MY106072A - Die attach adhesive composition - Google Patents

Die attach adhesive composition

Info

Publication number
MY106072A
MY106072A MYPI91000699A MYPI19910699A MY106072A MY 106072 A MY106072 A MY 106072A MY PI91000699 A MYPI91000699 A MY PI91000699A MY PI19910699 A MYPI19910699 A MY PI19910699A MY 106072 A MY106072 A MY 106072A
Authority
MY
Malaysia
Prior art keywords
adhesive composition
die attach
attach adhesive
chips
small amount
Prior art date
Application number
MYPI91000699A
Other languages
English (en)
Inventor
Chan Man-Sheung
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/515,698 external-priority patent/US5006575A/en
Application filed by Du Pont filed Critical Du Pont
Publication of MY106072A publication Critical patent/MY106072A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/16—Addition or condensation polymers of aldehydes or ketones according to C08L59/00 - C08L61/00; Derivatives thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
MYPI91000699A 1990-04-26 1991-04-24 Die attach adhesive composition MY106072A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/515,698 US5006575A (en) 1989-10-20 1990-04-26 Die attach adhesive composition

Publications (1)

Publication Number Publication Date
MY106072A true MY106072A (en) 1995-03-31

Family

ID=24052381

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI91000699A MY106072A (en) 1990-04-26 1991-04-24 Die attach adhesive composition

Country Status (5)

Country Link
EP (1) EP0454005B1 (de)
JP (1) JP2589892B2 (de)
CA (1) CA2041295A1 (de)
DE (1) DE69105597T2 (de)
MY (1) MY106072A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100333452B1 (ko) 1994-12-26 2002-04-18 이사오 우치가사키 필름 형상의 유기 다이본딩재 및 이를 이용한 반도체 장치
JP3260253B2 (ja) * 1995-01-06 2002-02-25 松下電器産業株式会社 半導体装置の検査方法と検査用導電性接着剤
TW310481B (de) 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US5912282A (en) * 1996-12-16 1999-06-15 Shell Oil Company Die attach adhesive compositions
KR20110033937A (ko) * 2008-07-22 2011-04-01 이 아이 듀폰 디 네모아 앤드 캄파니 박막 광전지에 사용하기 위한 중합체 후막 은 전극 조성물
AU2017247030B2 (en) * 2016-04-06 2021-03-11 Novel Technologies Holdings Limited Silver containing antimicrobial materials

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3412043A (en) * 1966-08-05 1968-11-19 Dexter Corp Electrically conductive resinous compositions
US4516836A (en) * 1982-09-20 1985-05-14 Crystaloid Electronics Company Conductor for use in electro-optical displays
JPS59159640A (ja) * 1983-02-28 1984-09-10 Fujikura Ltd 自己接着性絶縁電線およびこれを用いた密閉形圧縮機用電動機
US4747968A (en) * 1985-05-08 1988-05-31 Sheldahl, Inc. Low temperature cure having single component conductive adhesive
JPS63178181A (ja) * 1987-01-20 1988-07-22 Hitachi Chem Co Ltd 接着剤組成物
US4769399A (en) * 1987-03-12 1988-09-06 Minnesota Mining And Manufacturing Company Epoxy adhesive film for electronic applications
US4976813A (en) * 1988-07-01 1990-12-11 Amoco Corporation Process for using a composition for a solder mask
JPH02206670A (ja) * 1989-02-06 1990-08-16 Hitachi Chem Co Ltd 異方導電性を有する回路接続用熱伝導性接着剤組成物及び熱伝導性接着フィルム

Also Published As

Publication number Publication date
CA2041295A1 (en) 1991-10-27
JP2589892B2 (ja) 1997-03-12
JPH04227782A (ja) 1992-08-17
DE69105597T2 (de) 1995-05-11
EP0454005A3 (en) 1992-11-25
EP0454005A2 (de) 1991-10-30
EP0454005B1 (de) 1994-12-07
DE69105597D1 (de) 1995-01-19

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