Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Holwell Products CorpfiledCriticalHolwell Products Corp
Priority to MYPI9800066priorityCriticalpatent/MY122304A/en
Publication of MY122304ApublicationCriticalpatent/MY122304A/en
AN ELECTRIC CURING DEVICE WITH A MINIATURE STRUCTURE IS DISCLOSED. THE ELECTRIC CURING DEVICE INCLUDES AN UPPER CASE, A CONTROL CIRCUIT BOARD, A LOWER CASE, TWO BODY CONTACT PADS, AND A BODY CONTACT PAD RETAINING FRAME CASE. THE LOWER CASE IS JOINED WITH THE UPPER CASE SO THAT THE CONTROL CIRCUIT BOARD IS INTERPOSED THEREBETWEEN. THE BODY CONTACT PAD RETAINING FRAME CASE IS MOUNTED ON THE BOTTOM SURFACE OF THE LOWER CASE. THE LOWER CASE IS PROVIDED WITH A DOVETAIL BLOCK, AND A DOVETAIL GROOVE STRUCTURE IS CORRESPONDINGLY FORMED ON THE UPPER SURFACE OF THE BODY CONTACT PAD RETAINING FRAME CASE, SO THAT THE LOWER CASE MAY BE FASTENED WITH TILE BODY CONTACT PAD RETAINING FRAME CASE IN A DOVETAIL JOINT MANNER.(FIG. 2)
The leadframe with pedestal form raised pedestal on a leadframe die mount pad and form an electrical connection between the die mount pad and the semiconductor die.