KR970077136A - Wafer edge grinding device with wafer chuck - Google Patents

Wafer edge grinding device with wafer chuck Download PDF

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Publication number
KR970077136A
KR970077136A KR1019960015556A KR19960015556A KR970077136A KR 970077136 A KR970077136 A KR 970077136A KR 1019960015556 A KR1019960015556 A KR 1019960015556A KR 19960015556 A KR19960015556 A KR 19960015556A KR 970077136 A KR970077136 A KR 970077136A
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KR
South Korea
Prior art keywords
wafer
upper portion
chuck
edge grinding
wafer chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019960015556A
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Korean (ko)
Inventor
이경욱
Original Assignee
김광호
삼성전자 주식회사
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Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960015556A priority Critical patent/KR970077136A/en
Publication of KR970077136A publication Critical patent/KR970077136A/en
Withdrawn legal-status Critical Current

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Abstract

본 발명은 웨이퍼 척을 갖춘 웨이퍼 에지 그라인딩 장치에 관한 것으로, 본 발명에 따른 웨이퍼 에지 그라인딩 장치는 웨이퍼를 직접 홀딩하기 위하여 복수의 진공홀이 형성되어 있고, 웨이퍼와 동일하거나 큰 지름과, 웨이퍼와 동일한 형상을 가지는 상부와, 상기 상부보다 작은 지름을 가지고, 상기 상부의 저면에서 상기 상부를 지지하는 하부를 포함하는 웨이퍼 척을 포함한다. 본 발명에 의하면, 그라인드되는 웨이퍼에지에서의 두께를 균일하게 하고, 또한 웨이퍼 에지 두께가 얇아지는 것을 방지하여 웨이퍼 파손을 방지하고, 후속 공정을 용이하게 할 수 있다.The present invention relates to a wafer edge grinding apparatus having a wafer chuck, and a wafer edge grinding apparatus according to the present invention includes a plurality of vacuum holes for directly holding a wafer, and has a diameter equal to or larger than that of the wafer, And a wafer chuck having a smaller diameter than the upper portion and a lower portion supporting the upper portion at the bottom surface of the upper portion. According to the present invention, it is possible to uniformize the thickness of the wafer edge to be ground, prevent wafer edge thickness from being thinned, prevent wafer breakage, and facilitate the subsequent process.

Description

웨이퍼 척을 갖춘 웨이퍼 에지 그라인딩 장치Wafer edge grinding device with wafer chuck

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제4도는 본 발명에 따른 웨이퍼 에지 그라인딩 장치의 요부를 개략적으로 도시한 것이다.FIG. 4 schematically shows a main part of a wafer edge grinding apparatus according to the present invention.

Claims (2)

상면에 웨이퍼가 로딩될 수 있는 웨이퍼 척과, 웨이퍼 에지를 그라인딩할 수 있는 그라인드 휠과, 상기 웨이퍼 척과 그리인드 휠 사이에 설치되고 웨이퍼의 에지 부분이 삽입될 수 있는 창이 형성된 칸막이를 갖춘 웨이퍼 에지 그라인딩 장치에 있어서, 상기 웨이퍼 척은 웨이퍼를 직접 홀딩하기 위하여 복수의 진공홀이 형성되어 있고, 웨이퍼의 동일하거나 큰 지름과, 웨이퍼와 동일한 형상을 가지는 상부와, 상기 상부보다 작은 지름을 가지고, 상기 상부의 저면에서 상기 상부를 지지하는 하부를 포함하는 것을 특징으로 하는 웨이퍼 에지 그라인딩 장치.A wafer edge grinding apparatus having a wafer chuck capable of loading a wafer on an upper surface thereof, a grind wheel capable of grinding the wafer edge, and a partition provided between the wafer chuck and the grind wheel and having a window into which an edge portion of the wafer can be inserted, Wherein the wafer chuck has a plurality of vacuum holes formed therein for directly holding wafers, the wafer chuck having an equal or larger diameter of the wafer, an upper portion having the same shape as the wafer, a smaller diameter than the upper portion, And a lower portion for supporting the upper portion at the bottom surface. 제1항에 있어서, 상기 웨이퍼 척의 상부의 지름은 취급하는 웨이퍼의 지름보다 1∼2㎜ 더 큰 것을 특징으로 하는 웨이퍼 에지 그라인딩 장치.2. The wafer edge grinding apparatus according to claim 1, wherein the diameter of the upper portion of the wafer chuck is 1 to 2 mm larger than the diameter of the wafer to be handled. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960015556A 1996-05-11 1996-05-11 Wafer edge grinding device with wafer chuck Withdrawn KR970077136A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960015556A KR970077136A (en) 1996-05-11 1996-05-11 Wafer edge grinding device with wafer chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960015556A KR970077136A (en) 1996-05-11 1996-05-11 Wafer edge grinding device with wafer chuck

Publications (1)

Publication Number Publication Date
KR970077136A true KR970077136A (en) 1997-12-12

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Family Applications (1)

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KR1019960015556A Withdrawn KR970077136A (en) 1996-05-11 1996-05-11 Wafer edge grinding device with wafer chuck

Country Status (1)

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KR (1) KR970077136A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101247065B1 (en) * 2006-01-30 2013-03-25 엠이엠씨 일렉트로닉 머티리얼즈, 인크. Double side wafer grinder and methods for assessing workpiece nanotopology

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101247065B1 (en) * 2006-01-30 2013-03-25 엠이엠씨 일렉트로닉 머티리얼즈, 인크. Double side wafer grinder and methods for assessing workpiece nanotopology

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