MY136030A - Au alloy bonding wire - Google Patents

Au alloy bonding wire

Info

Publication number
MY136030A
MY136030A MYPI20055175A MYPI20055175A MY136030A MY 136030 A MY136030 A MY 136030A MY PI20055175 A MYPI20055175 A MY PI20055175A MY PI20055175 A MYPI20055175 A MY PI20055175A MY 136030 A MY136030 A MY 136030A
Authority
MY
Malaysia
Prior art keywords
mass
ppm
bonding wire
alloy bonding
pprn
Prior art date
Application number
MYPI20055175A
Inventor
Hiroshi Murai
Jun Chiba
Satoshi Teshima
Original Assignee
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind
Priority to MYPI20055175A priority Critical patent/MY136030A/en
Publication of MY136030A publication Critical patent/MY136030A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)

Abstract

AU ALLOY BONDING WIRE PROVIDED IS A THIN AU ALLOY BONDING WIRE HAVING DESIRED STRENGTH, GOOD BONCLABILITY AND STABILITY OVER TIME, AND IMPROVED CIRCULARITY OF A 5 SQUASHED BALL AND SPHERICITY OF A MELTED BALL, THE AU ALLOY BONDING WIRE CONTAINS, IN AN AU ALLOY MATRIX CONTAINING 0.05 TO 2 MASS IN TOTAL OF AT LEAST ONE SELECTED FRORN PD AND PT OF HIGH PURITY IN AU OF HIGH PURITY, AS TRACE ELEMENTS, 1 0 TO 1 00 PPRN BY MASS OF MG, 5 TO 1 00 PPM BY MASS OF CE, AND 5 TO 100 PPM BY MASS OF EACH OF AT LEAST ONE SELECTED FROM 10 BE, Y, GD, LA, EU AND SI, THE TOTAL CONTENT OF BE, Y, GD, LA, E-U AND SI BEING 5 TO 100 PPM BY MASS, OR AS TRACE ELEMENTS, MG, BE, AND AT LEAST ONE SELECTED FROM Y, LA, EU AND SI, OR AS TRACE ELEMENTS, 10 TO 100 PPRN BY MASS OF MG, 5 TO 30 PPRN BY MASS OF SI, 5 TO 30 PPM BY MASS C)F BE, AND 5 TO 30 PPM BY MASS OF AT LEAST ONE SELECTED FROM CA, CE AND SN. -D 01
MYPI20055175A 2005-11-02 2005-11-02 Au alloy bonding wire MY136030A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI20055175A MY136030A (en) 2005-11-02 2005-11-02 Au alloy bonding wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20055175A MY136030A (en) 2005-11-02 2005-11-02 Au alloy bonding wire

Publications (1)

Publication Number Publication Date
MY136030A true MY136030A (en) 2008-07-31

Family

ID=45879219

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20055175A MY136030A (en) 2005-11-02 2005-11-02 Au alloy bonding wire

Country Status (1)

Country Link
MY (1) MY136030A (en)

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