MX2020003372A - Fuente de arco. - Google Patents

Fuente de arco.

Info

Publication number
MX2020003372A
MX2020003372A MX2020003372A MX2020003372A MX2020003372A MX 2020003372 A MX2020003372 A MX 2020003372A MX 2020003372 A MX2020003372 A MX 2020003372A MX 2020003372 A MX2020003372 A MX 2020003372A MX 2020003372 A MX2020003372 A MX 2020003372A
Authority
MX
Mexico
Prior art keywords
arc
generating
magnetic field
magnetic
target
Prior art date
Application number
MX2020003372A
Other languages
English (en)
Inventor
Siegfried Krassnitzer
Juerg Hagmann
Original Assignee
Oerlikon Surface Solutions Ag Pfaeffikon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Surface Solutions Ag Pfaeffikon filed Critical Oerlikon Surface Solutions Ag Pfaeffikon
Publication of MX2020003372A publication Critical patent/MX2020003372A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/3255—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32559—Protection means, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/48—Generating plasma using an arc
    • H05H1/50—Generating plasma using an arc and using applied magnetic fields, e.g. for focusing or rotating the arc
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15—Means for deflecting or directing discharge
    • H01J2237/152—Magnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Discharge Heating (AREA)

Abstract

Un evaporador de ARCO que comprende: - un conjunto de cátodos, - un electrodo dispuesto para permitir que se pueda establecer un arco entre un electrodo y una superficie frontal del objetivo, y - un sistema de guía magnética colocado delante de una superficie posterior del objetivo caracterizado por que: el sistema de guía magnética comprende medios colocados en una región central para generar al menos un campo magnético y medios en una región periférica para generar al menos un campo magnético adicional, en el que los campos magnéticos generados de esta manera dan como resultado un campo magnético total para guiar el arco y controlar la trayectoria del punto de cátodo en la superficie frontal del objetivo, en el que los medios colocados en la región central comprenden una bobina electromagnética para generar un campo magnético y los medios colocados en la región periférica comprenden dos bobinas electromagnéticas para generar otros dos campos magnéticos.
MX2020003372A 2017-10-03 2018-10-04 Fuente de arco. MX2020003372A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762567423P 2017-10-03 2017-10-03
PCT/EP2018/000460 WO2019081053A1 (en) 2017-10-03 2018-10-04 ARC SOURCE

Publications (1)

Publication Number Publication Date
MX2020003372A true MX2020003372A (es) 2020-07-29

Family

ID=64572281

Family Applications (2)

Application Number Title Priority Date Filing Date
MX2020003372A MX2020003372A (es) 2017-10-03 2018-10-04 Fuente de arco.
MX2020004821A MX2020004821A (es) 2017-10-03 2018-10-04 Fuente de arco con campo magnetico confinado.

Family Applications After (1)

Application Number Title Priority Date Filing Date
MX2020004821A MX2020004821A (es) 2017-10-03 2018-10-04 Fuente de arco con campo magnetico confinado.

Country Status (11)

Country Link
US (2) US11578401B2 (es)
EP (2) EP3692183A1 (es)
JP (2) JP7344483B2 (es)
KR (2) KR102667843B1 (es)
CN (2) CN111279014A (es)
CA (2) CA3078100A1 (es)
MX (2) MX2020003372A (es)
MY (1) MY203523A (es)
RU (2) RU2020113430A (es)
SG (2) SG11202002991YA (es)
WO (2) WO2019081052A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102882257B1 (ko) * 2019-07-03 2025-11-06 오를리콘 서피스 솔루션스 아크티엔게젤샤프트, 페피콘 음극 아크 소스
US20250230537A1 (en) * 2024-01-11 2025-07-17 Ge Infrastructure Technology Llc Hybrid Cathodes for ION Plasma Deposition Systems and Methods

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* Cited by examiner, † Cited by third party
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US4448659A (en) * 1983-09-12 1984-05-15 Vac-Tec Systems, Inc. Method and apparatus for evaporation arc stabilization including initial target cleaning
US4724058A (en) * 1984-08-13 1988-02-09 Vac-Tec Systems, Inc. Method and apparatus for arc evaporating large area targets
US5298136A (en) * 1987-08-18 1994-03-29 Regents Of The University Of Minnesota Steered arc coating with thick targets
RU2074904C1 (ru) 1992-11-23 1997-03-10 Евгений Николаевич Ивашов Катодный узел для ионно-плазменного нанесения тонких пленок в вакууме
RU2135634C1 (ru) 1998-06-15 1999-08-27 Санкт-Петербургский государственный технический университет Способ и устройство магнетронного распыления
US6929727B2 (en) * 1999-04-12 2005-08-16 G & H Technologies, Llc Rectangular cathodic arc source and method of steering an arc spot
US6645354B1 (en) * 2000-04-07 2003-11-11 Vladimir I. Gorokhovsky Rectangular cathodic arc source and method of steering an arc spot
ATE277204T1 (de) * 2001-03-27 2004-10-15 Fundacion Tekniker Lichtbogenverdampfer mit kraftvoller magnetführung für targets mit grosser oberfläche
DE10127013A1 (de) 2001-06-05 2002-12-12 Gabriel Herbert M Lichtbogen-Verdampfungsvorrichtung
US20090050059A1 (en) 2005-12-16 2009-02-26 Josu Goikoetxea Larrinaga Cathode evaporation machine
RU2448388C2 (ru) * 2006-05-16 2012-04-20 Эрликон Трейдинг Аг, Трюббах Электродуговой источник и магнитное приспособление
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Also Published As

Publication number Publication date
KR20200063204A (ko) 2020-06-04
JP7212234B2 (ja) 2023-01-25
CN111279014A (zh) 2020-06-12
RU2020113430A (ru) 2021-11-08
US11306390B2 (en) 2022-04-19
RU2020113435A (ru) 2021-11-08
BR112020006716A2 (pt) 2020-10-06
JP2020536171A (ja) 2020-12-10
CN111315915A (zh) 2020-06-19
WO2019081052A1 (en) 2019-05-02
US11578401B2 (en) 2023-02-14
RU2020113435A3 (es) 2022-02-22
JP2020536170A (ja) 2020-12-10
KR20200063203A (ko) 2020-06-04
EP3692184B1 (en) 2024-04-17
MX2020004821A (es) 2020-08-13
WO2019081053A1 (en) 2019-05-02
SG11202002992TA (en) 2020-04-29
KR102667844B1 (ko) 2024-05-22
JP7344483B2 (ja) 2023-09-14
CA3078100A1 (en) 2019-05-02
EP3692183A1 (en) 2020-08-12
EP3692184A1 (en) 2020-08-12
CA3077570A1 (en) 2019-05-02
BR112020006715A2 (pt) 2020-10-06
US20200299824A1 (en) 2020-09-24
MY203523A (en) 2024-07-02
SG11202002991YA (en) 2020-04-29
RU2020113430A3 (es) 2021-11-29
US20200255932A1 (en) 2020-08-13
KR102667843B1 (ko) 2024-05-22

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