MY131804A - Polishing carrier, surface-polishing apparatus, and surface-polishing method - Google Patents

Polishing carrier, surface-polishing apparatus, and surface-polishing method

Info

Publication number
MY131804A
MY131804A MYPI9904118A MY131804A MY 131804 A MY131804 A MY 131804A MY PI9904118 A MYPI9904118 A MY PI9904118A MY 131804 A MY131804 A MY 131804A
Authority
MY
Malaysia
Prior art keywords
polishing
allows
reticulate
regions
work
Prior art date
Application number
Inventor
Takashi Kawate
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of MY131804A publication Critical patent/MY131804A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A TOTAL OF FOUR RETICULATE REGIONS 103 ARE FORMED ON A PLATE SURFACE, EACH OF WHICH ARE FORMED BETWEEN WORK-SUPPORTING OPENINGS 102. THE RETICULATE REGIONS 103 ARE FORMED INDIVIDUALLY IN SUITABLE SHAPES SO AS TO BE SPACED BY PREDETERMINED WIDTHS FROM AN OUTER PERIPHERAL SECTION, ON WHICH EXTERNAL TEETH 101 ARE FORMED, AND FROM PERIPHERAL SECTIONS OF THE WORK-HOLDING OPENINGS 102. THIS PROVIDES A TECHNIQUE THAT ALLOWS EVEN SIGNIFICANTLY THIN WORKS TO BE POLISHED WITHOUT PROBLEMS, ALLOWS A LOW PROCESSING PRECISION ATTRIBUTABLE TO VARIATION OF THE CARRIER SHAPE TO BE REDUCED, AND ALSO ALLOWS ACCIDENTS SUCH AS DAMAGE ON THE WORKS TO BE REDUCED.
MYPI9904118 1998-12-14 1999-09-22 Polishing carrier, surface-polishing apparatus, and surface-polishing method MY131804A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35463298 1998-12-14

Publications (1)

Publication Number Publication Date
MY131804A true MY131804A (en) 2007-09-28

Family

ID=18438871

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9904118 MY131804A (en) 1998-12-14 1999-09-22 Polishing carrier, surface-polishing apparatus, and surface-polishing method

Country Status (4)

Country Link
JP (1) JP3975251B2 (en)
CN (1) CN1132719C (en)
MY (1) MY131804A (en)
WO (1) WO2000035630A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100463778C (en) * 2004-09-10 2009-02-25 上海日进机床有限公司 Parallel plane grinder
JP5138407B2 (en) * 2008-02-14 2013-02-06 セイコーインスツル株式会社 Wafer and wafer polishing method
JP2012111001A (en) * 2010-11-25 2012-06-14 Nikon Corp Work carrier and polishing device having work carrier
CN103009242A (en) * 2011-09-28 2013-04-03 上海双明光学科技有限公司 Protection method for processing heavy-caliber ultrathin quartz glass
JP5937850B2 (en) * 2012-02-29 2016-06-22 株式会社ブリヂストン Grinding method
WO2017171052A1 (en) * 2016-03-31 2017-10-05 Hoya株式会社 Carrier and substrate manufacturing method using this carrier
CN106363529A (en) * 2016-11-14 2017-02-01 宜兴市晶科光学仪器有限公司 Work fixture for double-side grinding and polishing machine
CN107457687A (en) * 2017-09-30 2017-12-12 德清晶生光电科技有限公司 The erratic star wheel of uniform grinding
CN108608316A (en) * 2018-05-18 2018-10-02 成都成量工具集团有限公司 The processing tool and processing method of gauge block
CN115922555B (en) * 2022-12-04 2026-04-24 重庆前卫表业有限公司 Grinding equipment for valve grille and valve cover of diaphragm gas meter

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52109293U (en) * 1976-02-16 1977-08-19
JPS6434155U (en) * 1987-08-26 1989-03-02
JPH10180623A (en) * 1996-12-26 1998-07-07 Mitsubishi Materials Shilicon Corp Wrapping equipment
JPH1128661A (en) * 1997-07-09 1999-02-02 Nippon Electric Glass Co Ltd Polishing method and polishing device
JPH1190817A (en) * 1997-09-18 1999-04-06 Oputonikusu Seimitsu:Kk Wrapping carrier and manufacturing method thereof

Also Published As

Publication number Publication date
WO2000035630A1 (en) 2000-06-22
JP3975251B2 (en) 2007-09-12
CN1290202A (en) 2001-04-04
CN1132719C (en) 2003-12-31

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