MY139624A - Stripping and cleaning compositions for microelectronics - Google Patents
Stripping and cleaning compositions for microelectronicsInfo
- Publication number
- MY139624A MY139624A MYPI20044536A MY139624A MY 139624 A MY139624 A MY 139624A MY PI20044536 A MYPI20044536 A MY PI20044536A MY 139624 A MY139624 A MY 139624A
- Authority
- MY
- Malaysia
- Prior art keywords
- cleaning compositions
- substrates
- ions
- compositions
- microelectronics
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 7
- 238000004140 cleaning Methods 0.000 title abstract 6
- 238000004377 microelectronic Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 3
- -1 AMMONIUM IONS Chemical class 0.000 abstract 2
- 238000005260 corrosion Methods 0.000 abstract 2
- 230000007797 corrosion Effects 0.000 abstract 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 abstract 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 abstract 1
- XLYOFNOQVPJJNP-PWCQTSIFSA-N Tritiated water Chemical compound [3H]O[3H] XLYOFNOQVPJJNP-PWCQTSIFSA-N 0.000 abstract 1
- 239000008139 complexing agent Substances 0.000 abstract 1
- 239000003112 inhibitor Substances 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 239000007800 oxidant agent Substances 0.000 abstract 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
Abstract
AQUEOUS CLEANING COMPOSITIONS AND METHOD OF USING THE CLEANING COMPOSITIONS FOR CLEANING MICROELECTRONIC SUBSTRATES, WHICH COMPOSITIONS ARE ABLE TO ESSENTIALLY COMPLETELY CLEAN SUCH SUBSTRATES AND PRODUCE ESSENTIALLY NO METAL CORROSION OF THE METAL ELEMENTS OF SUCH SUBSTRATES. THE AQUEOUS CLEANING COMPOSITIONS OF THIS INVENTION HAVE (a) WATER, (b) AT LEAST ONE OF AMMONIUM AND QUATERNARY AMMONIUM IONS AND (c) AT LEAST ONE OF HYPOPHOSPHITE (H2PO2) AND/OR PHOSPHITE (HPO32-) IONS. THE CLEANING COMPOSITIONS ALSO MAY CONTAIN FLUORIDE IONS. OPTIONALLY, THE COMPOSITION MAY CONTAIN OTHER COMPONENTS SUCH AS ORGANIC SOLVENTS, OXIDIZING AGENTS, SURFACTANTS, CORROSION INHIBITORS AND METAL COMPLEXING AGENTS.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US54897604P | 2004-03-01 | 2004-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY139624A true MY139624A (en) | 2009-10-30 |
Family
ID=45756837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20044536 MY139624A (en) | 2004-03-01 | 2004-11-02 | Stripping and cleaning compositions for microelectronics |
Country Status (2)
| Country | Link |
|---|---|
| MY (1) | MY139624A (en) |
| TW (1) | TWI354020B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150104952A1 (en) | 2013-10-11 | 2015-04-16 | Ekc Technology, Inc. | Method and composition for selectively removing metal hardmask and other residues from semiconductor device substrates comprising low-k dielectric material and copper |
| CN114908341B (en) * | 2022-07-18 | 2022-09-27 | 深圳市板明科技股份有限公司 | Special surface treating agent for PCB chemical nickel-palladium-gold plating layer and preparation method thereof |
-
2004
- 2004-11-02 MY MYPI20044536 patent/MY139624A/en unknown
- 2004-11-29 TW TW93136760A patent/TWI354020B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200536936A (en) | 2005-11-16 |
| TWI354020B (en) | 2011-12-11 |
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