MY161519A - Pre-heating system for silicon dies - Google Patents

Pre-heating system for silicon dies

Info

Publication number
MY161519A
MY161519A MYPI2010003042A MYPI2010003042A MY161519A MY 161519 A MY161519 A MY 161519A MY PI2010003042 A MYPI2010003042 A MY PI2010003042A MY PI2010003042 A MYPI2010003042 A MY PI2010003042A MY 161519 A MY161519 A MY 161519A
Authority
MY
Malaysia
Prior art keywords
dies
heaters
heating system
desired temperature
silicon dies
Prior art date
Application number
MYPI2010003042A
Other languages
English (en)
Inventor
Amlan Sen
Chin Guan Khaw
Original Assignee
Orion Systems Integrated Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orion Systems Integrated Pte Ltd filed Critical Orion Systems Integrated Pte Ltd
Publication of MY161519A publication Critical patent/MY161519A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
MYPI2010003042A 2007-12-27 2007-12-27 Pre-heating system for silicon dies MY161519A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2007/000441 WO2009085009A1 (fr) 2007-12-27 2007-12-27 Système et procédé de préchauffage pour puces au silicium

Publications (1)

Publication Number Publication Date
MY161519A true MY161519A (en) 2017-04-28

Family

ID=40824560

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010003042A MY161519A (en) 2007-12-27 2007-12-27 Pre-heating system for silicon dies

Country Status (5)

Country Link
CN (1) CN101933411B (fr)
MY (1) MY161519A (fr)
PH (1) PH12010501459A1 (fr)
TW (1) TWI451508B (fr)
WO (1) WO2009085009A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11069555B2 (en) * 2018-09-03 2021-07-20 Assembleon B.V. Die attach systems, and methods of attaching a die to a substrate
CN110211899A (zh) * 2019-05-09 2019-09-06 四川九州光电子技术有限公司 一种芯片预热及焊接系统
CN110116287B (zh) * 2019-05-09 2024-08-13 深圳九州光电子技术有限公司 芯片上料焊接系统
CN110170720A (zh) * 2019-05-31 2019-08-27 广东瑞谷光网通信股份有限公司 一种定位加热台
CN111524842A (zh) * 2020-07-06 2020-08-11 宁波润华全芯微电子设备有限公司 一种渐进式烘烤加热装置
CN117594496B (zh) * 2024-01-11 2024-04-09 安徽众合半导体科技有限公司 一种半导体引线框架移动预热机构及预热方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1021877C (zh) * 1988-07-21 1993-08-18 日本电热计器株式会社 焊接装置
US5259545A (en) * 1991-12-20 1993-11-09 Vlsi Technology, Inc. Apparatus for bonding a semiconductor die to a package using a gold/silicon preform and cooling the die and package through a monotonically decreasing temperature sequence
US6110805A (en) * 1997-12-19 2000-08-29 Micron Technology, Inc. Method and apparatus for attaching a workpiece to a workpiece support
US6911624B2 (en) * 2002-08-23 2005-06-28 Micron Technology, Inc. Component installation, removal, and replacement apparatus and method

Also Published As

Publication number Publication date
TW200939373A (en) 2009-09-16
CN101933411B (zh) 2012-11-21
CN101933411A (zh) 2010-12-29
WO2009085009A1 (fr) 2009-07-09
PH12010501459A1 (en) 2015-04-27
TWI451508B (zh) 2014-09-01

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