MY136708A - A method for removing surface contaminants on moulds used in semiconductor packaging tools - Google Patents

A method for removing surface contaminants on moulds used in semiconductor packaging tools

Info

Publication number
MY136708A
MY136708A MYPI98002099A MYPI9802099A MY136708A MY 136708 A MY136708 A MY 136708A MY PI98002099 A MYPI98002099 A MY PI98002099A MY PI9802099 A MYPI9802099 A MY PI9802099A MY 136708 A MY136708 A MY 136708A
Authority
MY
Malaysia
Prior art keywords
laser
contaminants
mould
remove
semiconductor packaging
Prior art date
Application number
MYPI98002099A
Other languages
English (en)
Inventor
Lu Yongfeng
Song Wendong
Gow Cheng Pak
Chen Qiong
Tay Huck Wee
Hwa Teik Hing Thomas
Lim Lui Ching Dawn
Jason Ngin Yan Koon
Jason Sim Yak Hui
Original Assignee
Advanced Systems Automation Ltd
Inst Data Storage
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation Ltd, Inst Data Storage filed Critical Advanced Systems Automation Ltd
Publication of MY136708A publication Critical patent/MY136708A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cleaning In General (AREA)
  • Laser Beam Processing (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
MYPI98002099A 1997-12-18 1998-05-08 A method for removing surface contaminants on moulds used in semiconductor packaging tools MY136708A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG1997004544A SG78282A1 (en) 1997-12-18 1997-12-18 A method for removing surface contaminants on moulds used in semiconductor packaging tools

Publications (1)

Publication Number Publication Date
MY136708A true MY136708A (en) 2008-11-28

Family

ID=20429813

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI98002099A MY136708A (en) 1997-12-18 1998-05-08 A method for removing surface contaminants on moulds used in semiconductor packaging tools

Country Status (7)

Country Link
EP (1) EP1039977A4 (fr)
JP (1) JP2002508249A (fr)
CN (1) CN1210113C (fr)
MY (1) MY136708A (fr)
SG (1) SG78282A1 (fr)
TW (1) TW480689B (fr)
WO (1) WO1999030845A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110696241A (zh) * 2018-07-10 2020-01-17 东和株式会社 成形模清洁装置及方法、树脂成形装置以及树脂成形品制造方法

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4630442B2 (ja) * 2000-10-19 2011-02-09 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP3789349B2 (ja) * 2001-11-16 2006-06-21 Ｔｏｗａ株式会社 樹脂成形用金型のクリーニング方法及び装置
TW552188B (en) * 2001-11-16 2003-09-11 Towa Corp Apparatus and method for evaluating degree of adhesion of adherents to mold surface, apparatus and method for surface treatment of mold surface and method and apparatus for cleaning mold used for molding resin
JP2004230750A (ja) * 2003-01-31 2004-08-19 Sumitomo Heavy Ind Ltd 金型クリーニング方法及び金型クリーニング装置
KR100626037B1 (ko) 2004-11-18 2006-09-20 삼성에스디아이 주식회사 마스크 세정방법
JP2006317726A (ja) * 2005-05-13 2006-11-24 Nec Lcd Technologies Ltd 断線修正方法及びアクティブマトリックス基板の製造方法並びに表示装置
JP5314876B2 (ja) * 2006-11-22 2013-10-16 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
CN104043617A (zh) * 2014-05-19 2014-09-17 南京南车浦镇城轨车辆有限责任公司 金属表面油污激光清洗设备
US11362473B2 (en) 2016-09-26 2022-06-14 Saint-Gobain Glass France Device and method for producing a patterned functional coating for a glass layer
GB201701607D0 (en) * 2017-01-31 2017-03-15 Advanced Laser Tech Ltd Scanning and cleaning of moulds
CN107377532A (zh) * 2017-08-25 2017-11-24 济南高能清扬激光清洗有限公司 一种橡胶制品模具的复合清洗方法
CN108816960B (zh) * 2018-06-14 2020-06-26 爱阔特(上海)清洗设备制造有限公司 一种半导体光刻板清洗装置
CN108807129B (zh) * 2018-06-21 2020-09-01 北京蜃景光电科技有限公司 镀膜腔室清洗装置及镀膜腔室清洗方法
CN108787631A (zh) * 2018-07-09 2018-11-13 江苏峰钛激光科技有限公司 一种重锈蚀层的激光清洗方法
JP6930946B2 (ja) * 2018-07-10 2021-09-01 Ｔｏｗａ株式会社 成形型クリーニング装置、成形型クリーニング方法、樹脂成形装置、及び樹脂成形品製造方法
CN111375603A (zh) * 2018-12-29 2020-07-07 膳魔师（江苏）家庭制品有限公司 一种保温杯的褪漆方法及装置
CN110303009B (zh) 2019-06-26 2020-10-16 深圳市华星光电技术有限公司 紫外光清洁装置
KR102249069B1 (ko) * 2020-01-14 2021-05-07 주식회사 아이엠티 반도체 금형 레이저 세정 장치
JP7614987B2 (ja) * 2021-09-14 2025-01-16 株式会社東芝 表面浄化方法および表面浄化システム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD242760A1 (de) * 1985-11-19 1987-02-11 Akad Wissenschaften Ddr Verfahren zur pruefung der reinheit von substratoberflaechen und zur reinigung derselben
ES2019931B3 (es) * 1986-02-14 1991-07-16 Amoco Corp Tratamiento por laser ultravioleta de superficies moldeadas.
DE3721940A1 (de) * 1987-07-02 1989-01-12 Ibm Deutschland Entfernen von partikeln von oberflaechen fester koerper durch laserbeschuss
JPH01122417A (ja) * 1987-11-06 1989-05-15 Rohm Co Ltd 合成樹脂モールド用金型の清掃方法
US5023424A (en) * 1990-01-22 1991-06-11 Tencor Instruments Shock wave particle removal method and apparatus
US5373140A (en) * 1993-03-16 1994-12-13 Vernay Laboratories, Inc. System for cleaning molding equipment using a laser
IT1282722B1 (it) * 1996-03-01 1998-03-31 Pirelli Metodo ed apparato per la pulitura di stampi di vulcanizzazione di articoli in materiale elastomerico

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110696241A (zh) * 2018-07-10 2020-01-17 东和株式会社 成形模清洁装置及方法、树脂成形装置以及树脂成形品制造方法
CN110696241B (zh) * 2018-07-10 2021-09-28 东和株式会社 成形模清洁装置及方法、树脂成形装置以及树脂成形品制造方法

Also Published As

Publication number Publication date
EP1039977A4 (fr) 2003-08-13
WO1999030845A1 (fr) 1999-06-24
CN1210113C (zh) 2005-07-13
EP1039977A1 (fr) 2000-10-04
CN1282277A (zh) 2001-01-31
TW480689B (en) 2002-03-21
JP2002508249A (ja) 2002-03-19
SG78282A1 (en) 2001-02-20

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