KR970077272A - 초음파를 이용한 브러쉬 세척 장치 - Google Patents
초음파를 이용한 브러쉬 세척 장치 Download PDFInfo
- Publication number
- KR970077272A KR970077272A KR1019960016565A KR19960016565A KR970077272A KR 970077272 A KR970077272 A KR 970077272A KR 1019960016565 A KR1019960016565 A KR 1019960016565A KR 19960016565 A KR19960016565 A KR 19960016565A KR 970077272 A KR970077272 A KR 970077272A
- Authority
- KR
- South Korea
- Prior art keywords
- brush
- cleaning
- ultrasonic
- cleaning liquid
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (7)
- 오염된 브러쉬를 세척하기 위한 세척조와, 상기 세척조에 투입되는 브러쉬부와, 상기 세척조의 일측에 형성되어 상기 브러쉬부를 세척하기 위해 세척액을 공급하여 분사하는 세척액 공급수단으로 구성된 브러쉬 세척 장치에 있어서, 상기 세척액 공급수단은 상기 세척액을 공급하는 공급관과, 상기 공급관에 연통되어 상기 공급관에 공급되는 세척액의 운동량을 증가시키는 초음파 장치로 구성된 것을 특징으로 하는 초음파를 이용한 브러쉬 세척 장치.
- 제1항에 있어서, 상기 세척액 고급수단은 상기 부러쉬부의 상기 세척조로의 투입여부에 따라 상기 초음파 장치를 제어하는 제어수단을 더 포함하는 것을 특징으로 하는 초음파를 이용한 브러쉬 세척 장치.
- 제1항에 있어서, 상기 제어수단은 상기 브러쉬부가 상기 세척조로의 투입여부를 감지하는 감지부와, 상기 감지부로부터 신호를 입력받아 상기 초음파 장치로 공급되는 전원을 제어하는 제어부로 구성된 것을 특징으로 하는 초음파를 이용한 브러쉬 세척 장치.
- 제3항에 있어서, 상기 감지부는 근접센서인 것을 특징으로 하는 초음파를 이용한 브러쉬 세척 장치.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 초음파 장치는 중앙에 상기 공급관인 관통 연장된 분사헤드와, 상기 분사헤드 내부에 관통 형성된 초음파 전달관과, 상기 초음파 전달관의 일측 단부에 형성된 발진판과, 상기 초음파 전달관의 하측 단부에 연통된 집합관으로 구성되며 상기 집합관은 상기 공급관과 연통되는 것을 특징으로 하는 초음파를 이용한 브러쉬 세척 장치.
- 제5항에 있어서, 상기 분사헤드는 상기 테이퍼 형상인 것을 특징으로 하는 초음파를 이용한 브러쉬 세척 장치.
- 제6항에 있어서, 상기 집합관은 역 테이퍼 형상인 것을 초음파를 이용한 브러쉬 세적 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960016565A KR970077272A (ko) | 1996-05-17 | 1996-05-17 | 초음파를 이용한 브러쉬 세척 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960016565A KR970077272A (ko) | 1996-05-17 | 1996-05-17 | 초음파를 이용한 브러쉬 세척 장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970077272A true KR970077272A (ko) | 1997-12-12 |
Family
ID=66219587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960016565A Withdrawn KR970077272A (ko) | 1996-05-17 | 1996-05-17 | 초음파를 이용한 브러쉬 세척 장치 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970077272A (ko) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030051210A (ko) * | 2002-10-31 | 2003-06-25 | (주)홍익 하이엠 | 브라운관 표면세척용 브러쉬의 세정장치 |
| KR20050070767A (ko) * | 2003-12-30 | 2005-07-07 | 동부아남반도체 주식회사 | 반도체 기판용 클리닝부재의 파티클 제거장치 |
| KR100719369B1 (ko) * | 2005-07-06 | 2007-05-17 | 삼성전자주식회사 | 브러쉬 웨팅 장치 |
-
1996
- 1996-05-17 KR KR1019960016565A patent/KR970077272A/ko not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030051210A (ko) * | 2002-10-31 | 2003-06-25 | (주)홍익 하이엠 | 브라운관 표면세척용 브러쉬의 세정장치 |
| KR20050070767A (ko) * | 2003-12-30 | 2005-07-07 | 동부아남반도체 주식회사 | 반도체 기판용 클리닝부재의 파티클 제거장치 |
| KR100719369B1 (ko) * | 2005-07-06 | 2007-05-17 | 삼성전자주식회사 | 브러쉬 웨팅 장치 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| PC1203 | Withdrawal of no request for examination |
St.27 status event code: N-1-6-B10-B12-nap-PC1203 |
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| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid | ||
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |