MY179988A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
MY179988A
MY179988A MYUI2013002162A MYUI2013002162A MY179988A MY 179988 A MY179988 A MY 179988A MY UI2013002162 A MYUI2013002162 A MY UI2013002162A MY UI2013002162 A MYUI2013002162 A MY UI2013002162A MY 179988 A MY179988 A MY 179988A
Authority
MY
Malaysia
Prior art keywords
resin composition
photosensitive resin
compound
general formula
photopolymerization initiator
Prior art date
Application number
MYUI2013002162A
Inventor
Kunimatsu Shinichi
Tsutsui Yamato
Naito Kazuya
Original Assignee
Asahi Kasei E Mat Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Mat Corporation filed Critical Asahi Kasei E Mat Corporation
Publication of MY179988A publication Critical patent/MY179988A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Graft Or Block Polymers (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

A photosensitive resin composition which comprises (A) an alkali-soluble polymer, (B) a photopolymerization initiator, and (C) a compound having an ethylenically unsaturated double bond, wherein the photopolymerization initiator (B) is a 2,4,5-triarylimidazole dimer or an acridine compound, while a compound represented by general formula (I) is contained as the compound (C).In general formula (I), R1 , R2 , A, B, n1 , n2 and n3 are each as defined in the description. The photosensitive resin composition is excellently and stably dispersible in a developer to minimize the generation of an aggregate. Further, the resin composition exhibits proper developability and can provide a flexible cured resist with good etching resistance
MYUI2013002162A 2010-12-24 2011-11-28 Photosensitive resin composition MY179988A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010288105 2010-12-24
PCT/JP2011/077415 WO2012086371A1 (en) 2010-12-24 2011-11-28 Photosensitive resin composition

Publications (1)

Publication Number Publication Date
MY179988A true MY179988A (en) 2020-11-19

Family

ID=46313653

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2013002162A MY179988A (en) 2010-12-24 2011-11-28 Photosensitive resin composition

Country Status (6)

Country Link
JP (2) JP5707420B2 (en)
KR (3) KR20130098406A (en)
CN (1) CN103282829B (en)
MY (1) MY179988A (en)
TW (1) TWI530757B (en)
WO (1) WO2012086371A1 (en)

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JP6063200B2 (en) * 2012-10-15 2017-01-18 旭化成株式会社 Photosensitive resin composition
KR101675822B1 (en) * 2013-08-07 2016-11-15 코오롱인더스트리 주식회사 Photosensitive Resin Composition for Dry Film Photoresist
JP6207943B2 (en) * 2013-09-19 2017-10-04 旭化成株式会社 Photosensitive resin composition and photosensitive resin laminate
JP6486672B2 (en) * 2013-12-20 2019-03-20 旭化成株式会社 Photosensitive element and manufacturing method thereof
JP2015152854A (en) * 2014-02-18 2015-08-24 旭化成イーマテリアルズ株式会社 Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern
CN106462066A (en) * 2014-05-13 2017-02-22 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and process for producing printed wiring board
WO2015174468A1 (en) * 2014-05-13 2015-11-19 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and process for producing printed wiring board
JP6318260B2 (en) * 2014-09-24 2018-04-25 旭化成株式会社 Photosensitive resin laminate, resin pattern manufacturing method, cured film manufacturing method, and display device manufacturing method
TWI561920B (en) * 2014-12-22 2016-12-11 Chi Mei Corp Photosensitive polysiloxane composition, protecting film, and element having the protecting film
JP6584105B2 (en) * 2015-03-19 2019-10-02 株式会社日立製作所 Microbe-immobilized carrier and method for producing microorganism-immobilized carrier
JPWO2016163540A1 (en) * 2015-04-08 2017-11-02 旭化成株式会社 Photosensitive resin composition
JP2017003966A (en) * 2015-06-12 2017-01-05 Jsr株式会社 Photosensitive composition and method for manufacturing plated molded article
WO2017043544A1 (en) * 2015-09-11 2017-03-16 旭化成株式会社 Photosensitive resin composition
WO2017069262A1 (en) * 2015-10-21 2017-04-27 日産化学工業株式会社 Composition for forming optical waveguide
JP6567952B2 (en) * 2015-10-26 2019-08-28 旭化成株式会社 Photosensitive resin composition, photosensitive resin laminate, and resist pattern forming method
JP6809873B2 (en) * 2015-12-28 2021-01-06 旭化成株式会社 Laminate
KR102792073B1 (en) * 2016-12-29 2025-04-08 주식회사 동진쎄미켐 Negative photosensitive resin composition
TWI664497B (en) * 2017-01-30 2019-07-01 日商旭化成股份有限公司 Photosensitive resin composition, photosensitive resin laminated body, substrate on which photoresist pattern is formed, and method for manufacturing circuit board
JP7088838B2 (en) * 2017-08-18 2022-06-21 積水化学工業株式会社 Moisture-curable resin compositions, adhesives for electronic components, and adhesives for display elements
JP7162448B2 (en) * 2018-05-29 2022-10-28 旭化成株式会社 Photosensitive resin composition, transfer film using photosensitive resin composition, method for producing resin pattern, and method for producing cured film pattern
TWI770578B (en) * 2019-08-06 2022-07-11 日商旭化成股份有限公司 Photosensitive resin composition, and photosensitive element
KR102730592B1 (en) * 2019-09-13 2024-11-14 아사히 가세이 가부시키가이샤 Photosensitive resin composition and photosensitive element
US12353130B2 (en) 2019-11-11 2025-07-08 Asahi Kasei Kabushiki Kaisha Photosensitive resin composition and photosensitive resin multilayer body
JP7769468B2 (en) * 2019-12-13 2025-11-13 旭化成株式会社 Photosensitive resin composition, transfer film using photosensitive resin composition
CN115485621B (en) * 2020-04-28 2026-02-03 富士胶片株式会社 Photosensitive transfer material, method for producing resin pattern, method for producing circuit wiring, and method for producing touch panel
TWI830425B (en) * 2021-10-25 2024-01-21 日商旭化成股份有限公司 Photosensitive element and method for forming photoresist pattern

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Also Published As

Publication number Publication date
KR102019580B1 (en) 2019-09-06
JP2015096960A (en) 2015-05-21
KR20170120190A (en) 2017-10-30
WO2012086371A1 (en) 2012-06-28
TW201232173A (en) 2012-08-01
CN103282829A (en) 2013-09-04
JP5707420B2 (en) 2015-04-30
TWI530757B (en) 2016-04-21
JPWO2012086371A1 (en) 2014-05-22
CN103282829B (en) 2016-08-17
KR20150017384A (en) 2015-02-16
KR20130098406A (en) 2013-09-04

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