MX2020004821A - Fuente de arco con campo magnetico confinado. - Google Patents

Fuente de arco con campo magnetico confinado.

Info

Publication number
MX2020004821A
MX2020004821A MX2020004821A MX2020004821A MX2020004821A MX 2020004821 A MX2020004821 A MX 2020004821A MX 2020004821 A MX2020004821 A MX 2020004821A MX 2020004821 A MX2020004821 A MX 2020004821A MX 2020004821 A MX2020004821 A MX 2020004821A
Authority
MX
Mexico
Prior art keywords
magnetic field
target
cathode assembly
arc source
arc
Prior art date
Application number
MX2020004821A
Other languages
English (en)
Inventor
Siegfried Krassnitzer
Juerg Hagmann
Original Assignee
Oerlikon Surface Solutions Ag Pfaeffikon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Surface Solutions Ag Pfaeffikon filed Critical Oerlikon Surface Solutions Ag Pfaeffikon
Publication of MX2020004821A publication Critical patent/MX2020004821A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/3255—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32559—Protection means, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/48—Generating plasma using an arc
    • H05H1/50—Generating plasma using an arc and using applied magnetic fields, e.g. for focusing or rotating the arc
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15—Means for deflecting or directing discharge
    • H01J2237/152—Magnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Analytical Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Discharge Heating (AREA)

Abstract

Un evaporador de ARCO que comprende: - un conjunto de cátodo que comprende una placa de enfriamiento (11), un objetivo (1) como elemento de cátodo, - un electrodo dispuesto para permitir que se pueda establecer un arco entre el electrodo y la superficie frontal (1A) del objetivo (1) - un sistema de guía magnética colocado delante de la superficie posterior (1B) del objetivo (i) que comprende medios para generar uno o más magnéticos mientras que: - los bordes del conjunto de cátodo comprenden un blindaje circundante (15) fabricado de material ferromagnético, en el que el blindaje circundante (15) tiene una altura total (H) en la dirección transversal, dicha altura total (H) incluye un componente (C) para causar un efecto de blindaje de líneas de campo magnético que se extienden en cualquier dirección longitudinal, estableciendo de esta manera los bordes del conjunto de cátodo como límite de la extensión de las líneas de campo magnético en cualquier dirección longitudinal.
MX2020004821A 2017-10-03 2018-10-04 Fuente de arco con campo magnetico confinado. MX2020004821A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762567423P 2017-10-03 2017-10-03
PCT/EP2018/000459 WO2019081052A1 (en) 2017-10-03 2018-10-04 CONFINED MAGNETIC FIELD ARC SOURCE

Publications (1)

Publication Number Publication Date
MX2020004821A true MX2020004821A (es) 2020-08-13

Family

ID=64572281

Family Applications (2)

Application Number Title Priority Date Filing Date
MX2020004821A MX2020004821A (es) 2017-10-03 2018-10-04 Fuente de arco con campo magnetico confinado.
MX2020003372A MX2020003372A (es) 2017-10-03 2018-10-04 Fuente de arco.

Family Applications After (1)

Application Number Title Priority Date Filing Date
MX2020003372A MX2020003372A (es) 2017-10-03 2018-10-04 Fuente de arco.

Country Status (11)

Country Link
US (2) US11578401B2 (es)
EP (2) EP3692184B1 (es)
JP (2) JP7212234B2 (es)
KR (2) KR102667844B1 (es)
CN (2) CN111315915A (es)
CA (2) CA3078100A1 (es)
MX (2) MX2020004821A (es)
MY (1) MY203523A (es)
RU (2) RU2020113430A (es)
SG (2) SG11202002992TA (es)
WO (2) WO2019081052A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120738607A (zh) * 2019-07-03 2025-10-03 欧瑞康表面解决方案股份公司，普费菲孔 阴极电弧源
US20250230537A1 (en) * 2024-01-11 2025-07-17 Ge Infrastructure Technology Llc Hybrid Cathodes for ION Plasma Deposition Systems and Methods

