MY144117A - Flex-rigid wiring board and method of manufacturing the same - Google Patents

Flex-rigid wiring board and method of manufacturing the same

Info

Publication number
MY144117A
MY144117A MYPI20090314A MY144117A MY 144117 A MY144117 A MY 144117A MY PI20090314 A MYPI20090314 A MY PI20090314A MY 144117 A MY144117 A MY 144117A
Authority
MY
Malaysia
Prior art keywords
flex
manufacturing
insulating layer
same
wiring board
Prior art date
Application number
Inventor
Takahashi Michimasa
Aoyama Masakazu
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to MYPI20090314 priority Critical patent/MY144117A/en
Publication of MY144117A publication Critical patent/MY144117A/en

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A FLEXIBLE SUBSTRATE (112) HAVING A CONDUCTIVE PATTERN (132,133) AND A NON-FLEXIBLE BASE MATERIAL(112) HAVING RIGIDITY ARE DISPOSED ADJACENT TO EACH OTHER IN A HORIZONTAL DIRECTION. AN INSULATING LAYER (111,113) CONTAINING AN INORGANIC MATERIAL (111A, 111B, 113A, 113B) COVERS THE FLEXIBLE SUBSTRATE (13) AND THE NON-FLEXIBLE BASE MATERIAL (112) SO AS TO EXPOSE AT LEAST A PART OF THE FLEXIBLE SUBSTRATE(13). A VIA (116,141) WHICH REACHES THE CONDUCTIVE PATTERN (132,133) OF THE FLEXIBLE SUBSTRATE (13) IS FORMED IN THE INSULATING LAYER, A WIRE (117,118,142,143) EXTENDING TO THE CONDUCTIVE PATTERN (132,133) IS FORMED THROUGH THE VIA (116, 141) BY PLATING. ON THE INSULATING LAYER (111, 113), AN UPPER INSULATING LAYER (114,115,144,145) IS LAMINATED, AND A CIRCUIT (123,150) IS FORMED.
MYPI20090314 2006-10-30 2006-10-30 Flex-rigid wiring board and method of manufacturing the same MY144117A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI20090314 MY144117A (en) 2006-10-30 2006-10-30 Flex-rigid wiring board and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20090314 MY144117A (en) 2006-10-30 2006-10-30 Flex-rigid wiring board and method of manufacturing the same

Publications (1)

Publication Number Publication Date
MY144117A true MY144117A (en) 2011-08-15

Family

ID=45024009

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20090314 MY144117A (en) 2006-10-30 2006-10-30 Flex-rigid wiring board and method of manufacturing the same

Country Status (1)

Country Link
MY (1) MY144117A (en)

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