MY152017A - Photosensitive resin composition, photosensitive element wherein same is used, method for forming a resist-pattern, and method for producing a printed wiring board - Google Patents

Photosensitive resin composition, photosensitive element wherein same is used, method for forming a resist-pattern, and method for producing a printed wiring board

Info

Publication number
MY152017A
MY152017A MYPI20106007A MY152017A MY 152017 A MY152017 A MY 152017A MY PI20106007 A MYPI20106007 A MY PI20106007A MY 152017 A MY152017 A MY 152017A
Authority
MY
Malaysia
Prior art keywords
resin composition
resist
pattern
producing
forming
Prior art date
Application number
Inventor
Iso Junichi
Ajioka Yoshiki
Ishi Mitsuru
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of MY152017A publication Critical patent/MY152017A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H10P76/2042—Photolithographic processes using lasers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A PHOTOSENSITIVE RESIN COMPOSITION CONTAINING (A) A BINDER POLYMER, (B) A PHOTOPOLYMERIZABLE COMPOUND HAVING AT LEAST ONE ETHYLENIC UNSATURATED BOND, AND (C) A PHOTOPOLYMERIZATION INITIATOR, WHEREIN THE ABOVE (C) PHOTOPOLYMERIZATION INITIATOR COMPRISES A COMPOUND REPRESENTED BY FORMULA (I) AND A COMPOUND REPRESENTED BY FORMULA (II):
MYPI20106007 2008-06-18 2009-06-16 Photosensitive resin composition, photosensitive element wherein same is used, method for forming a resist-pattern, and method for producing a printed wiring board MY152017A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008159062 2008-06-18

Publications (1)

Publication Number Publication Date
MY152017A true MY152017A (en) 2014-08-15

Family

ID=41434110

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20106007 MY152017A (en) 2008-06-18 2009-06-16 Photosensitive resin composition, photosensitive element wherein same is used, method for forming a resist-pattern, and method for producing a printed wiring board

Country Status (6)

Country Link
JP (1) JP4645776B2 (en)
KR (1) KR101040475B1 (en)
CN (2) CN103064250A (en)
MY (1) MY152017A (en)
TW (1) TW201007360A (en)
WO (1) WO2009154194A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102341753B (en) * 2009-03-13 2013-08-07 日立化成株式会社 Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same
KR101775206B1 (en) * 2010-03-19 2017-09-05 히타치가세이가부시끼가이샤 Photosensitive resin composition and photosensitive element using same, resist pattern formation method and printed circuit board manufacturing method
CN102375335B (en) * 2010-08-10 2015-04-15 日立化成工业株式会社 Manufacturing method of resin composition, photosensitive element, resist pattern and circuit board
CN103076719B (en) * 2011-10-26 2019-08-09 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
CN103064253B (en) * 2012-12-05 2015-04-08 北京化工大学常州先进材料研究院 Photosensitive composition containing acridine oxide
KR101708343B1 (en) * 2013-12-27 2017-02-20 코오롱인더스트리 주식회사 Photosensitive resin composition for dry film photoresist
TW201546547A (en) * 2014-05-13 2015-12-16 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed circuit board
WO2016184429A1 (en) * 2015-05-21 2016-11-24 常州强力先端电子材料有限公司 Pyrazoline sensitizer and preparation method and use thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3843204A1 (en) * 1988-12-22 1990-06-28 Hoechst Ag PHOTOPOLYMERIZABLE MIXTURE AND CONTAINING PHOTOPOLYMERISABLE RECORDING MATERIAL
US5217845A (en) * 1988-12-22 1993-06-08 Hoechst Aktiengesellschaft Photopolymerizable mixture and photopolymerizable copying material containing same
US6010824A (en) * 1992-11-10 2000-01-04 Tokyo Ohka Kogyo Co., Ltd. Photosensitive resin composition containing a triazine compound and a pre-sensitized plate using the same, and photosensitive resin composition containing acridine and triazine compounds and a color filter and a pre-sensitized plate using the same
US5952153A (en) * 1997-12-01 1999-09-14 Morton International, Inc. Photoimageable composition having improved flexibility, adhesion and stripping characteristics
JP4524844B2 (en) 2000-03-23 2010-08-18 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, resist pattern manufacturing method, and printed wiring board manufacturing method
JPWO2002025377A1 (en) * 2000-09-20 2004-01-29 日立化成工業株式会社 Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
TWI296738B (en) * 2001-03-29 2008-05-11 Hitachi Chemical Co Ltd
JP4519356B2 (en) * 2001-04-26 2010-08-04 旭化成イーマテリアルズ株式会社 Photosensitive resin laminate
JP4315892B2 (en) * 2004-11-25 2009-08-19 東京応化工業株式会社 Photosensitive resin composition and photosensitive dry film using the same
WO2007010614A1 (en) * 2005-07-22 2007-01-25 Asahi Kasei Emd Corporation Photosensitive resin composition and laminates
JP4761909B2 (en) * 2005-10-05 2011-08-31 旭化成イーマテリアルズ株式会社 Photosensitive resin composition and laminate
JP5050707B2 (en) * 2006-10-18 2012-10-17 日立化成工業株式会社 Photosensitive resin composition and photosensitive film
JP5252963B2 (en) * 2007-04-17 2013-07-31 旭化成イーマテリアルズ株式会社 Photosensitive resin composition and laminate

Also Published As

Publication number Publication date
TW201007360A (en) 2010-02-16
JPWO2009154194A1 (en) 2011-12-01
JP4645776B2 (en) 2011-03-09
KR101040475B1 (en) 2011-06-09
TWI369584B (en) 2012-08-01
CN102067037B (en) 2013-07-24
WO2009154194A1 (en) 2009-12-23
CN103064250A (en) 2013-04-24
CN102067037A (en) 2011-05-18
KR20110005914A (en) 2011-01-19

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