KR970077182A - Ion generator of semiconductor ion implantation equipment - Google Patents
Ion generator of semiconductor ion implantation equipment Download PDFInfo
- Publication number
- KR970077182A KR970077182A KR1019960015150A KR19960015150A KR970077182A KR 970077182 A KR970077182 A KR 970077182A KR 1019960015150 A KR1019960015150 A KR 1019960015150A KR 19960015150 A KR19960015150 A KR 19960015150A KR 970077182 A KR970077182 A KR 970077182A
- Authority
- KR
- South Korea
- Prior art keywords
- base plate
- filament
- ion
- generating device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/083—Beam forming
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electron Sources, Ion Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
반도체 제조 설비에 있어서, 버나스 소스(Bernas Source)를 장착하여 사용하고 있는 고전류 이온주입설비의 이온발생장치에 관한 것이다.BACKGROUND OF THE INVENTION Field of the Invention [0001] The present invention relates to an ion generating device of a high current ion implanter equipped with a Bernas Source in a semiconductor manufacturing facility.
본 발명의 구성은 프론트 플레이트(13), 사이드 플레이트(14) 및 베이스 플레이트(15)로 이루어져 이온 반응실(12)을 형성하는 아아크 챔버(11)와, 상기 아아(11)크 챔버내에 설치되어 열전자를 방출하는 것으로 하부가 베이스 플레이트(15)의 관통구멍(15a)을 관통하여 설치된 필라멘트(16)와, 상기 베이스 플레이트의 하부에 설치되어 필라멘트의 하부에 접속된 필라멘트 커넥트 로드(17)로 구성된 반도체 이온주입설비의 이온발생장치에 있어서, 상기 베이스 플레이트(15)의 관통구멍(15a)에 필라멘트(16)와 베이스 플레이트(15) 사이의 절연을 위한 절연체(18)가 삽입 설치되어 이루어진다.The structure of the present invention includes an arc chamber 11 formed of a front plate 13, a side plate 14 and a base plate 15 to form an ion reaction chamber 12, A filament 16 provided below the base plate 15 to penetrate through the through hole 15a of the base plate 15 and a filament connecting rod 17 connected to the lower portion of the filament, An ion generating device of a semiconductor ion implantation facility is provided with an insulator 18 for insulation between a filament 16 and a base plate 15 in a through hole 15a of the base plate 15.
따라서 베이스 플레이트와 필라멘트와의 절연이 확실하게 이루어져 원하는 이온빔을 효율적으로 얻을 수 있고, 플라즈마의 안정화로 설비의 고장 및 수리로 인한 설비의 가동중단율이 감소되어 생산성이 향상되는 효과가 있다.Therefore, the insulation between the base plate and the filament can be reliably obtained, and a desired ion beam can be efficiently obtained. In addition, the stabilization of the plasma can reduce the operation interruption rate of equipment due to the failure and repair of the equipment.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
제2도는 본 발명에 따른 이온발생장치를 나타낸 단면구조도이다.FIG. 2 is a cross-sectional structural view showing an ion generating device according to the present invention. FIG.
Claims (4)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960015150A KR970077182A (en) | 1996-05-08 | 1996-05-08 | Ion generator of semiconductor ion implantation equipment |
| JP8239089A JPH09306372A (en) | 1996-05-08 | 1996-09-10 | Ion generator for semiconductor ion implantation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960015150A KR970077182A (en) | 1996-05-08 | 1996-05-08 | Ion generator of semiconductor ion implantation equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970077182A true KR970077182A (en) | 1997-12-12 |
Family
ID=19458134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960015150A Abandoned KR970077182A (en) | 1996-05-08 | 1996-05-08 | Ion generator of semiconductor ion implantation equipment |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH09306372A (en) |
| KR (1) | KR970077182A (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2131051B (en) * | 1982-05-07 | 1985-10-23 | Inst Mash Im A A Blagonravova | Method for chemical heat treatment of parts made of steels and alloys |
| JPH08111198A (en) * | 1994-10-11 | 1996-04-30 | Ulvac Japan Ltd | Ion source |
-
1996
- 1996-05-08 KR KR1019960015150A patent/KR970077182A/en not_active Abandoned
- 1996-09-10 JP JP8239089A patent/JPH09306372A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09306372A (en) | 1997-11-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PC1901 | Submission of document of abandonment after decision of registration |
St.27 status event code: N-1-6-B10-B11-nap-PC1901 |
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| SUBM | Surrender of laid-open application requested | ||
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |