KR970077272A - Ultrasonic brush cleaning device - Google Patents
Ultrasonic brush cleaning device Download PDFInfo
- Publication number
- KR970077272A KR970077272A KR1019960016565A KR19960016565A KR970077272A KR 970077272 A KR970077272 A KR 970077272A KR 1019960016565 A KR1019960016565 A KR 1019960016565A KR 19960016565 A KR19960016565 A KR 19960016565A KR 970077272 A KR970077272 A KR 970077272A
- Authority
- KR
- South Korea
- Prior art keywords
- brush
- cleaning
- ultrasonic
- cleaning liquid
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
세척액 초음파를 가해 주면 초음파의 진동에 의해서 세척액의 운동이 활발해지므로 브러쉬에 붙어 있는 이물질을 효과적으로 제거하여 웨이퍼 수율을 향상시킬 수 있고, 또한, 브러쉬에 붙어 있는 이물질을 효과적으로 제거됨으로써 브러쉬의 수명이 연장되어 노동력이 절감됨가 아울러 생산성을 향상시킬 수 있다.When the ultrasonic wave is applied to the cleaning liquid, the movement of the cleaning liquid becomes active due to the vibration of the ultrasonic wave. Therefore, the foreign substances attached to the brush can be effectively removed to improve the yield of the wafers. Further, Labor force can be saved and productivity can be improved.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
제2도 (A)는 본 발명에 의한 초음파를 이용한 브러쉬 세척 장치의 구조를 나타낸 단면도이고, (B)는 초음파 장치에 있어서 발진판의 구조를 나타낸 부분 확대도.Fig. 2 (A) is a cross-sectional view showing the structure of a brush cleaning device using ultrasonic waves according to the present invention, and Fig. 2 (B) is a partially enlarged view showing the structure of an oscillation plate in an ultrasonic device.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960016565A KR970077272A (en) | 1996-05-17 | 1996-05-17 | Ultrasonic brush cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960016565A KR970077272A (en) | 1996-05-17 | 1996-05-17 | Ultrasonic brush cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970077272A true KR970077272A (en) | 1997-12-12 |
Family
ID=66219587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960016565A Withdrawn KR970077272A (en) | 1996-05-17 | 1996-05-17 | Ultrasonic brush cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970077272A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030051210A (en) * | 2002-10-31 | 2003-06-25 | (주)홍익 하이엠 | Apparatus for washing a brush for cleaning surface of a cathode ray tube |
| KR20050070767A (en) * | 2003-12-30 | 2005-07-07 | 동부아남반도체 주식회사 | An apparatus for eliminating particle of cleaning member of semiconductor wafer |
| KR100719369B1 (en) * | 2005-07-06 | 2007-05-17 | 삼성전자주식회사 | Brush wetting device |
-
1996
- 1996-05-17 KR KR1019960016565A patent/KR970077272A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030051210A (en) * | 2002-10-31 | 2003-06-25 | (주)홍익 하이엠 | Apparatus for washing a brush for cleaning surface of a cathode ray tube |
| KR20050070767A (en) * | 2003-12-30 | 2005-07-07 | 동부아남반도체 주식회사 | An apparatus for eliminating particle of cleaning member of semiconductor wafer |
| KR100719369B1 (en) * | 2005-07-06 | 2007-05-17 | 삼성전자주식회사 | Brush wetting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PC1203 | Withdrawal of no request for examination |
St.27 status event code: N-1-6-B10-B12-nap-PC1203 |
|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid | ||
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |