MX361608B - Fuente de desposicion por arco que tiene un campo electrico definido. - Google Patents

Fuente de desposicion por arco que tiene un campo electrico definido.

Info

Publication number
MX361608B
MX361608B MX2012015089A MX2012015089A MX361608B MX 361608 B MX361608 B MX 361608B MX 2012015089 A MX2012015089 A MX 2012015089A MX 2012015089 A MX2012015089 A MX 2012015089A MX 361608 B MX361608 B MX 361608B
Authority
MX
Mexico
Prior art keywords
cathode
anode
arc deposition
electric field
deposition source
Prior art date
Application number
MX2012015089A
Other languages
English (en)
Other versions
MX2012015089A (es
Inventor
Krassnitzer Siegfried
Hagmann Juerg
Original Assignee
Oerlikon Surface Solutions Ag Pfaeffikon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Surface Solutions Ag Pfaeffikon filed Critical Oerlikon Surface Solutions Ag Pfaeffikon
Publication of MX2012015089A publication Critical patent/MX2012015089A/es
Publication of MX361608B publication Critical patent/MX361608B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0089—Reactive sputtering in metallic mode
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5873—Removal of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Plasma Technology (AREA)

Abstract

La invención se relaciona con un dispositivo de deposición por arco, que comprende un cátodo, un ánodo, y una fuente de voltaje para colocar el ánodo al potencial positivo con relación al cátodo. El dispositivo también comprende los elementos magnéticos, que producen un campo magnético sobre la superficie catódica, donde el ánodo se coloca cerca del cátodo de una manera tal que las líneas del campo magnético que salen de la superficie catódica alcancen el ánodo.
MX2012015089A 2010-06-22 2011-06-03 Fuente de desposicion por arco que tiene un campo electrico definido. MX361608B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35727210P 2010-06-22 2010-06-22
PCT/EP2011/002734 WO2011160766A1 (de) 2010-06-22 2011-06-03 Arc-verdampfungsquelle mit definiertem elektrischem feld

Publications (2)

Publication Number Publication Date
MX2012015089A MX2012015089A (es) 2013-05-28
MX361608B true MX361608B (es) 2018-12-07

Family

ID=44487011

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2012015089A MX361608B (es) 2010-06-22 2011-06-03 Fuente de desposicion por arco que tiene un campo electrico definido.

Country Status (17)

