MX2017001680A - Baño de electrodeposicion de aleacion de cobre-niquel. - Google Patents

Baño de electrodeposicion de aleacion de cobre-niquel.

Info

Publication number
MX2017001680A
MX2017001680A MX2017001680A MX2017001680A MX2017001680A MX 2017001680 A MX2017001680 A MX 2017001680A MX 2017001680 A MX2017001680 A MX 2017001680A MX 2017001680 A MX2017001680 A MX 2017001680A MX 2017001680 A MX2017001680 A MX 2017001680A
Authority
MX
Mexico
Prior art keywords
copper
electroplating bath
nickel alloy
alloy electroplating
salt
Prior art date
Application number
MX2017001680A
Other languages
English (en)
Inventor
Yuasa Satoshi
Sakurai Hitoshi
Hashimoto Akira
Ono Kazunori
Original Assignee
Dipsol Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dipsol Chem filed Critical Dipsol Chem
Publication of MX2017001680A publication Critical patent/MX2017001680A/es

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/58Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/562Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

La presente invención proporciona un baño de electrodeposición de cobre-níquel que contiene (a) una sal de cobre y una sal de níquel, (b) un agente formador de complejos de metal, (c) un agente que imparte conductividad, (d) un compuesto orgánico que contiene azufre y (e) un regulador de potencial redox.
MX2017001680A 2014-08-08 2015-07-10 Baño de electrodeposicion de aleacion de cobre-niquel. MX2017001680A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014162802A JP6439172B2 (ja) 2014-08-08 2014-08-08 銅−ニッケル合金電気めっき浴
PCT/JP2015/069944 WO2016021369A1 (ja) 2014-08-08 2015-07-10 銅-ニッケル合金電気めっき浴

Publications (1)

Publication Number Publication Date
MX2017001680A true MX2017001680A (es) 2017-05-09

Family

ID=55263643

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017001680A MX2017001680A (es) 2014-08-08 2015-07-10 Baño de electrodeposicion de aleacion de cobre-niquel.

Country Status (12)

Country Link
US (1) US10316421B2 (es)
EP (1) EP3178968B1 (es)
JP (1) JP6439172B2 (es)
KR (1) KR102001322B1 (es)
CN (1) CN106574387B (es)
BR (1) BR112017002269A2 (es)
MX (1) MX2017001680A (es)
PH (1) PH12017500218B1 (es)
RU (1) RU2666391C1 (es)
SG (1) SG11201700896XA (es)
TW (1) TWI652378B (es)
WO (1) WO2016021369A1 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6988826B2 (ja) * 2016-12-16 2022-01-05 コニカミノルタ株式会社 透明導電膜の形成方法及び電解メッキ用メッキ液
EP3758456B1 (en) * 2018-02-22 2022-11-09 Konica Minolta, Inc. Pattern forming method
RU2694398C1 (ru) * 2018-12-14 2019-07-12 Федеральное государственное бюджетное образовательное учреждение высшего образования "Елецкий государственный университет им. И.А. Бунина" Электролит для получения сплавов железо-никель
CN111321437B (zh) * 2020-03-31 2021-04-27 安徽铜冠铜箔集团股份有限公司 铜镍合金箔及其电沉积制备方法
AU2021297185A1 (en) * 2020-06-22 2023-02-16 Offgrid Energy Labs Inc. Novel eutectic solvent
CN116445998B (zh) * 2022-01-10 2026-04-24 财团法人交大思源基金会 双晶铜-镍合金金属层及其制备方法
TWI804149B (zh) * 2022-01-10 2023-06-01 國立陽明交通大學 雙晶銅-鎳合金金屬層及其製備方法
KR102587490B1 (ko) * 2022-12-05 2023-10-11 동국제강 주식회사 내식성이 우수한 클래드 후강판용 슬래브의 도금 방법 및 이 도금 방법으로 제조된 내식성이 우수한 클래드 후강판용 슬래브
KR102933691B1 (ko) 2023-11-10 2026-03-03 국립순천대학교산학협력단 전기도금 공정으로 제조되는 Fe-Ni계 합금 박막의 상분율 제어 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1837835A (en) * 1926-12-20 1931-12-22 Gen Spring Bumper Corp Process for electrodepositing bright nickel
US3833481A (en) 1972-12-18 1974-09-03 Buckbel Mears Co Electroforming nickel copper alloys
JPS58133392A (ja) * 1982-02-01 1983-08-09 Oosakashi 光沢銅−ニツケル−コバルト合金電気めつき浴
JPS58133391A (ja) * 1982-02-01 1983-08-09 Oosakashi 光沢銅−ニツケル合金電気めつき浴
JPH02285091A (ja) * 1989-04-26 1990-11-22 Kobe Steel Ltd ニッケル―銅合金めっき浴
JPH04198499A (ja) * 1990-07-20 1992-07-17 Asahi Glass Co Ltd 電位調節機構を有する銅溶解槽
JPH0598488A (ja) * 1991-06-05 1993-04-20 Daiwa Kasei Kenkyusho:Kk 銅−ニツケル合金電気メツキ浴
RU2106436C1 (ru) 1996-07-22 1998-03-10 Тюменский государственный нефтегазовый университет Электролит для осаждения сплава медь - никель
RU2365683C1 (ru) * 2008-09-30 2009-08-27 Государственное образовательное учреждение высшего профессионального образования "Пензенский государственный университет" (ПГУ) Сульфосалицилатный электролит для осаждения сплава медь-никель
KR101077890B1 (ko) * 2008-12-26 2011-10-31 주식회사 포스코 아연-니켈 전기 도금액용 첨가제 조성물, 이를 포함하는 아연-니켈 전기 도금액 조성물 및 이를 이용한 아연-니켈전기도금강판의 제조방법
KR101649435B1 (ko) * 2012-04-19 2016-08-19 딥솔 가부시키가이샤 구리-니켈 합금 전기 도금 욕 및 도금 방법
CN104233302B (zh) * 2014-09-15 2016-09-14 南通万德科技有限公司 一种蚀刻液及其应用

Also Published As

Publication number Publication date
JP6439172B2 (ja) 2018-12-19
RU2666391C1 (ru) 2018-09-07
EP3178968A4 (en) 2018-01-17
CN106574387B (zh) 2019-10-18
JP2016037649A (ja) 2016-03-22
EP3178968A1 (en) 2017-06-14
WO2016021369A1 (ja) 2016-02-11
KR102001322B1 (ko) 2019-07-17
PH12017500218A1 (en) 2017-07-10
EP3178968B1 (en) 2019-09-04
SG11201700896XA (en) 2017-03-30
TW201610241A (zh) 2016-03-16
CN106574387A (zh) 2017-04-19
BR112017002269A2 (pt) 2018-01-16
KR20170038918A (ko) 2017-04-07
US20170241031A1 (en) 2017-08-24
TWI652378B (zh) 2019-03-01
US10316421B2 (en) 2019-06-11
PH12017500218B1 (en) 2020-02-19

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