MY122351A - Fine wire of gold alloy, method for manufacture thereof and use thereof - Google Patents

Fine wire of gold alloy, method for manufacture thereof and use thereof

Info

Publication number
MY122351A
MY122351A MYPI98005384A MYPI9805384A MY122351A MY 122351 A MY122351 A MY 122351A MY PI98005384 A MYPI98005384 A MY PI98005384A MY PI9805384 A MYPI9805384 A MY PI9805384A MY 122351 A MY122351 A MY 122351A
Authority
MY
Malaysia
Prior art keywords
gold alloy
manufacture
fine wire
gold
metaal
Prior art date
Application number
MYPI98005384A
Other languages
English (en)
Inventor
Christoph Dr Simons
Gunther Dr Herklotz
Lutz Schrapler
Jurgen Reuel
Y C Cho
Original Assignee
Heraeus Materials Tech Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Materials Tech Gmbh filed Critical Heraeus Materials Tech Gmbh
Publication of MY122351A publication Critical patent/MY122351A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
MYPI98005384A 1997-11-29 1998-11-27 Fine wire of gold alloy, method for manufacture thereof and use thereof MY122351A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19753055A DE19753055B4 (de) 1997-11-29 1997-11-29 Feinstdraht aus einer Gold-Legierung, Verfahren zu seiner Herstellung und seine Verwendung

Publications (1)

Publication Number Publication Date
MY122351A true MY122351A (en) 2006-04-29

Family

ID=7850260

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI98005384A MY122351A (en) 1997-11-29 1998-11-27 Fine wire of gold alloy, method for manufacture thereof and use thereof

Country Status (6)

Country Link
JP (1) JP3579603B2 (de)
KR (1) KR100326478B1 (de)
CN (1) CN1085739C (de)
CH (1) CH693209A5 (de)
DE (1) DE19753055B4 (de)
MY (1) MY122351A (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030096985A (ko) * 2002-06-18 2003-12-31 헤라우스오리엔탈하이텍 주식회사 본딩용 금합금 세선
JP4596467B2 (ja) * 2005-06-14 2010-12-08 田中電子工業株式会社 高い接合信頼性、圧着ボールの高い真円性、高い直進性および高い耐樹脂流れ性を有するボンディングワイヤ用金合金線
JP4726206B2 (ja) * 2005-06-14 2011-07-20 田中電子工業株式会社 高い初期接合性、高い接合信頼性、圧着ボールの高い真円性、高い直進性、高い耐樹脂流れ性および低い比抵抗を有するボンディングワイヤ用金合金線
JP4726205B2 (ja) * 2005-06-14 2011-07-20 田中電子工業株式会社 高い初期接合性、高い接合信頼性、圧着ボールの高い真円性、高い直進性および高い耐樹脂流れ性を有するボンディングワイヤ用金合金線
KR101451361B1 (ko) * 2012-12-04 2014-10-15 희성금속 주식회사 반도체 패키지용 동 합금 본딩 와이어
CH707538B1 (fr) 2013-02-06 2017-12-15 Rolex Sa Alliage d'or rose pour pièce d'horlogerie.
MY192624A (en) * 2017-03-27 2022-08-29 Subodh Pethe Hard gold alloy with zirconium, titanium and magnesium for jewelry manufacture
CN107974571B (zh) * 2017-11-22 2019-06-14 有研亿金新材料有限公司 一种金瓷合金丝材及其制备方法
CN108922876B (zh) * 2018-06-27 2020-05-29 汕头市骏码凯撒有限公司 一种金合金键合丝及其制造方法
CN111394606B (zh) * 2020-05-06 2021-03-16 贵研铂业股份有限公司 一种金基高阻合金、合金材料及其制备方法
CN114214538B (zh) * 2021-11-12 2022-07-26 中国科学院金属研究所 一种空间引力波探测惯性传感器用金铂合金检验质量材料及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE674933C (de) * 1934-08-17 1939-04-25 Heraeus Gmbh W C Beryllium-Gold-Legierungen
GB2116208B (en) * 1981-12-04 1985-12-04 Mitsubishi Metal Corp Fine gold alloy wire for bonding of a semiconductor device
JPS63145729A (ja) * 1986-03-28 1988-06-17 Nittetsu Micro Metal:Kk 半導体素子ボンデイング用金線
JP2613224B2 (ja) * 1987-09-29 1997-05-21 田中貴金属工業株式会社 金極細線用材料
JP2745065B2 (ja) * 1988-05-02 1998-04-28 新日本製鐵株式会社 半導体素子用ボンディングワイヤ
JPH04291748A (ja) * 1991-03-20 1992-10-15 Sumitomo Electric Ind Ltd 配線基板
JP3586909B2 (ja) * 1995-01-20 2004-11-10 住友金属鉱山株式会社 ボンディングワイヤ
JP3367544B2 (ja) * 1995-08-23 2003-01-14 田中電子工業株式会社 ボンディング用金合金細線及びその製造方法

Also Published As

Publication number Publication date
JP3579603B2 (ja) 2004-10-20
JPH11222639A (ja) 1999-08-17
CN1224767A (zh) 1999-08-04
KR19990045637A (ko) 1999-06-25
DE19753055A1 (de) 1999-06-10
KR100326478B1 (ko) 2002-07-02
CH693209A5 (de) 2003-04-15
DE19753055B4 (de) 2005-09-15
CN1085739C (zh) 2002-05-29

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