가 들어가고 빠져나오는 양끝의 판 사이에 상기 유체가 유동할 수 있는 압력판이 온도에 따라 몇 장으로 구성되어 있는 구조로 되어 있는 것을 특징으로 하는 상기 반도체설비용 온도 조절장치.2. The semiconductor device according to claim 1, wherein the heat exchanger has a structure in which a plurality of pressure plates, through which the fluid flows, between the plates at both ends of the cooling water, Thermostats. 제1항에 있어서, 상기 가공설비는 건식식각설비인 것을 특징으로 하는 상기 반도체설비용 온도조절장치.The temperature control device for semiconductor equipment according to claim 1, wherein the processing facility is a dry etching facility. 유체를 저장하는 물탱크; 상기 물탱크로부터 유체를 펌핑하여 공정챔버 내를 순환시키는 펌프; 및 외부에서 냉각부를 공급받아 상기 공정챔버 내에서 순환되는 유체로부터 상기 냉각수로 공정에너지를 간접 열전달방식에 의해 이동시키는 열교환기 : 를 구비하는 것을 특징으로 하는 반도체 가공설비.A water tank for storing the fluid; A pump for pumping fluid from the water tank to circulate within the process chamber; And a heat exchanger for receiving the cooling portion from the outside and moving the process energy from the fluid circulated in the process chamber to the cooling water by an indirect heat transfer method. 제4항에 있어서, 상기 열교환기는 상기 냉각수가 들어가고 빠져나오는 양끝의 판 사이에 상기 유체가유동할 수 있는 압력판이 온도에 따라 몇 장으로 구성되어 있는 구조로 되어 있는 것을 특징으로 하는 상기 반도체 가공설비.5. The semiconductor processing apparatus according to claim 4, wherein the heat exchanger has a structure in which a plurality of pressure plates, through which the fluid flows, between the plates at both ends of the cooling water, . 제4항에 있어서, 상기 유체의 온도를 조절하기 위하여 상기 물탱크에 연결된 가열기, 상기 펌핑된 유체가 상기 공정챔버로 공급되도록 그 유동을 조절하는 조정밸브, 및 상기 유체가 물탱크로부터 열교환기로 역류되는 것을 방지하도록 상기 열교환기와 물탱크 사이에 설치된 역류방지밸브를 더 구비하는 것을 특징으로 하는 상기 반도체 가공설비.5. The apparatus of claim 4, further comprising: a heater connected to the water tank for regulating the temperature of the fluid; a regulating valve for regulating the flow of the pumped fluid to be supplied to the process chamber; Further comprising a backflow prevention valve provided between the heat exchanger and the water tank to prevent the backflow prevention valve. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960003586A 1996-02-14 1996-02-14 Temperature controller and semiconductor processing equipment for semiconductor equipment Expired - Fee Related KR0176125B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960003586A KR0176125B1 (en) 1996-02-14 1996-02-14 Temperature controller and semiconductor processing equipment for semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960003586A KR0176125B1 (en) 1996-02-14 1996-02-14 Temperature controller and semiconductor processing equipment for semiconductor equipment

Publications (2)

Publication Number Publication Date
KR970063473A true KR970063473A (en) 1997-09-12
KR0176125B1 KR0176125B1 (en) 1999-04-15

Family

ID=19451245

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960003586A Expired - Fee Related KR0176125B1 (en) 1996-02-14 1996-02-14 Temperature controller and semiconductor processing equipment for semiconductor equipment

Country Status (1)

Country Link
KR (1) KR0176125B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220035381A (en) * 2019-07-18 2022-03-22 솔베이 스페셜티 폴리머스 이태리 에스.피.에이. Heat Exchange Method Using Fluorinated Compounds with Low GWP
KR20230057367A (en) * 2020-08-28 2023-04-28 솔베이 스페셜티 폴리머스 이태리 에스.피.에이. Heat exchange method using vinyl fluoride ether having low GWP

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100468793B1 (en) * 1997-11-04 2005-03-16 삼성전자주식회사 Substrate cooling apparatus for plasma etching device using inductively coupled plasma chamber
KR102012158B1 (en) 2019-05-13 2019-08-20 정영문 air conditioning apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220035381A (en) * 2019-07-18 2022-03-22 솔베이 스페셜티 폴리머스 이태리 에스.피.에이. Heat Exchange Method Using Fluorinated Compounds with Low GWP
KR20230057367A (en) * 2020-08-28 2023-04-28 솔베이 스페셜티 폴리머스 이태리 에스.피.에이. Heat exchange method using vinyl fluoride ether having low GWP

Also Published As

Publication number Publication date
KR0176125B1 (en) 1999-04-15

Similar Documents

Publication Publication Date Title
KR970030433A (en) Substrate Drying Equipment
WO2010026840A1 (en) Heat exchanging device
US4954048A (en) Process and device for conveying boilable liquids
CN104968369A (en) Disinfection device and method for disinfection with energy recovery
EP0331826A1 (en) Heat recovery from hydraulic oil
PT1412681E (en) GEOTHERMAL SYSTEM
US5791370A (en) Apparatus for supplying and continuously circulating fluid
RU2121627C1 (en) Closed autonomous heating system
GB2116034A (en) Warm-air hand drying apparatus
PT86429A (en) DEVICE FOR CONTROLLING THE OVERHEAT AND FORMATION OF CALCULATIONS IN A FLUID HEATING APPARATUS AND THE APPARATUS DEVICE INCLUDING THE DEVICE
KR100625311B1 (en) Temperature Control of Multiple Chemical Pipes in Semiconductor Manufacturing Equipment
JPH0788934B2 (en) Vacuum steam generator
CN109661542B (en) Boiler Feed Tank Energy Recovery System
JP2002115907A (en) Water heater
ITMI982628A1 (en) THERMOSTATICALLY MOBILE WASHING VALVE
JP3019734B2 (en) Corrosion protection system for plumbing equipment in water supply and distribution systems.
KR970047773A (en) Heating device for hydrogen storage alloy tank of hydrogen car
KR960003917B1 (en) Cooling-water circulation apparatus for waste-water treatment
RU1770603C (en) Energy converter
RU2003128592A (en) HEATING DEVICE
JPH055402Y2 (en)
KR200204223Y1 (en) A boiler with the form of heat pipe
KR900001722Y1 (en) Heating device using heat pump
KR100358958B1 (en) The heating water circulation system of straight line type for heating a thermosyphon
CN113582277A (en) MVR desalination system for ship wastewater

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20061030

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20071113

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20071113

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000