MY140213A - Adhesive sheet for producing semiconductor device, semiconductor device, and manufacturing method thereof - Google Patents

Adhesive sheet for producing semiconductor device, semiconductor device, and manufacturing method thereof

Info

Publication number
MY140213A
MY140213A MYPI20044574A MYPI20044574A MY140213A MY 140213 A MY140213 A MY 140213A MY PI20044574 A MYPI20044574 A MY PI20044574A MY PI20044574 A MYPI20044574 A MY PI20044574A MY 140213 A MY140213 A MY 140213A
Authority
MY
Malaysia
Prior art keywords
semiconductor device
manufacturing
adhesive sheet
producing
base material
Prior art date
Application number
MYPI20044574A
Inventor
Takeshi Satou
Akinori Sei
Nobuhiro Hashimoto
Original Assignee
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Publication of MY140213A publication Critical patent/MY140213A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

Adhesive sheet for producing semiconductor device, semiconductor device, and manufacturing method thereof ABSTRACT OF THE DISCLOSURE An adhesive sheet (10) being strippably adhered to the lead frame or the wiring board, for manufacturing a semiconductor device of the present invention, which includes the heat-resistant base material and the adhesive layer (12) on one surface of the heat-resistant base material, wherein the adhesive layer (12) contains the then no setting resin (a) and the strippability imparting component (b). (Fig 1)
MYPI20044574A 2003-11-07 2004-11-04 Adhesive sheet for producing semiconductor device, semiconductor device, and manufacturing method thereof MY140213A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003378118A JP4319892B2 (en) 2003-11-07 2003-11-07 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
MY140213A true MY140213A (en) 2009-11-30

Family

ID=34688606

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20044574A MY140213A (en) 2003-11-07 2004-11-04 Adhesive sheet for producing semiconductor device, semiconductor device, and manufacturing method thereof

Country Status (6)

Country Link
JP (1) JP4319892B2 (en)
KR (1) KR100618640B1 (en)
CN (1) CN1300845C (en)
MY (1) MY140213A (en)
SG (1) SG150377A1 (en)
TW (1) TWI249222B (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100635053B1 (en) 2005-06-21 2006-10-16 도레이새한 주식회사 Adhesive tape for electronic parts
JP4538398B2 (en) * 2005-10-31 2010-09-08 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device
JP4505645B2 (en) * 2006-02-17 2010-07-21 フジコピアン株式会社 Affixing the fixed sheet
JP4505644B2 (en) * 2006-02-17 2010-07-21 フジコピアン株式会社 Fixed sheet
JP4505646B2 (en) * 2006-02-20 2010-07-21 フジコピアン株式会社 Fixed sheet
JP4505649B2 (en) * 2006-03-23 2010-07-21 フジコピアン株式会社 Fixed sheet
JP5067927B2 (en) * 2007-03-27 2012-11-07 日東電工株式会社 Adhesive film for semiconductor device manufacturing
KR100910672B1 (en) * 2007-08-03 2009-08-04 도레이새한 주식회사 Heat resistant adhesive sheet
KR101073698B1 (en) 2009-09-07 2011-10-14 도레이첨단소재 주식회사 Lamination method of adhesive tape and lead frame
JP2011134851A (en) * 2009-12-24 2011-07-07 Hitachi Chem Co Ltd Semiconductor device, method for manufacturing the same, wiring base material for connecting semiconductor device, wiring board for mounting semiconductor device, and method for manufacturing the same
JP2011134960A (en) * 2009-12-25 2011-07-07 Hitachi Chem Co Ltd Semiconductor device, method for manufacturing the same, wiring base material for connecting semiconductor element, wiring board for mounting semiconductor device, and method for manufacturing the same
KR20110087547A (en) * 2010-01-26 2011-08-03 도레이첨단소재 주식회사 Manufacturing Method of Semiconductor Device Using Heat-Resistant Adhesive Sheet
CN102386105B (en) * 2010-09-01 2016-02-03 群成科技股份有限公司 Four-sided flat no-pin packaging method and its fabricated structure
CN102386104B (en) * 2010-09-01 2014-11-12 群成科技股份有限公司 Quad Flat No Lead Package Method
CN104658923B (en) * 2010-09-01 2018-08-14 群成科技股份有限公司 Quad flat non-leaded package method and structure manufactured by same
TWI510155B (en) * 2011-04-26 2015-11-21 群成科技股份有限公司 Semiconductor package structure and method of manufacturing same
JP5687230B2 (en) * 2012-02-28 2015-03-18 信越化学工業株式会社 Wafer processing body, wafer processing member, wafer processing temporary adhesive, and thin wafer manufacturing method
JP5824402B2 (en) * 2012-04-02 2015-11-25 株式会社巴川製紙所 Mask sheet for manufacturing semiconductor device and method for manufacturing semiconductor device using the same
JP5925560B2 (en) * 2012-04-02 2016-05-25 株式会社巴川製紙所 Mask sheet for manufacturing semiconductor device and method for manufacturing semiconductor device using the same
KR101557841B1 (en) 2012-12-07 2015-10-06 제일모직주식회사 Anisotropic conductive film
JP6322026B2 (en) * 2014-03-31 2018-05-09 日東電工株式会社 Die bond film, die bond film with dicing sheet, semiconductor device, and method for manufacturing semiconductor device
CN105720021B (en) * 2016-01-25 2020-02-11 苏州日月新半导体有限公司 Integrated circuit package and method of manufacturing the same
JP6956492B2 (en) 2017-02-02 2021-11-02 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor devices and manufacturing method of semiconductor devices using it
CN110352472B (en) * 2017-02-28 2020-09-29 住友电木株式会社 Adhesive tape for processing semiconductor substrate and method for manufacturing semiconductor device
JP6909171B2 (en) 2018-02-12 2021-07-28 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor devices and manufacturing method of semiconductor devices using it
JP7187906B2 (en) * 2018-09-10 2022-12-13 昭和電工マテリアルズ株式会社 Semiconductor device manufacturing method
CN115003506B (en) 2020-02-20 2024-07-09 Ａｇｃ株式会社 Multilayer film and method for producing the same
JP7447647B2 (en) * 2020-04-06 2024-03-12 株式会社レゾナック Temporary protective film for semiconductor encapsulation molding and its manufacturing method, lead frame with temporary protective film, encapsulating molded body, and method for manufacturing a semiconductor package
WO2021241359A1 (en) 2020-05-26 2021-12-02 株式会社巴川製紙所 Adhesive sheet for semiconductor device production and method for producing semiconductor device using same
CN116848635A (en) 2021-02-16 2023-10-03 株式会社巴川制纸所 Adhesive sheet for semiconductor device manufacturing and method of manufacturing semiconductor device using the adhesive sheet for semiconductor device manufacturing

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093830A (en) * 2000-09-14 2002-03-29 Sony Corp Manufacturing method of chip-shaped electronic component and manufacturing method of pseudo wafer used for manufacturing the same
JP4173346B2 (en) * 2001-12-14 2008-10-29 株式会社ルネサステクノロジ Semiconductor device
US20030190466A1 (en) * 2002-04-03 2003-10-09 Katsuji Nakaba Adhesive sheet for producing semiconductor devices

Also Published As

Publication number Publication date
SG150377A1 (en) 2009-03-30
TW200522252A (en) 2005-07-01
JP4319892B2 (en) 2009-08-26
TWI249222B (en) 2006-02-11
KR100618640B1 (en) 2006-09-06
KR20050044259A (en) 2005-05-12
JP2005142401A (en) 2005-06-02
CN1300845C (en) 2007-02-14
CN1617332A (en) 2005-05-18

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