MY164922A - Method of thermocompression bonding of laser-etched copper pads to cob module - Google Patents

Method of thermocompression bonding of laser-etched copper pads to cob module

Info

Publication number
MY164922A
MY164922A MYPI2011002669A MYPI2011002669A MY164922A MY 164922 A MY164922 A MY 164922A MY PI2011002669 A MYPI2011002669 A MY PI2011002669A MY PI2011002669 A MYPI2011002669 A MY PI2011002669A MY 164922 A MY164922 A MY 164922A
Authority
MY
Malaysia
Prior art keywords
thermocompression bonding
laser
copper pads
etched copper
cob module
Prior art date
Application number
MYPI2011002669A
Other languages
English (en)
Inventor
Pooi Nguon Lim
Bin Mohd Daud Noordazlee
Original Assignee
Iris Corp Berhad
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iris Corp Berhad filed Critical Iris Corp Berhad
Priority to MYPI2011002669A priority Critical patent/MY164922A/en
Priority to PCT/MY2012/000116 priority patent/WO2012169873A2/fr
Priority to TW101120726A priority patent/TW201316865A/zh
Publication of MY164922A publication Critical patent/MY164922A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
  • Details Of Aerials (AREA)
MYPI2011002669A 2011-06-10 2011-06-10 Method of thermocompression bonding of laser-etched copper pads to cob module MY164922A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
MYPI2011002669A MY164922A (en) 2011-06-10 2011-06-10 Method of thermocompression bonding of laser-etched copper pads to cob module
PCT/MY2012/000116 WO2012169873A2 (fr) 2011-06-10 2012-06-08 Procédé de soudure par thermocompression de plages en cuivre gravées par laser à un module cob
TW101120726A TW201316865A (zh) 2011-06-10 2012-06-08 熱壓接合雷射蝕刻銅墊至板上連接式晶片模組之方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2011002669A MY164922A (en) 2011-06-10 2011-06-10 Method of thermocompression bonding of laser-etched copper pads to cob module

Publications (1)

Publication Number Publication Date
MY164922A true MY164922A (en) 2018-02-15

Family

ID=47296656

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011002669A MY164922A (en) 2011-06-10 2011-06-10 Method of thermocompression bonding of laser-etched copper pads to cob module

Country Status (3)

Country Link
MY (1) MY164922A (fr)
TW (1) TW201316865A (fr)
WO (1) WO2012169873A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025262574A1 (fr) * 2024-06-19 2025-12-26 Avery Dennison Retail Information Services Llc Procédé de fabrication de dispositifs rfid

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1544787A1 (fr) * 2003-12-19 2005-06-22 Axalto SA Carte sans contact avec un interrupteur d'antenne
CN101160597A (zh) * 2005-04-18 2008-04-09 哈里斯股份有限公司 电子零件及该电子零件的制造方法
US7980477B2 (en) * 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
CN101971194A (zh) * 2007-12-19 2011-02-09 谢玉莲 非接触式和双界面嵌体及其生产方法
DE102008037817B4 (de) * 2008-08-14 2019-09-05 Infineon Technologies Ag Transponderinlay für ein Dokument zur Personenidentifikation und ein Verfahren zur Herstellung eines Transponderinlays

Also Published As

Publication number Publication date
WO2012169873A2 (fr) 2012-12-13
WO2012169873A3 (fr) 2013-04-04
TW201316865A (zh) 2013-04-16

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