MY153546A - Entry sheet for drilling - Google Patents

Entry sheet for drilling

Info

Publication number: MY153546A
Authority: MY; Malaysia
Prior art keywords: water soluble; weight; parts; resin; drilling
Prior art date: 2009-06-01

Application number

MYPI2011005808A

Other languages

English (en)

Inventor

Matsuyama Yousuke

Shimizu Ken-Ichi

Ihara Katsutoshi

Original Assignee

Mitsubishi Gas Chemical Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-06-01

Filing date

2010-05-28

Publication date

2015-02-27

2010-05-28 Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co

2015-02-27 Publication of MY153546A publication Critical patent/MY153546A/en

Links

238000005553 drilling Methods 0.000 title 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 8
239000011347 resin Substances 0.000 abstract 6
229920005989 resin Polymers 0.000 abstract 6
-1 AMINO ACID DERIVATIVE ALCOHOLS Chemical class 0.000 abstract 2
239000002202 Polyethylene glycol Substances 0.000 abstract 2
239000011888 foil Substances 0.000 abstract 2
239000000314 lubricant Substances 0.000 abstract 2
239000002184 metal Substances 0.000 abstract 2
229920001223 polyethylene glycol Polymers 0.000 abstract 2
239000011342 resin composition Substances 0.000 abstract 2
239000000203 mixture Substances 0.000 abstract 1
150000007524 organic acids Chemical class 0.000 abstract 1
235000005985 organic acids Nutrition 0.000 abstract 1
239000000126 substance Substances 0.000 abstract 1
150000005846 sugar alcohols Polymers 0.000 abstract 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
- B26D7/088—Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/127—Lubricants, e.g. during drilling of holes

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Life Sciences & Earth Sciences (AREA)
Forests & Forestry (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Compositions Of Macromolecular Compounds (AREA)
Lubricants (AREA)
Laminated Bodies (AREA)

MYPI2011005808A 2009-06-01 2010-05-28 Entry sheet for drilling MY153546A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2009132367		2009-06-01

Publications (1)

Publication Number	Publication Date
MY153546A true MY153546A (en)	2015-02-27

Family

ID=43297476

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
MYPI2011005808A MY153546A (en)	2009-06-01	2010-05-28	Entry sheet for drilling

Country Status (8)

