TWI451508B - 用於矽晶粒的預加熱系統及方法 - Google Patents

用於矽晶粒的預加熱系統及方法 Download PDF

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Publication number
TWI451508B
TWI451508B TW097145880A TW97145880A TWI451508B TW I451508 B TWI451508 B TW I451508B TW 097145880 A TW097145880 A TW 097145880A TW 97145880 A TW97145880 A TW 97145880A TW I451508 B TWI451508 B TW I451508B
Authority
TW
Taiwan
Prior art keywords
die
preheaters
temperature
grains
bonding
Prior art date
Application number
TW097145880A
Other languages
English (en)
Chinese (zh)
Other versions
TW200939373A (en
Inventor
阿木嵐 森
許振源
Original Assignee
豪銳恩科技私人有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 豪銳恩科技私人有限公司 filed Critical 豪銳恩科技私人有限公司
Publication of TW200939373A publication Critical patent/TW200939373A/zh
Application granted granted Critical
Publication of TWI451508B publication Critical patent/TWI451508B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW097145880A 2007-12-27 2008-11-27 用於矽晶粒的預加熱系統及方法 TWI451508B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2007/000441 WO2009085009A1 (fr) 2007-12-27 2007-12-27 Système et procédé de préchauffage pour puces au silicium

Publications (2)

Publication Number Publication Date
TW200939373A TW200939373A (en) 2009-09-16
TWI451508B true TWI451508B (zh) 2014-09-01

Family

ID=40824560

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097145880A TWI451508B (zh) 2007-12-27 2008-11-27 用於矽晶粒的預加熱系統及方法

Country Status (5)

Country Link
CN (1) CN101933411B (fr)
MY (1) MY161519A (fr)
PH (1) PH12010501459A1 (fr)
TW (1) TWI451508B (fr)
WO (1) WO2009085009A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11069555B2 (en) * 2018-09-03 2021-07-20 Assembleon B.V. Die attach systems, and methods of attaching a die to a substrate
CN110211899A (zh) * 2019-05-09 2019-09-06 四川九州光电子技术有限公司 一种芯片预热及焊接系统
CN110116287B (zh) * 2019-05-09 2024-08-13 深圳九州光电子技术有限公司 芯片上料焊接系统
CN110170720A (zh) * 2019-05-31 2019-08-27 广东瑞谷光网通信股份有限公司 一种定位加热台
CN111524842A (zh) * 2020-07-06 2020-08-11 宁波润华全芯微电子设备有限公司 一种渐进式烘烤加热装置
CN117594496B (zh) * 2024-01-11 2024-04-09 安徽众合半导体科技有限公司 一种半导体引线框架移动预热机构及预热方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030178475A1 (en) * 1997-12-19 2003-09-25 Ed Schrock Method and apparatus for attaching a workpiece to a workpiece support

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1021877C (zh) * 1988-07-21 1993-08-18 日本电热计器株式会社 焊接装置
US5259545A (en) * 1991-12-20 1993-11-09 Vlsi Technology, Inc. Apparatus for bonding a semiconductor die to a package using a gold/silicon preform and cooling the die and package through a monotonically decreasing temperature sequence
US6911624B2 (en) * 2002-08-23 2005-06-28 Micron Technology, Inc. Component installation, removal, and replacement apparatus and method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030178475A1 (en) * 1997-12-19 2003-09-25 Ed Schrock Method and apparatus for attaching a workpiece to a workpiece support

Also Published As

Publication number Publication date
TW200939373A (en) 2009-09-16
CN101933411B (zh) 2012-11-21
CN101933411A (zh) 2010-12-29
MY161519A (en) 2017-04-28
WO2009085009A1 (fr) 2009-07-09
PH12010501459A1 (en) 2015-04-27

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