Country Link
US (1) US10253407B2 (es)
EP (1) EP2585622B1 (es)
JP (1) JP6095568B2 (es)
KR (1) KR101854936B1 (es)
CN (1) CN102947478B (es)
BR (1) BR112012033065B1 (es)
CA (1) CA2803087C (es)
ES (1) ES2666234T3 (es)
HU (1) HUE038729T2 (es)
MX (1) MX361608B (es)
MY (1) MY170012A (es)
PL (1) PL2585622T3 (es)
PT (1) PT2585622T (es)
SG (1) SG186722A1 (es)
SI (1) SI2585622T1 (es)
TW (1) TWI553132B (es)
WO (1) WO2011160766A1 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2726648B1 (en) 2011-06-30 2019-09-11 Oerlikon Surface Solutions AG, Pfäffikon Nano-layer coating for high performance tools
CN103958738B (zh) 2011-09-30 2017-09-01 欧瑞康表面解决方案股份公司，普费菲孔 用于在加工操作中增强耐磨性的适应形态的铝钛氮化物涂层和其方法
EP2607517A1 (en) * 2011-12-22 2013-06-26 Oerlikon Trading AG, Trübbach Low temperature arc ion plating coating
HK1214356A1 (zh) * 2012-10-26 2016-07-22 Pixie Scientific, Inc 健康診斷系統和方法
JP6842233B2 (ja) 2014-07-29 2021-03-17 サンドビック インテレクチュアル プロパティー アクティエボラーグ コーティングされた切削工具、及びコーティングされた切削工具の製造方法
WO2016191372A1 (en) 2015-05-22 2016-12-01 Pixie Scientific, Llc Indicator panels for incontinence products
CN108368601B (zh) * 2015-12-22 2020-10-30 山特维克知识产权股份有限公司 涂覆的切削工具和方法
WO2019136261A1 (en) * 2018-01-04 2019-07-11 Ih Ip Holdings Limited Gas phase co-deposition of hydrogen/deuterium loaded metallic structures
EP3556901B1 (en) * 2018-04-20 2021-03-31 Plansee Composite Materials Gmbh Vacuum arc source
CN120738607A (zh) 2019-07-03 2025-10-03 欧瑞康表面解决方案股份公司，普费菲孔 阴极电弧源
KR102667048B1 (ko) * 2021-07-20 2024-05-22 한국생산기술연구원 중앙부 함몰형 자기장을 가지는 아크 증발원 및 이를 포함하는 아크 이온 플레이팅 장치, 그리고 이를 이용한 금속 및 금속화합물의 증착방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3625848A (en) 1968-12-26 1971-12-07 Alvin A Snaper Arc deposition process and apparatus
SU1040631A1 (ru) * 1980-06-25 1983-09-07 Предприятие П/Я В-8851 Вакуумно-дуговое устройство
US4620913A (en) 1985-11-15 1986-11-04 Multi-Arc Vacuum Systems, Inc. Electric arc vapor deposition method and apparatus
DE59004614D1 (de) 1989-06-27 1994-03-24 Hauzer Holding Verfahren und vorrichtung zur beschichtung von substraten.
US5380421A (en) * 1992-11-04 1995-01-10 Gorokhovsky; Vladimir I. Vacuum-arc plasma source
JP2002525431A (ja) * 1998-09-14 2002-08-13 ユナキス・トレーディング・アクチェンゲゼルシャフト アーク蒸化室用ターゲット配置
JP3917348B2 (ja) * 1999-05-26 2007-05-23 株式会社神戸製鋼所 アーク蒸発源、真空蒸着装置及び真空蒸着方法
JP4409015B2 (ja) * 1999-11-30 2010-02-03 株式会社神戸製鋼所 アークイオンプレーティング装置
CA2305938C (en) * 2000-04-10 2007-07-03 Vladimir I. Gorokhovsky Filtered cathodic arc deposition method and apparatus
DE10018143C5 (de) * 2000-04-12 2012-09-06 Oerlikon Trading Ag, Trübbach DLC-Schichtsystem sowie Verfahren und Vorrichtung zur Herstellung eines derartigen Schichtsystems
JP4000764B2 (ja) * 2000-09-18 2007-10-31 日新電機株式会社 真空アーク蒸発装置
JP4034563B2 (ja) * 2001-12-27 2008-01-16 株式会社神戸製鋼所 真空アーク蒸発源
JP4109503B2 (ja) * 2002-07-22 2008-07-02 日新電機株式会社 真空アーク蒸着装置
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AU2007306494B2 (en) * 2006-10-10 2012-05-31 Oerlikon Trading Ag, Truebbach Layer system having at least one mixed crystal layer of a polyoxide

Also Published As

Publication number Publication date
WO2011160766A1 (de) 2011-12-29
MY170012A (en) 2019-06-20
CA2803087A1 (en) 2011-12-29
HUE038729T2 (hu) 2018-11-28
PL2585622T3 (pl) 2018-07-31
SI2585622T1 (en) 2018-06-29
KR101854936B1 (ko) 2018-06-14
EP2585622A1 (de) 2013-05-01
PT2585622T (pt) 2018-04-20
JP2013533382A (ja) 2013-08-22
BR112012033065B1 (pt) 2022-04-05
US20130126347A1 (en) 2013-05-23
MX2012015089A (es) 2013-05-28
RU2013102585A (ru) 2014-08-10
EP2585622B1 (de) 2018-01-17
CN102947478B (zh) 2016-02-17
BR112012033065A2 (pt) 2020-08-11
CA2803087C (en) 2019-11-12
ES2666234T3 (es) 2018-05-03
US10253407B2 (en) 2019-04-09
CN102947478A (zh) 2013-02-27
JP6095568B2 (ja) 2017-03-15
TWI553132B (zh) 2016-10-11
KR20130121078A (ko) 2013-11-05
TW201219582A (en) 2012-05-16
SG186722A1 (en) 2013-02-28

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