Country	Link
JP (1)	JP4798308B2 (pt)
KR (1)	KR101153259B1 (pt)
CN (1)	CN102458783B (pt)
BR (1)	BRPI1011865A2 (pt)
MY (1)	MY153546A (pt)
RU (1)	RU2534178C2 (pt)
TW (1)	TWI503191B (pt)
WO (1)	WO2010140333A1 (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2012091179A1 (ja) *	2010-12-28	2012-07-05	三菱瓦斯化学株式会社	ドリル孔あけ用エントリーシート
RU2540075C1 (ru) *	2011-01-07	2015-01-27	Мицубиси Гэс Кемикал Компани, Инк.	Трафарет для высверливания отверстий
MY168641A (en) *	2012-03-21	2018-11-26	Mitsubishi Gas Chemical Co	Entry sheet for drilling and process for producing the same and drilling method
US10159153B2 (en)	2012-03-27	2018-12-18	Mitsubishi Gas Chemical Company, Inc.	Entry sheet for drilling
US10674609B2 (en)	2014-03-31	2020-06-02	Mitsubishi Gas Chemical Company, Inc.	Entry sheet for drilling
CN103937387B (zh) *	2014-04-22	2016-06-29	深圳市柳鑫实业股份有限公司	一种pcb钻孔用覆膜铝基盖板及其制备方法
CN105583889A (zh) *	2014-10-22	2016-05-18	合正科技股份有限公司	钻孔用盖板
SG11201707185PA (en) *	2015-03-19	2017-10-30	Mitsubishi Gas Chemical Co	Entry sheet for drilling and method for drilling processing using same
US10486324B2 (en)	2015-03-19	2019-11-26	Mitsubishi Gas Chemical Company, Inc.	Entry sheet for drilling and method for drilling processing using same
WO2017155060A1 (ja) *	2016-03-11	2017-09-14	三菱瓦斯化学株式会社	ドリル孔あけ用エントリーシート及びそれを用いたドリル孔あけ加工方法
WO2018221440A1 (ja) *	2017-06-01	2018-12-06	三菱瓦斯化学株式会社	微細径用ドリル孔あけ用エントリーシート、及びそれを用いたドリル孔あけ加工方法
CN109913105A (zh) *	2019-01-14	2019-06-21	广东中晨电子科技有限公司	一种具有水溶性涂层的铝盖板
CN110281308A (zh) *	2019-06-28	2019-09-27	烟台柳鑫新材料科技有限公司	一种pcb钻孔用涂胶铝基盖板及其制备方法
CN112662314B (zh) *	2020-12-10	2022-08-23	深圳市柳鑫实业股份有限公司	一种环保型pcb钻孔用盖板及其制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO1988003743A1 (en) *	1986-11-13	1988-05-19	Johnston James A	Method and apparatus for manufacturing printed circuit boards
JP2855824B2 (ja) *	1990-08-08	1999-02-10	三菱瓦斯化学株式会社	プリント配線板の孔明け加工法
JP4543243B2 (ja) *	1999-06-01	2010-09-15	昭和電工パッケージング株式会社	小径孔あけ加工用あて板および小径孔あけ加工方法
JP4201462B2 (ja) *	2000-06-05	2008-12-24	利昌工業株式会社	ドリル加工用エントリーボード
JP4968652B2 (ja) *	2001-07-17	2012-07-04	日本合成化学工業株式会社	プリント配線基板穿孔用水分散性樹脂組成物、該組成物よりなるシート及びかかるシートを用いたプリント配線基板の穿孔方法
JP2003225892A (ja) *	2002-02-05	2003-08-12	Mitsubishi Gas Chem Co Inc	ドリル孔明け方法
JP2004017190A (ja) *	2002-06-13	2004-01-22	Kobe Steel Ltd	プリント配線基板の穴あけ加工に使用する樹脂被覆金属板
US20050003169A1 (en) *	2003-01-28	2005-01-06	Nobuyuki Ikeguchi	Lubricant sheet for drilling and method of drilling
TWI306369B (en) *	2003-01-28	2009-02-11	Mitsubishi Gas Chemical Co	Lubricant sheet for drilling and method of drilling
JP4541132B2 (ja) *	2004-12-27	2010-09-08	昭和電工パッケージング株式会社	小口径孔あけ加工用エントリーボードと小口径孔あけ加工方法
CN100531517C (zh) *	2005-07-25	2009-08-19	合正科技股份有限公司	一种钻孔用高散热润滑铝质盖板
JP5011823B2 (ja) *	2006-05-30	2012-08-29	三菱瓦斯化学株式会社	ドリル孔明け用エントリーシートの製造方法
KR20080055264A (ko) *	2006-12-15	2008-06-19	홍부진	천공 가공용 쉬트
JP5198809B2 (ja) *	2007-07-12	2013-05-15	三菱瓦斯化学株式会社	ドリル穴明け用エントリーシート
KR100879284B1 (ko) *	2008-02-12	2009-01-16	(주)상아프론테크	인쇄회로기판 천공용 윤활시트 및 상기 윤활시트 형성용조성물
CN102119074B (zh) *	2008-06-10	2015-07-15	三菱瓦斯化学株式会社	钻孔用盖板

2010
- 2010-05-28 JP JP2010541366A patent/JP4798308B2/ja not_active Expired - Fee Related
- 2010-05-28 MY MYPI2011005808A patent/MY153546A/en unknown
- 2010-05-28 WO PCT/JP2010/003621 patent/WO2010140333A1/ja not_active Ceased
- 2010-05-28 KR KR1020117028855A patent/KR101153259B1/ko not_active Expired - Fee Related
- 2010-05-28 RU RU2011148789/02A patent/RU2534178C2/ru active
- 2010-05-28 CN CN2010800342390A patent/CN102458783B/zh not_active Expired - Fee Related
- 2010-05-28 BR BRPI1011865A patent/BRPI1011865A2/pt not_active Application Discontinuation
- 2010-06-01 TW TW099117578A patent/TWI503191B/zh not_active IP Right Cessation

Also Published As

Publication number	Publication date
RU2534178C2 (ru)	2014-11-27
RU2011148789A (ru)	2013-07-20
TWI503191B (zh)	2015-10-11
KR101153259B1 (ko)	2012-06-07
CN102458783B (zh)	2013-07-24
BRPI1011865A2 (pt)	2019-05-14
WO2010140333A1 (ja)	2010-12-09
JPWO2010140333A1 (ja)	2012-11-15
CN102458783A (zh)	2012-05-16
JP4798308B2 (ja)	2011-10-19
KR20120008533A (ko)	2012-01-30
TW201043362A (en)	2010-12-16

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