MY117983A - Electronic chip component and method of manufacturing the same - Google Patents
Electronic chip component and method of manufacturing the sameInfo
- Publication number
- MY117983A MY117983A MYPI96001993A MYPI9601993A MY117983A MY 117983 A MY117983 A MY 117983A MY PI96001993 A MYPI96001993 A MY PI96001993A MY PI9601993 A MYPI9601993 A MY PI9601993A MY 117983 A MY117983 A MY 117983A
- Authority
- MY
- Malaysia
- Prior art keywords
- electrode layers
- manufacturing
- same
- chip component
- electronic chip
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C8/00—Non-adjustable resistors consisting of loose powdered or granular conducting, or powdered or granular semi-conducting material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
IN A CHIP RESISTOR COMPRISING OF A RESISTOR LAYER 4, A PAIR OF UPPER SURFACE ELECTRODE LAYERS 2, A PROTECTION LAYER 6 FORMED ON THE SURFACE OF A SUBSTRATE 1, AND A PAIR OF EXTERNAL ELECTRODES COMPOSED OF FIRST ELECTRODE LAYERS 3 AND SECOND ELECTRODE LAYERS 7 OF SOLDER AT BOTH SIDES, AN ELECTRO-CONDUCTIVE MATERIAL IN WHICH ELECTRO-CONDUCTIVE METAL POWDER HAVING PLURAL PROJECTIONS ON THE SURFACE AND RESIN BINDER ARE MIXED IS USED FOR MAKING THE FIRST ELECTRODE LAYERS 3, IN ORDER TO IMPROVE THE MECHANICAL STRENGTH OF THE EXTERNAL ELECTRODES. (FIG. 1)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12616395A JP3739830B2 (en) | 1995-05-25 | 1995-05-25 | Chip-shaped electronic component and manufacturing method thereof |
| JP7278805A JPH09129406A (en) | 1995-10-26 | 1995-10-26 | Electronic component and method of manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY117983A true MY117983A (en) | 2004-08-30 |
Family
ID=26462384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI96001993A MY117983A (en) | 1995-05-25 | 1996-05-25 | Electronic chip component and method of manufacturing the same |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR100212225B1 (en) |
| CN (1) | CN1095174C (en) |
| DE (1) | DE19620446A1 (en) |
| MY (1) | MY117983A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1160742C (en) * | 1997-07-03 | 2004-08-04 | 松下电器产业株式会社 | Resistor and method for manufacturing the same |
| DE10120517B4 (en) | 2001-04-26 | 2013-06-06 | Epcos Ag | Electrical multilayer PTC thermistor and method for its production |
| WO2002091408A1 (en) | 2001-05-08 | 2002-11-14 | Epcos Ag | Ceramic multi-layer element and a method for the production thereof |
| JPWO2007032201A1 (en) * | 2005-09-15 | 2009-03-19 | パナソニック株式会社 | Chip electronic components |
| US8031043B2 (en) * | 2008-01-08 | 2011-10-04 | Infineon Technologies Ag | Arrangement comprising a shunt resistor and method for producing an arrangement comprising a shunt resistor |
| CN110277206A (en) * | 2018-03-16 | 2019-09-24 | 新力应用材料有限公司 | Conductive terminal material, resistor and manufacturing method thereof |
| CN109767885B (en) * | 2019-02-28 | 2020-09-22 | 华南理工大学 | A kind of zinc oxide varistor element of solder alloy layer electrode and preparation method thereof |
-
1996
- 1996-05-21 DE DE19620446A patent/DE19620446A1/en not_active Withdrawn
- 1996-05-24 CN CN96106663A patent/CN1095174C/en not_active Expired - Fee Related
- 1996-05-25 KR KR1019960017859A patent/KR100212225B1/en not_active Expired - Fee Related
- 1996-05-25 MY MYPI96001993A patent/MY117983A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN1095174C (en) | 2002-11-27 |
| DE19620446A1 (en) | 1996-11-28 |
| CN1147138A (en) | 1997-04-09 |
| KR960042780A (en) | 1996-12-21 |
| KR100212225B1 (en) | 1999-08-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB2354112B (en) | Ceramic electronic component | |
| MY113149A (en) | Method of manufacturing a printed circuit assembly | |
| GB2327631B (en) | Ceramic electronic part and method for producing the same | |
| EP0101791A3 (en) | Multi-layer circuitry | |
| MY112657A (en) | Multi-layer electronic part | |
| SG71171A1 (en) | Semiconductor device method of making the same and electronic device using the same | |
| EP0299252A3 (en) | Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers | |
| CA2028043A1 (en) | Chip form of surface mounted electrical resistance and its manufacturing method | |
| EP1895587A3 (en) | Semiconductor package substrate | |
| TW243584B (en) | Apparatus having inner layers supporting surface-mount components and a method of manufacturing the same | |
| WO1997023897A3 (en) | Opto-electronic sensor component | |
| SG81960A1 (en) | Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument | |
| MY117368A (en) | A resistor and its manufacturing method | |
| IL141118A0 (en) | A method for the implementation of electronic components in via-holes of a multi-layer multi-chip module | |
| EP0362161A3 (en) | Method of manufacturing a substrate for microwave integrated circuits | |
| CA1249064A (en) | Process for application of overlay conductors to surface of printed circuit board assemblies | |
| MY117983A (en) | Electronic chip component and method of manufacturing the same | |
| US5112648A (en) | Method of manufacturing a printed circuit board | |
| US3851223A (en) | Microcircuit board | |
| CA2200154A1 (en) | LSI Package and Manufacturing Method Thereof | |
| MY133863A (en) | Passive component integrated circuit chip | |
| EP0039160A3 (en) | Methods for bonding conductive bumps to electronic circuitry | |
| TW347577B (en) | Bottom electrode structure for integrated circuit capacitors and method of making the same | |
| EP0844658A3 (en) | Integrated circuit, method of fabrication and evaluation of the same | |
| US5219607A (en) | Method of manufacturing printed circuit board |