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4448659A (en) * 1983-09-12 1984-05-15 Vac-Tec Systems, Inc. Method and apparatus for evaporation arc stabilization including initial target cleaning
US4724058A (en) * 1984-08-13 1988-02-09 Vac-Tec Systems, Inc. Method and apparatus for arc evaporating large area targets
US5298136A (en) 1987-08-18 1994-03-29 Regents Of The University Of Minnesota Steered arc coating with thick targets
RU2074904C1 (ru) 1992-11-23 1997-03-10 Евгений Николаевич Ивашов Катодный узел для ионно-плазменного нанесения тонких пленок в вакууме
RU2135634C1 (ru) 1998-06-15 1999-08-27 Санкт-Петербургский государственный технический университет Способ и устройство магнетронного распыления
US6929727B2 (en) * 1999-04-12 2005-08-16 G & H Technologies, Llc Rectangular cathodic arc source and method of steering an arc spot
US6645354B1 (en) * 2000-04-07 2003-11-11 Vladimir I. Gorokhovsky Rectangular cathodic arc source and method of steering an arc spot
CN100355933C (zh) * 2001-03-27 2007-12-19 特克尼克基业 具有用于较大表面积的靶的强力磁引导装置的电弧蒸发器
DE10127013A1 (de) * 2001-06-05 2002-12-12 Gabriel Herbert M Lichtbogen-Verdampfungsvorrichtung
WO2007068768A1 (es) 2005-12-16 2007-06-21 Fundacion Tekniker Máquina de evaporación catódica
EP2466614A3 (de) * 2006-05-16 2013-05-22 Oerlikon Trading AG, Trübbach Arcquelle und Magnetanordnung
CN101358328A (zh) 2007-12-28 2009-02-04 中国科学院金属研究所 一种动态受控电弧离子镀弧源
JP5496223B2 (ja) * 2008-12-26 2014-05-21 フンダシオン テクニケル アーク・エバポレーターおよびアーク・エバポレーターの操作方法
WO2011021281A1 (ja) * 2009-08-19 2011-02-24 日新電機株式会社 アーク蒸発源及び真空蒸着装置
WO2011137967A1 (de) 2010-05-04 2011-11-10 Oerlikon Trading Ag, Trübbach Verfahren zum funkenverdampfen mit keramischen targets
UA101678C2 (uk) * 2011-04-08 2013-04-25 Национальный Научный Центр "Харьковский Физико-Технический Институт" Вакуумно-дуговий випарник для генерування катодної плазми
US9153422B2 (en) 2011-08-02 2015-10-06 Envaerospace, Inc. Arc PVD plasma source and method of deposition of nanoimplanted coatings
CN102534513B (zh) * 2011-12-19 2014-04-16 东莞市汇成真空科技有限公司 一种组合磁场的矩形平面阴极电弧蒸发源
RU2482217C1 (ru) * 2012-02-28 2013-05-20 Открытое акционерное общество "Национальный институт авиационных технологий" Вакуумно-дуговой источник плазмы
US9772808B1 (en) 2012-11-29 2017-09-26 Eric Nashbar System and method for document delivery
AT13830U1 (de) * 2013-04-22 2014-09-15 Plansee Se Lichtbogenverdampfungs-Beschichtungsquelle
CN106756819A (zh) * 2016-09-30 2017-05-31 广东省新材料研究所 一种MCrAlY高温防护涂层制备方法

Also Published As

Publication number Publication date
CA3078100A1 (en) 2019-05-02
MY203523A (en) 2024-07-02
KR20200063204A (ko) 2020-06-04
WO2019081053A1 (en) 2019-05-02
WO2019081052A1 (en) 2019-05-02
JP2020536170A (ja) 2020-12-10
US11306390B2 (en) 2022-04-19
KR20200063203A (ko) 2020-06-04
CA3077570A1 (en) 2019-05-02
KR102667843B1 (ko) 2024-05-22
JP2020536171A (ja) 2020-12-10
BR112020006715A2 (pt) 2020-10-06
CN111315915A (zh) 2020-06-19
RU2020113430A3 (es) 2021-11-29
MX2020003372A (es) 2020-07-29
EP3692184A1 (en) 2020-08-12
CN111279014A (zh) 2020-06-12
JP7212234B2 (ja) 2023-01-25
EP3692183A1 (en) 2020-08-12
RU2020113430A (ru) 2021-11-08
RU2020113435A (ru) 2021-11-08
KR102667844B1 (ko) 2024-05-22
EP3692184B1 (en) 2024-04-17
SG11202002992TA (en) 2020-04-29
US20200299824A1 (en) 2020-09-24
JP7344483B2 (ja) 2023-09-14
RU2020113435A3 (es) 2022-02-22
BR112020006716A2 (pt) 2020-10-06
SG11202002991YA (en) 2020-04-29
US20200255932A1 (en) 2020-08-13
US11578401B2 (en) 2023-02-14

Similar Documents

Publication Publication Date Title
CU20150108A7 (es) Procesamiento de materiales
MX392707B (es) LINFOCITOS T ACTIVADOS POR BiTE EX VIVO.
EP3163626A3 (en) Organic light emitting display device
AR095602A1 (es) Sistema y método de recubrimiento de un sustrato
MX2022001776A (es) Terapias de combinacion de inmuno oncologia con conjugados de il-2.
ES410383A1 (es) Una disposicion de tubo de rayos catodicos.
MX358910B (es) Sistemas y metodos de soporte para electrodos de soldadura con varilla.
MX2019001081A (es) Dispositivo de soldadura.
ES2666234T3 (es) Fuente de deposición por arco con campo eléctrico definido
MX2017001184A (es) Sistema de boquilla para soldadura de onda y método de soldadura de onda.
MX2016012703A (es) Dispositivo de deposicion tridimensional.
BR112017007353A2 (pt) artigo absorvente com estrutura adaptável ao corpo
MX2020004919A (es) Articulos absorbentes con armazon y pretinas visualmente diferentes.
BR112018001228A2 (pt) aparelho e método para produzir um plasma, e uso do aparelho
MX2017005428A (es) Transductor electromagnetico acustico.
MX2020004821A (es) Fuente de arco con campo magnetico confinado.
UY36593A (es) Sistema de irradiación que consta de un soporte de zonas de blancos dentro de un recinto de radioprotección y de un dispositivo de deflexión de haz de irradiación
BR112014017309A8 (pt) pistola de plasma em cascata estendida
PE20180334A1 (es) Sistemas y metodos para reducir las corrientes parasitas no deseadas
AR095963A1 (es) Celda electrolítica para la extracción por vía electrolítica de metales
MX2019012660A (es) Metodo para tratar cancer empleando un inhibidor de proteina de linfoma de celulas b 2 (bcl-2) en forma conjunta con una radioinmunoterapia con emision de particulas alfa.
CO2018011747A2 (es) Método de soldadura resistiva, conjunto de antena y vidrio y sistema de soldadura resistiva
EP4404214A3 (en) Neutron activator, neutron activation system comprising such neutron activator and method for neutron activation implementing such neutron activator
BR112018010777A8 (pt) artigo absorvente
ES182165A1 (es) MEJORAS EN DISPOSITIVOS DE DESCARGA ELECTRoNICA