KR970077405A - Pattern alignment inspection system of semiconductor equipment - Google Patents

Pattern alignment inspection system of semiconductor equipment Download PDF

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Publication number
KR970077405A
KR970077405A KR1019960014666A KR19960014666A KR970077405A KR 970077405 A KR970077405 A KR 970077405A KR 1019960014666 A KR1019960014666 A KR 1019960014666A KR 19960014666 A KR19960014666 A KR 19960014666A KR 970077405 A KR970077405 A KR 970077405A
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KR
South Korea
Prior art keywords
image
unit
sensing
subdivided
pattern
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Application number
KR1019960014666A
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Korean (ko)
Inventor
김경일
Original Assignee
김주용
현대전자산업 주식회사
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Priority to KR1019960014666A priority Critical patent/KR970077405A/en
Publication of KR970077405A publication Critical patent/KR970077405A/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/9563—Inspecting patterns on the surface of objects and suppressing pattern images

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

본 발명은 반도체 소자의 제조공정에서 웨이퍼의 패턴 정렬을 검사하는 반도체 소자의 패턴정렬 검사장치를 개시한다. 이 장치는 웨이퍼에 형성될 패턴을 소정 크기로 세분화한 영상을 저장하는 영상 저장부와, 상기 웨이퍼에 형성된 각 패턴을 소정 크기로 세분화한 영상의 명암을 감지하는 영상 감지부와, 상기 영상 감지부에서 감지된 세분화된 영상을 상기 영상 저장부에 저장된 세분화된 영상과 비교하는 영상 비교부와, 상기 비교부의 비교결과에 따라 정렬 상태를 판정하는 정렬 판정부를 포함한다.The present invention discloses a pattern alignment inspection apparatus for a semiconductor device that inspects pattern alignment of wafers in a manufacturing process of semiconductor devices. The apparatus includes an image storage unit for storing an image obtained by subdividing a pattern to be formed on a wafer into a predetermined size, an image sensing unit for sensing brightness and darkness of an image obtained by subdividing each pattern formed on the wafer into a predetermined size, An image comparing unit for comparing the subdivided image detected by the comparing unit with the subdivided image stored in the image storing unit, and an alignment determining unit for determining the alignment state according to the comparison result of the comparing unit.

Description

반도체 장비의 패턴 정렬 검사장치.Pattern alignment inspection system of semiconductor equipment.

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제1도는 본 발명의 실시예에 따른 패턴 정렬 검사장치의 블록 구성도.FIG. 1 is a block diagram of a pattern alignment inspection apparatus according to an embodiment of the present invention. FIG.

제2도는 제1도의 실시예에 따른 장치에서 영상감지센서의 설치를 위한 화소 분할 평면도.FIG. 2 is a sectional view of a pixel for installation of an image sensing sensor in an apparatus according to an embodiment of FIG. 1; FIG.

제3도는 제1도의 실시예에 따른 장치에서 결함감지센서의 설치를 위한 화소 분할 평면도.FIG. 3 is a sectional view of a pixel for installation of a defect detection sensor in an apparatus according to an embodiment of FIG. 1; FIG.

Claims (5)

웨이퍼에 형성될 패턴을 소정 크기로 세분화한 영상을 저장하는 영상 저장부와, 상기 웨이퍼에 형성된 각 패턴을 소정 크기로 세분화한 영상의 명암을 감지하는 영상 감지부와, 상기 영상 감지부에서 감지된 세분화된 영상을 상기 영상 저장부에 저장된 세분화된 영상과 비교하는 영상 비교부와, 상기 비교부의 비교결과에 따라 정렬 상태를 판정하는 정렬 판정부를 포함하는 것을 특징으로 하는 반도체소자의 패턴 정렬 검사장치.An image storage unit for storing an image obtained by subdividing a pattern to be formed on a wafer into a predetermined size; an image sensing unit for sensing brightness and darkness of an image obtained by subdividing each pattern formed on the wafer into a predetermined size; An image comparison unit for comparing the subdivided image with the subdivided image stored in the image storage unit; and an alignment determination unit for determining an alignment state according to the comparison result of the comparison unit. 제1항에 있어서, 상기 영상 감지부는 감지영역을 소정 면적으로 세분화하고, 그 세분화된 각각에 대하여 패턴의 명암을 감지하는 명암감지센서를 구비한 것을 특징으로 하는 반도체 소자의 패턴 정렬 검사장치.The device according to claim 1, wherein the image sensing unit includes a lightness and darkness sensor for subdividing a sensing area into a predetermined area and sensing a lightness and darkness of each of the subdivided sensing areas. 제2항에 있어서, 상기 영상 감지부의 감지영역은 1,000×1,000개로 세분화하는 것을 특징으로 하는 반도체 소자의 패턴 정렬 검사장치.The apparatus of claim 2, wherein the sensing area of the image sensing unit is subdivided into 1,000 × 1,000. 제2항에 있어서, 상기 영상 감지부의 감지영역은 500×500개로 세분화하는 것을 특징으로 하는 반도체 소자의 패턴 정렬 검사장치.3. The device according to claim 2, wherein the sensing area of the image sensing unit is subdivided into 500x500. 제1항에 있어서, 상기 영상 감지부의 감지 명암은 밝기에 따라서 1부터 1,000까지로 분류하는 것을 특징으로 하는 반도체 소자의 패턴 정렬 검사장치.The device according to claim 1, wherein the image sensing unit is classified into 1 to 1,000 depending on brightness. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960014666A 1996-05-06 1996-05-06 Pattern alignment inspection system of semiconductor equipment Withdrawn KR970077405A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960014666A KR970077405A (en) 1996-05-06 1996-05-06 Pattern alignment inspection system of semiconductor equipment

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Application Number Priority Date Filing Date Title
KR1019960014666A KR970077405A (en) 1996-05-06 1996-05-06 Pattern alignment inspection system of semiconductor equipment

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100607410B1 (en) * 2004-07-15 2006-08-02 삼성전자주식회사 Substrate alignment method and apparatus, defect inspection method and apparatus of substrate using same
US7155366B2 (en) 2003-12-01 2006-12-26 Samsung Electronics Co., Ltd. Apparatus and method for inspecting patterns on wafers
KR100782498B1 (en) * 2006-11-24 2007-12-05 삼성전자주식회사 Mask pattern matching method and mask pattern matching device using same
KR20250071397A (en) * 2023-11-15 2025-05-22 주식회사 지에스에프솔루션 Detecting method and system for wafer wobbling

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7155366B2 (en) 2003-12-01 2006-12-26 Samsung Electronics Co., Ltd. Apparatus and method for inspecting patterns on wafers
KR100607410B1 (en) * 2004-07-15 2006-08-02 삼성전자주식회사 Substrate alignment method and apparatus, defect inspection method and apparatus of substrate using same
KR100782498B1 (en) * 2006-11-24 2007-12-05 삼성전자주식회사 Mask pattern matching method and mask pattern matching device using same
KR20250071397A (en) * 2023-11-15 2025-05-22 주식회사 지에스에프솔루션 Detecting method and system for wafer wobbling

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