MY106164A - Autodeposition emulsion and methods of using thereof to selectively protect metallic surfaces. - Google Patents

Autodeposition emulsion and methods of using thereof to selectively protect metallic surfaces.

Info

Publication number
MY106164A
MY106164A MYPI91000187A MYPI19910187A MY106164A MY 106164 A MY106164 A MY 106164A MY PI91000187 A MYPI91000187 A MY PI91000187A MY PI19910187 A MYPI19910187 A MY PI19910187A MY 106164 A MY106164 A MY 106164A
Authority
MY
Malaysia
Prior art keywords
emulsion
substrate
selectively protect
autodeposition
methods
Prior art date
Application number
MYPI91000187A
Other languages
English (en)
Inventor
Joseph Hart Daniel
Robert Browne Alan
Frederick Becknell Alan
Elzufen Betsy
Original Assignee
Grace W R & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grace W R & Co filed Critical Grace W R & Co
Publication of MY106164A publication Critical patent/MY106164A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
  • Chemically Coating (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
MYPI91000187A 1990-12-07 1991-02-07 Autodeposition emulsion and methods of using thereof to selectively protect metallic surfaces. MY106164A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62136190A 1990-12-07 1990-12-07

Publications (1)

Publication Number Publication Date
MY106164A true MY106164A (en) 1995-03-31

Family

ID=24489847

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI91000187A MY106164A (en) 1990-12-07 1991-02-07 Autodeposition emulsion and methods of using thereof to selectively protect metallic surfaces.

Country Status (3)

Country Link
JP (1) JPH04314877A (ja)
KR (1) KR920012518A (ja)
MY (1) MY106164A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5374500A (en) * 1993-04-02 1994-12-20 International Business Machines Corporation Positive photoresist composition containing photoacid generator and use thereof
KR100764374B1 (ko) * 2005-10-31 2007-10-08 주식회사 하이닉스반도체 이머젼 리소그라피 용액 제거용 조성물 및 이를 이용한이머젼 리소그라피 공정을 포함하는 반도체 소자 제조방법
JP6735717B2 (ja) 2017-09-21 2020-08-19 栗田工業株式会社 蒸気による加熱効率向上方法及び抄紙方法

Also Published As

Publication number Publication date
JPH04314877A (ja) 1992-11-06
KR920012518A (ko) 1992-07-27

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