MY115159A - Solder. - Google Patents

Solder.

Info

Publication number
MY115159A
MY115159A MYPI94002985A MYPI9402985A MY115159A MY 115159 A MY115159 A MY 115159A MY PI94002985 A MYPI94002985 A MY PI94002985A MY PI9402985 A MYPI9402985 A MY PI9402985A MY 115159 A MY115159 A MY 115159A
Authority
MY
Malaysia
Prior art keywords
tin
lead alloy
alloy solder
solder
condinations
Prior art date
Application number
MYPI94002985A
Other languages
English (en)
Inventor
Yasuji Kawashima
Takashi Nagashima
Akihiko Matsuike
Takeshi Meguro
Kaoru Shimizu
Hideo Chaki
Toshiaki Ogura
Original Assignee
Nippon Genma Kk
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Genma Kk, Matsushita Electric Industrial Co Ltd filed Critical Nippon Genma Kk
Publication of MY115159A publication Critical patent/MY115159A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Paper (AREA)
MYPI94002985A 1993-11-09 1994-11-09 Solder. MY115159A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27938193 1993-11-09
JP6053489A JP2677760B2 (ja) 1993-11-09 1994-03-24 はんだ

Publications (1)

Publication Number Publication Date
MY115159A true MY115159A (en) 2003-04-30

Family

ID=17610354

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI94002985A MY115159A (en) 1993-11-09 1994-11-09 Solder.

Country Status (4)

Country Link
JP (1) JP2677760B2 (fr)
KR (1) KR100259311B1 (fr)
MY (1) MY115159A (fr)
TW (2) TW291455B (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6033488A (en) * 1996-11-05 2000-03-07 Samsung Electronics Co., Ltd. Solder alloy
KR100230269B1 (ko) * 1996-12-31 1999-11-15 윤종용 납땜용 솔더 합금
JP2002153990A (ja) 2000-11-21 2002-05-28 Senju Metal Ind Co Ltd はんだボール用合金
JP3599101B2 (ja) * 2000-12-11 2004-12-08 株式会社トッパンＮｅｃサーキットソリューションズ はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法
CN100413633C (zh) * 2003-09-05 2008-08-27 中国科学院金属研究所 一种抗氧化的锡铅系合金焊料
US8128868B2 (en) 2009-02-12 2012-03-06 International Business Machines Corporation Grain refinement by precipitate formation in PB-free alloys of tin
US8493746B2 (en) 2009-02-12 2013-07-23 International Business Machines Corporation Additives for grain fragmentation in Pb-free Sn-based solder
CN101920405B (zh) * 2010-08-23 2013-07-31 中国电力科学研究院 一种镀锌钢接地网用锡铅基复合钎料及其制备方法
CN115781100B (zh) * 2023-01-29 2023-05-02 河北钢研德凯科技有限公司 一种镁合金焊丝及其制备方法和应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59153857A (ja) * 1983-02-21 1984-09-01 Taruchin Kk 接合部形成用合金
JPS61273296A (ja) * 1985-05-29 1986-12-03 Taruchin Kk 耐食性はんだ合金
JPH02101132A (ja) * 1988-10-11 1990-04-12 Ichiro Kawakatsu 低融点ハンダ合金
JP2731277B2 (ja) * 1990-02-28 1998-03-25 株式会社東芝 ダイボンディング用半田

Also Published As

Publication number Publication date
TW291455B (fr) 1996-11-21
JPH07178587A (ja) 1995-07-18
TW305899B (fr) 1997-05-21
KR100259311B1 (ko) 2000-06-15
JP2677760B2 (ja) 1997-11-17
KR950014341A (ko) 1995-06-15

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