LU80700A1 - PROCESS FOR A CONTINUOUS BONDING ON CIRCUIT BOARDS - Google Patents

PROCESS FOR A CONTINUOUS BONDING ON CIRCUIT BOARDS

Info

Publication number
LU80700A1
LU80700A1 LU80700A LU80700A LU80700A1 LU 80700 A1 LU80700 A1 LU 80700A1 LU 80700 A LU80700 A LU 80700A LU 80700 A LU80700 A LU 80700A LU 80700 A1 LU80700 A1 LU 80700A1
Authority
LU
Luxembourg
Prior art keywords
circuit boards
continuous bonding
bonding
continuous
boards
Prior art date
Application number
LU80700A
Other languages
German (de)
Inventor
W Lohrke
Original Assignee
Deutsche Telephonwerk Kabel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Telephonwerk Kabel filed Critical Deutsche Telephonwerk Kabel
Publication of LU80700A1 publication Critical patent/LU80700A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0004—Resistance soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of infrared [IR]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connection Of Plates (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
LU80700A 1978-03-01 1978-12-22 PROCESS FOR A CONTINUOUS BONDING ON CIRCUIT BOARDS LU80700A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782809288 DE2809288A1 (en) 1978-03-01 1978-03-01 PROCESS FOR A CONTINUOUS BONDING ON CIRCUIT BOARDS

Publications (1)

Publication Number Publication Date
LU80700A1 true LU80700A1 (en) 1979-04-13

Family

ID=6033520

Family Applications (1)

Application Number Title Priority Date Filing Date
LU80700A LU80700A1 (en) 1978-03-01 1978-12-22 PROCESS FOR A CONTINUOUS BONDING ON CIRCUIT BOARDS

Country Status (9)

Country Link
BE (1) BE874479A (en)
DE (1) DE2809288A1 (en)
DK (1) DK53579A (en)
FR (1) FR2418991A1 (en)
GB (1) GB2015405A (en)
IE (1) IE790296L (en)
IT (1) IT1111863B (en)
LU (1) LU80700A1 (en)
NL (1) NL7900112A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2559968A1 (en) * 1984-02-18 1985-08-23 Lucas Ind Plc METHOD FOR MANUFACTURING A CONDUCTOR FOR ARMATURE WINDING

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3008285A1 (en) * 1980-03-04 1981-09-17 Kurt-Åke Vallentuna Wallberg DEVICE FOR CREATING A SEALED CONNECTION BETWEEN TWO METAL LINKS
CN110303213A (en) * 2019-07-05 2019-10-08 深圳市集银科技有限公司 A kind of backlight module FPC welding wire pressing plate technology

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2559968A1 (en) * 1984-02-18 1985-08-23 Lucas Ind Plc METHOD FOR MANUFACTURING A CONDUCTOR FOR ARMATURE WINDING

Also Published As

Publication number Publication date
DK53579A (en) 1979-09-02
GB2015405A (en) 1979-09-12
FR2418991A1 (en) 1979-09-28
IE790296L (en) 1979-09-01
DE2809288A1 (en) 1979-09-06
IT7920456A0 (en) 1979-02-23
IT1111863B (en) 1986-01-13
BE874479A (en) 1979-06-18
NL7900112A (en) 1979-09-04

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