MY148191A - System and method for inspection of semiconductor packages - Google Patents

System and method for inspection of semiconductor packages

Info

Publication number
MY148191A
MY148191A MYPI20092564A MYPI20092564A MY148191A MY 148191 A MY148191 A MY 148191A MY PI20092564 A MYPI20092564 A MY PI20092564A MY PI20092564 A MYPI20092564 A MY PI20092564A MY 148191 A MY148191 A MY 148191A
Authority
MY
Malaysia
Prior art keywords
camera
semiconductor package
inspection
semiconductor packages
assembly
Prior art date
Application number
MYPI20092564A
Inventor
Amanullah Ajharali
Ge Han Cheng
Heng Lee Kwang
Albert Archwamety
Original Assignee
Semiconductor Tech & Instr Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Tech & Instr Inc filed Critical Semiconductor Tech & Instr Inc
Publication of MY148191A publication Critical patent/MY148191A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

A SYSTEM (10) AND METHOD (300) FOR INSPECTION OF SEMICONDUCTOR PACKAGES (12). THE SYSTEM COMPRISES A LIGHTING ASSEMBLY (14), A PRISM ASSEMBLY (16), A FIRST CAMERA (24) AND A SECOND CAMERA (26). THE PRISM ASSEMBLY (16) COMPRISES A NUMBER OF SURFACES. LIGHT REFLECTED OFF THE SEMICONDUCTOR PACKAGE (12) POSITIONED AT A READY POSITION ENTERS THE PRISM ASSEMBLY (16) BEFORE EXITING THEREFROM AND ENTERING INTO ONE OF THE FIRST CAMERA (24) AND THE SECOND CAMERA (26). THE FIRST CAMERA (24) AND THE SECOND CAMERA (26) HAVE DIFFERENT MAGNIFICATIONS. THE FIRST CAMERA (24) CAPTURES AN IMAGE OF A BOTTOM SURFACE AND EACH OF FOUR SIDE SURFACES OF THE SEMICONDUCTOR PACKAGE (12). THE SECOND CAMERA (26) CAPTURES AN IMAGE OF ONLY THE BOTTOM SURFACE OF THE SEMICONDUCTOR PACKAGE (12). LIGHT SUPPLIED BY THE LIGHTING ASSEMBLY (14) IS OF A PREDETERMINED SET OF PROPERTIES, WHICH ARE VARIABLE TO ENHANCE SPECIFIC DEFECT DETECTION. IMAGES CAPTURED BY THE FIRST CAMERA (24) AND THE SECOND CAMERA (26) ARE TRANSFERRED TO A CONTROLLER FOR ANALYSIS THEREBY.
MYPI20092564A 2008-06-23 2009-06-19 System and method for inspection of semiconductor packages MY148191A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200804752-4A SG157977A1 (en) 2008-06-23 2008-06-23 System and method for inspection of semiconductor packages

Publications (1)

Publication Number Publication Date
MY148191A true MY148191A (en) 2013-03-15

Family

ID=41509581

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20092564A MY148191A (en) 2008-06-23 2009-06-19 System and method for inspection of semiconductor packages

Country Status (6)

Country Link
KR (1) KR101698006B1 (en)
CN (1) CN101672802B (en)
CH (1) CH699122B1 (en)
MY (1) MY148191A (en)
SG (1) SG157977A1 (en)
TW (1) TWI499771B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102192909A (en) * 2010-03-12 2011-09-21 深圳市先阳软件技术有限公司 System for detecting laser cutting quality of battery pole piece
JP6491425B2 (en) * 2014-05-21 2019-03-27 Ｔｏｗａ株式会社 Electronic parts package side view photographing device
KR20180010492A (en) * 2016-07-21 2018-01-31 (주)제이티 Vision inspection module and device handler having the same
CN107677678A (en) * 2017-09-20 2018-02-09 广州视源电子科技股份有限公司 appearance detection method and device based on automatic path planning
CN107688029A (en) * 2017-09-20 2018-02-13 广州视源电子科技股份有限公司 Appearance detection method and device
CN109100366A (en) * 2018-08-10 2018-12-28 武汉盛为芯科技有限公司 The detection system and method for semiconductor laser chip end face appearance
CN110806410A (en) * 2019-12-09 2020-02-18 泉州师范学院 Optical device and method for simultaneously detecting top surface and side surface of semiconductor crystal grain
KR102350544B1 (en) * 2020-10-14 2022-01-17 주식회사 지엠지 Optical module for semiconductor packaging inspection process
JP2025526048A (en) * 2022-12-12 2025-08-07 エルジー エナジー ソリューション リミテッド Battery Inspection Equipment
CN119138818A (en) * 2023-06-14 2024-12-17 杭州微新医疗科技有限公司 Inspection device and endoscopic equipment
CN118058689A (en) * 2023-06-14 2024-05-24 杭州微新医疗科技有限公司 Endoscopic examination apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1273224A (en) * 1985-03-14 1990-08-28 Timothy R. Pryor Panel surface flaw inspection
DE3712513A1 (en) * 1987-04-13 1988-11-03 Roth Electric Gmbh METHOD AND DEVICE FOR DETECTING SURFACE DEFECTS
IL99823A0 (en) * 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
US6567161B1 (en) * 2000-11-28 2003-05-20 Asti Holdings Limited Three dimensional lead inspection system
DE10122917A1 (en) * 2001-05-11 2002-11-14 Byk Gardner Gmbh Device and method for determining the properties of reflective bodies
US20030086083A1 (en) * 2001-11-01 2003-05-08 Martin Ebert Optical metrology tool with dual camera path for simultaneous high and low magnification imaging
JP3789097B2 (en) * 2002-02-21 2006-06-21 光洋機械工業株式会社 Peripheral inspection method and peripheral inspection apparatus for inspection object
US6809808B2 (en) * 2002-03-22 2004-10-26 Applied Materials, Inc. Wafer defect detection system with traveling lens multi-beam scanner
US7315364B2 (en) * 2004-10-25 2008-01-01 Applied Materials, Israel, Ltd. System for inspecting a surface employing configurable multi angle illumination modes

Also Published As

Publication number Publication date
TW201005285A (en) 2010-02-01
SG157977A1 (en) 2010-01-29
CN101672802B (en) 2014-07-16
KR20090133097A (en) 2009-12-31
KR101698006B1 (en) 2017-02-01
TWI499771B (en) 2015-09-11
CN101672802A (en) 2010-03-17
CH699122B1 (en) 2015-05-15
CH699122A2 (en) 2010-01-15

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