MY140781A - Flux for soldering, soldering method, and printed circuit board - Google Patents

Flux for soldering, soldering method, and printed circuit board

Info

Publication number
MY140781A
MY140781A MYPI20044864A MYPI20044864A MY140781A MY 140781 A MY140781 A MY 140781A MY PI20044864 A MYPI20044864 A MY PI20044864A MY PI20044864 A MYPI20044864 A MY PI20044864A MY 140781 A MY140781 A MY 140781A
Authority
MY
Malaysia
Prior art keywords
organic acid
soldering
flux
circuit board
printed circuit
Prior art date
Application number
MYPI20044864A
Inventor
Kazuki Ikeda
Hisao Irie
Toshinori Shima
Takaaki Anada
Syunsuke Ishikawa
Original Assignee
Harima Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harima Chemicals Inc filed Critical Harima Chemicals Inc
Publication of MY140781A publication Critical patent/MY140781A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A FLUX FOR SOLDERING USED WHEN SOLDERING IS PERFORMED TO A BOARD SUBJECTED TO ELECTROLESS NICKEL PLATING; THE FLUX CONTAINING RESIN HAVING FILM FORMING ABILITY, ACTIVATOR, AND SOLVENT, AND FURTHER CONTAINING METALLIC SALT OF ORGANIC ACID IN AN AMOUNT OF 0.1 TO 20% BY WEIGHT OF THE TOTAL AMOUNT OF FLUX; AND THE ACTIVATOR IS ORGANIC ACID THAT IS THE SAME AS ORGANIC ACID COMPOSING THE METALLIC SALT OF ORGANIC ACID, OR ORGANIC ACID HAVING A LOWER ACIDITY THAN THAT. THEREBY, THE STABILITY OF METAL SALT OF ORGANIC ACID CAN IMPROVE AND HIGH BONDING STRENGTH CAN BE MAINTAINED FOR A LONG PERIOD OF TIME.
MYPI20044864A 2004-08-16 2004-11-24 Flux for soldering, soldering method, and printed circuit board MY140781A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004236407A JP4213642B2 (en) 2004-08-16 2004-08-16 Soldering flux, soldering method and printed circuit board

Publications (1)

Publication Number Publication Date
MY140781A true MY140781A (en) 2010-01-15

Family

ID=36029321

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20044864A MY140781A (en) 2004-08-16 2004-11-24 Flux for soldering, soldering method, and printed circuit board

Country Status (4)

Country Link
JP (1) JP4213642B2 (en)
KR (1) KR101117884B1 (en)
CN (1) CN100571965C (en)
MY (1) MY140781A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI498184B (en) 2008-01-31 2015-09-01 Arakawa Chem Ind Solder flux and solder paste
KR101140462B1 (en) * 2010-07-02 2012-04-30 김성균 Solder Paste and Flux for Aluminum
JP5531188B2 (en) * 2012-03-12 2014-06-25 株式会社弘輝 Flux, solder composition and method for manufacturing electronic circuit mounting board
CN103817461A (en) * 2014-03-17 2014-05-28 苏州龙腾万里化工科技有限公司 Resin-core soldering flux
JP6511768B2 (en) * 2014-10-21 2019-05-15 三菱マテリアル株式会社 Method of forming solder bumps
CN104625288A (en) * 2014-12-23 2015-05-20 常熟高嘉能源科技有限公司 Solar cell welding process
CN106624463A (en) * 2016-11-30 2017-05-10 重庆微世特电子材料有限公司 Activating agent used for water-based soldering flux and preparing method of activating agent
CN106752518B (en) * 2016-12-15 2019-06-18 东莞市先飞电子材料有限公司 A kind of anti-humidity oil and preparation method thereof
JP6940963B2 (en) * 2017-03-10 2021-09-29 株式会社タムラ製作所 Flux composition and solder paste
CN109014656A (en) * 2018-08-24 2018-12-18 云南科威液态金属谷研发有限公司 A kind of halogen-free scaling powder and its preparation method and application
CN110181136B (en) * 2019-06-28 2021-08-10 吴忠仪表有限责任公司 Brazing method for butterfly piece type labyrinth valve cage installation structure
KR102591564B1 (en) * 2021-09-15 2023-10-19 엘에스이브이코리아 주식회사 Laser Soldering System
CN114434047B (en) * 2021-11-25 2023-02-28 浙江亚通新材料股份有限公司 Soldering flux for indium-based solder low-temperature welding and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN85102604B (en) * 1985-04-06 1988-08-24 福建师范大学 Resin type soft soldering flux
CN1017324B (en) * 1989-05-09 1992-07-08 化学工业部晨光化工研究院一分院 Flux assistant for tin soldering of printed circuit board
CN1042809C (en) * 1994-04-06 1999-04-07 化学工业部晨光化工研究院成都分院 Non-halogen non-rosin type low solid content non-cleaning scaling powder
JP3394703B2 (en) * 1998-03-16 2003-04-07 ハリマ化成株式会社 Flux for solder
JP3867116B2 (en) * 2002-02-15 2007-01-10 ハリマ化成株式会社 Soldering flux

Also Published As

Publication number Publication date
CN1736653A (en) 2006-02-22
JP2006051532A (en) 2006-02-23
KR20060016056A (en) 2006-02-21
JP4213642B2 (en) 2009-01-21
KR101117884B1 (en) 2012-03-07
CN100571965C (en) 2009-12-23

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