MY121923A - Finger mounting structure for a robot arm adapted to collectively conveying wafers in a semiconductor manufacturing system - Google Patents

Finger mounting structure for a robot arm adapted to collectively conveying wafers in a semiconductor manufacturing system

Info

Publication number
MY121923A
MY121923A MYPI9400964A MY121923A MY 121923 A MY121923 A MY 121923A MY PI9400964 A MYPI9400964 A MY PI9400964A MY 121923 A MY121923 A MY 121923A
Authority
MY
Malaysia
Prior art keywords
holes
finger
robot arm
semiconductor manufacturing
mounting structure
Prior art date
Application number
Other languages
English (en)
Inventor
Hitoshi Kawano
Hiroshi Nagashima
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of MY121923A publication Critical patent/MY121923A/en

Links

Landscapes

  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
MYPI9400964 1993-04-22 1994-04-20 Finger mounting structure for a robot arm adapted to collectively conveying wafers in a semiconductor manufacturing system MY121923A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11761293A JP2970308B2 (ja) 1993-04-22 1993-04-22 半導体製造装置におけるウェーハ一括搬送用ロボットアームのフィンガ取付構造

Publications (1)

Publication Number Publication Date
MY121923A true MY121923A (en) 2006-03-31

Family

ID=14716074

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9400964 MY121923A (en) 1993-04-22 1994-04-20 Finger mounting structure for a robot arm adapted to collectively conveying wafers in a semiconductor manufacturing system

Country Status (2)

Country Link
JP (1) JP2970308B2 (ja)
MY (1) MY121923A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6450755B1 (en) * 1998-07-10 2002-09-17 Equipe Technologies Dual arm substrate handling robot with a batch loader
US6216883B1 (en) 1998-07-24 2001-04-17 Mitsubishi Denki Kabushiki Kaisha Wafer holding hand
JP7611651B2 (ja) * 2020-06-09 2025-01-10 川崎重工業株式会社 基板保持装置
CN115763331A (zh) * 2022-11-28 2023-03-07 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 晶圆传输装置
KR102876268B1 (ko) * 2024-08-30 2025-10-28 주식회사 원익아이피에스 기판 이송 장치 및 이를 포함하는 기판 처리 장치

Also Published As

Publication number Publication date
JPH06310585A (ja) 1994-11-04
JP2970308B2 (ja) 1999-11-02

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