KR970077405A - 반도체 장비의 패턴 정렬 검사장치 - Google Patents
반도체 장비의 패턴 정렬 검사장치 Download PDFInfo
- Publication number
- KR970077405A KR970077405A KR1019960014666A KR19960014666A KR970077405A KR 970077405 A KR970077405 A KR 970077405A KR 1019960014666 A KR1019960014666 A KR 1019960014666A KR 19960014666 A KR19960014666 A KR 19960014666A KR 970077405 A KR970077405 A KR 970077405A
- Authority
- KR
- South Korea
- Prior art keywords
- image
- unit
- sensing
- subdivided
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/27—Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/9563—Inspecting patterns on the surface of objects and suppressing pattern images
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (5)
- 웨이퍼에 형성될 패턴을 소정 크기로 세분화한 영상을 저장하는 영상 저장부와, 상기 웨이퍼에 형성된 각 패턴을 소정 크기로 세분화한 영상의 명암을 감지하는 영상 감지부와, 상기 영상 감지부에서 감지된 세분화된 영상을 상기 영상 저장부에 저장된 세분화된 영상과 비교하는 영상 비교부와, 상기 비교부의 비교결과에 따라 정렬 상태를 판정하는 정렬 판정부를 포함하는 것을 특징으로 하는 반도체소자의 패턴 정렬 검사장치.
- 제1항에 있어서, 상기 영상 감지부는 감지영역을 소정 면적으로 세분화하고, 그 세분화된 각각에 대하여 패턴의 명암을 감지하는 명암감지센서를 구비한 것을 특징으로 하는 반도체 소자의 패턴 정렬 검사장치.
- 제2항에 있어서, 상기 영상 감지부의 감지영역은 1,000×1,000개로 세분화하는 것을 특징으로 하는 반도체 소자의 패턴 정렬 검사장치.
- 제2항에 있어서, 상기 영상 감지부의 감지영역은 500×500개로 세분화하는 것을 특징으로 하는 반도체 소자의 패턴 정렬 검사장치.
- 제1항에 있어서, 상기 영상 감지부의 감지 명암은 밝기에 따라서 1부터 1,000까지로 분류하는 것을 특징으로 하는 반도체 소자의 패턴 정렬 검사장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960014666A KR970077405A (ko) | 1996-05-06 | 1996-05-06 | 반도체 장비의 패턴 정렬 검사장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960014666A KR970077405A (ko) | 1996-05-06 | 1996-05-06 | 반도체 장비의 패턴 정렬 검사장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970077405A true KR970077405A (ko) | 1997-12-12 |
Family
ID=66216930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960014666A Withdrawn KR970077405A (ko) | 1996-05-06 | 1996-05-06 | 반도체 장비의 패턴 정렬 검사장치 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970077405A (ko) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100607410B1 (ko) * | 2004-07-15 | 2006-08-02 | 삼성전자주식회사 | 기판 정렬 방법 및 장치, 이를 이용한 기판의 결함 검사방법 및 장치 |
| US7155366B2 (en) | 2003-12-01 | 2006-12-26 | Samsung Electronics Co., Ltd. | Apparatus and method for inspecting patterns on wafers |
| KR100782498B1 (ko) * | 2006-11-24 | 2007-12-05 | 삼성전자주식회사 | 마스크 패턴 매칭방법 및 이를 사용하는 마스크 패턴매칭장치 |
| KR20250071397A (ko) * | 2023-11-15 | 2025-05-22 | 주식회사 지에스에프솔루션 | 웨이퍼 와블링 감지 방법 및 웨이퍼 와블링 감지 시스템 |
-
1996
- 1996-05-06 KR KR1019960014666A patent/KR970077405A/ko not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7155366B2 (en) | 2003-12-01 | 2006-12-26 | Samsung Electronics Co., Ltd. | Apparatus and method for inspecting patterns on wafers |
| KR100607410B1 (ko) * | 2004-07-15 | 2006-08-02 | 삼성전자주식회사 | 기판 정렬 방법 및 장치, 이를 이용한 기판의 결함 검사방법 및 장치 |
| KR100782498B1 (ko) * | 2006-11-24 | 2007-12-05 | 삼성전자주식회사 | 마스크 패턴 매칭방법 및 이를 사용하는 마스크 패턴매칭장치 |
| KR20250071397A (ko) * | 2023-11-15 | 2025-05-22 | 주식회사 지에스에프솔루션 | 웨이퍼 와블링 감지 방법 및 웨이퍼 와블링 감지 시스템 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| PC1203 | Withdrawal of no request for examination |
St.27 status event code: N-1-6-B10-B12-nap-PC1203 |
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| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid | ||
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| PN2301 | Change of applicant |
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| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |