MY140439A - Adhesive sheet for semiconductor device production, semiconductor device using the same, and production method of semiconductor device - Google Patents

Adhesive sheet for semiconductor device production, semiconductor device using the same, and production method of semiconductor device

Info

Publication number
MY140439A
MY140439A MYPI20041058A MYPI20041058A MY140439A MY 140439 A MY140439 A MY 140439A MY PI20041058 A MYPI20041058 A MY PI20041058A MY PI20041058 A MYPI20041058 A MY PI20041058A MY 140439 A MY140439 A MY 140439A
Authority
MY
Malaysia
Prior art keywords
semiconductor device
production
adhesive sheet
same
adhesive
Prior art date
Application number
MYPI20041058A
Inventor
Takeshi Sato
Akinori Sei
Original Assignee
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Publication of MY140439A publication Critical patent/MY140439A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)

Abstract

THE PRESENT INVENTION DISCLOSES AN ADHESIVE SHEET (10) FOR SEMICONDUCTOR DEVICE PRODUCTION REMOVABLY ADHERABLE TO A LEAD FRAME (20) OR A WIRING BOARD, COMPRISING: A LAMINATE COMPOSED OF A HEAT-RESISTANT BASE MATERIAL AND AN ADHESIVE LAYER, AND A THERMOPLASTIC RESIN COMPONENT (B) AND A REMOVABILITY-IMPARTING COMPONENT (C) IN THE ADHESIVE LAYER. IN THE CASE THAT THE ADHESIVE SHEET IS USED TO PRODUCE SEMICONDUCTOR DEVICES SUCH AS A QFN (50), ADHESIVE RESIDUE AND PRODUCTION OF DEFECTIVE SEMICONDUCTOR DEVICES ARE PREVENTED WHILE MAINTAINING SATISFACTORY WIRING BONDING PROPERTIES AND MOLD FLASH CHARACTERISTICS IN THE CASE OF USING.
MYPI20041058A 2003-03-25 2004-03-25 Adhesive sheet for semiconductor device production, semiconductor device using the same, and production method of semiconductor device MY140439A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003083795A JP4421204B2 (en) 2003-03-25 2003-03-25 Adhesive sheet for manufacturing semiconductor device, semiconductor device using the same, and manufacturing method

Publications (1)

Publication Number Publication Date
MY140439A true MY140439A (en) 2009-12-31

Family

ID=33399169

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20041058A MY140439A (en) 2003-03-25 2004-03-25 Adhesive sheet for semiconductor device production, semiconductor device using the same, and production method of semiconductor device

Country Status (5)

Country Link
JP (1) JP4421204B2 (en)
KR (1) KR100596186B1 (en)
CN (1) CN100492586C (en)
MY (1) MY140439A (en)
TW (1) TWI313481B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4654062B2 (en) * 2005-03-30 2011-03-16 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device
JP4538398B2 (en) * 2005-10-31 2010-09-08 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device
JP4863690B2 (en) * 2005-10-31 2012-01-25 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor device, semiconductor device and manufacturing method thereof
JP4505649B2 (en) * 2006-03-23 2010-07-21 フジコピアン株式会社 Fixed sheet
JP2009158817A (en) * 2007-12-27 2009-07-16 Tomoegawa Paper Co Ltd QFN thermosetting resin composition and QFN adhesive sheet using the same
KR20110087547A (en) * 2010-01-26 2011-08-03 도레이첨단소재 주식회사 Manufacturing Method of Semiconductor Device Using Heat-Resistant Adhesive Sheet
JP5714349B2 (en) * 2011-01-31 2015-05-07 ニッタ株式会社 Easy peelable adhesive sheet and easy peelable adhesive tape
CN110734736B (en) * 2014-08-08 2022-04-19 东丽株式会社 Adhesive for temporary bonding, adhesive layer, wafer processed body, and method for manufacturing semiconductor device using same
TWI732764B (en) * 2015-06-01 2021-07-11 日商富士軟片股份有限公司 Temporary adhesive, adhesive film, adhesive support, laminate and adhesive kit
CN108922854B (en) * 2018-06-14 2020-06-05 中国电子科技集团公司第二十四研究所 A method for realizing a transient circuit packaging structure for packaging a silicon-based chip
JP7187906B2 (en) * 2018-09-10 2022-12-13 昭和電工マテリアルズ株式会社 Semiconductor device manufacturing method
WO2021131925A1 (en) * 2019-12-23 2021-07-01 日産化学株式会社 Adhesive composition, laminate and method for producing same, method for peeling laminate, and method for processing semiconductor-forming substrate

Also Published As

Publication number Publication date
KR100596186B1 (en) 2006-07-03
CN1622279A (en) 2005-06-01
HK1073178A1 (en) 2005-09-23
TWI313481B (en) 2009-08-11
TW200501208A (en) 2005-01-01
CN100492586C (en) 2009-05-27
JP4421204B2 (en) 2010-02-24
JP2004296549A (en) 2004-10-21
KR20040084680A (en) 2004-10-06

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