MY124410A - Burn-in test socket. - Google Patents

Burn-in test socket.

Info

Publication number
MY124410A
MY124410A MYPI99001225A MYPI9901225A MY124410A MY 124410 A MY124410 A MY 124410A MY PI99001225 A MYPI99001225 A MY PI99001225A MY PI9901225 A MYPI9901225 A MY PI9901225A MY 124410 A MY124410 A MY 124410A
Authority
MY
Malaysia
Prior art keywords
housing
socket
limit position
circuit package
burn
Prior art date
Application number
MYPI99001225A
Inventor
Isamu Yamamoto
Tomohiro Nakano
Akira Kaneshige
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of MY124410A publication Critical patent/MY124410A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A SOCKET (1) FOR BURN-IN TESTING OF AN INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICAL LEADS. THE SOCKET INCLUDES AN OUTER SOCKET HOUSING AND AN INNER SOCKET HOUSING (4)SLIDABLY MOVEABLE RELATIVE TO THE OUTER HOUSING BETWEEN AN UPPER LIMIT POSITION AND A LOWER LIMIT POSITION, THE INNER FOR SUPPORTING THE INREGRATED CIRCUIT PACKAGE THEREON AND HAVING A PLURALITY OF TERMINAL-RECEIVING CAVITIES(7) THEREIN. TYHE SOCKET FURTHER INCLUDES A PLURALITY OF TERMINALS (12) DISPOSED IN THE TERMINAL-RECIEVING OF SAID INNER HOUSING (4) FOR CONTACTING THE LEADS OF THE INTEGRATED CIRCUIT PACKAGE, A CAM MECHANISM (27) FOR RAISING AND LOWERING THE INNER HOUSING BETWEEN THE UPPER LIMIT POSITION AND LOWER LIMIT POSITION RELATIVE TO THE OUTER HOUSING, AND A LATCH MECHANISM (34) FOR HOLDING AND RELEASING THE INTEGRATED CIRCIUT PACKAGE RELATIVE TI THE INNER HOUSING. (FIG. 1)
MYPI99001225A 1998-04-01 1999-03-31 Burn-in test socket. MY124410A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10105894A JP3020030B2 (en) 1998-04-01 1998-04-01 Burn-in socket

Publications (1)

Publication Number Publication Date
MY124410A true MY124410A (en) 2006-06-30

Family

ID=14419623

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI99001233A MY123246A (en) 1998-04-01 1999-03-31 Test socket lattice
MYPI99001225A MY124410A (en) 1998-04-01 1999-03-31 Burn-in test socket.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
MYPI99001233A MY123246A (en) 1998-04-01 1999-03-31 Test socket lattice

Country Status (6)

Country Link
JP (1) JP3020030B2 (en)
KR (2) KR100581237B1 (en)
CN (2) CN1178065C (en)
MY (2) MY123246A (en)
TW (2) TW411060U (en)
WO (2) WO1999050676A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6283780B1 (en) 1998-04-01 2001-09-04 Molex Incorporated Test socket lattice
US6267603B1 (en) 1998-04-01 2001-07-31 Molex Incorporated Burn-in test socket
JP2002164135A (en) * 2000-11-26 2002-06-07 Isao Kimoto Socket
JP3789789B2 (en) * 2001-08-31 2006-06-28 株式会社エンプラス Socket for electrical parts
JP4368132B2 (en) * 2003-04-25 2009-11-18 株式会社エンプラス Socket for electrical parts
KR100898409B1 (en) 2007-07-05 2009-05-21 주식회사 오킨스전자 Burn-in socket for leadframe chip packages
KR101090303B1 (en) * 2009-06-12 2011-12-07 (주)브이알인사이트 Bank Structure of FPM Board for Semiconductor Verification
US8888503B2 (en) * 2011-12-28 2014-11-18 Enplas Corporation Socket for electric parts
JP5836112B2 (en) * 2011-12-28 2015-12-24 株式会社エンプラス Socket for electrical parts
KR101485779B1 (en) * 2013-06-28 2015-01-26 황동원 Socket device for testing an IC
KR101931623B1 (en) * 2016-12-20 2018-12-21 주식회사 오킨스전자 Soket comprising locker for fixing latch
CN109342773A (en) * 2018-08-17 2019-02-15 北方电子研究院安徽有限公司 A metal tube shell aging board fixture
US11415624B2 (en) * 2019-01-31 2022-08-16 Yamaichi Electronics Co., Ltd. Socket for inspection
CN110867422A (en) * 2019-10-29 2020-03-06 太极半导体（苏州）有限公司 A ceramic grid array CLGA package carrier
KR102606908B1 (en) * 2020-12-23 2023-11-24 (주)마이크로컨텍솔루션 Test socket

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3245747B2 (en) * 1991-09-18 2002-01-15 日本テキサス・インスツルメンツ株式会社 socket
JPH0677467B2 (en) * 1992-12-25 1994-09-28 山一電機株式会社 IC socket
JP3259109B2 (en) * 1993-02-08 2002-02-25 日本テキサス・インスツルメンツ株式会社 socket
JP2667633B2 (en) * 1994-02-24 1997-10-27 山一電機株式会社 IC holding device in IC socket
JPH0888063A (en) * 1994-09-16 1996-04-02 Yamaichi Electron Co Ltd IC socket contact structure
JPH09162332A (en) * 1995-12-13 1997-06-20 Toshiba Chem Corp Ic test socket for bga
JP3714642B2 (en) * 1996-07-30 2005-11-09 株式会社エンプラス Electrical connection device

Also Published As

Publication number Publication date
MY123246A (en) 2006-05-31
CN1266492A (en) 2000-09-13
WO1999050676A1 (en) 1999-10-07
KR100581237B1 (en) 2006-05-22
CN1178066C (en) 2004-12-01
WO1999050677A1 (en) 1999-10-07
CN1178065C (en) 2004-12-01
KR20010013205A (en) 2001-02-26
TW399814U (en) 2000-07-21
KR20010013206A (en) 2001-02-26
JP3020030B2 (en) 2000-03-15
CN1266491A (en) 2000-09-13
KR100581240B1 (en) 2006-05-22
JPH11297443A (en) 1999-10-29
TW411060U (en) 2000-11-01

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