WO2012169873A2 - Procédé de soudure par thermocompression de plages en cuivre gravées par laser à un module cob - Google Patents

Procédé de soudure par thermocompression de plages en cuivre gravées par laser à un module cob Download PDF

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Publication number
WO2012169873A2
WO2012169873A2 PCT/MY2012/000116 MY2012000116W WO2012169873A2 WO 2012169873 A2 WO2012169873 A2 WO 2012169873A2 MY 2012000116 W MY2012000116 W MY 2012000116W WO 2012169873 A2 WO2012169873 A2 WO 2012169873A2
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
board
terminal pads
lead frame
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/MY2012/000116
Other languages
English (en)
Other versions
WO2012169873A3 (fr
Inventor
Pooi Nguon LIM
Noordazlee Bin MOHD DAUD
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iris Corp Bhd
Original Assignee
Iris Corp Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iris Corp Bhd filed Critical Iris Corp Bhd
Publication of WO2012169873A2 publication Critical patent/WO2012169873A2/fr
Publication of WO2012169873A3 publication Critical patent/WO2012169873A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer

Definitions

  • the present invention relates to method of chip-on-board (COB) module bonding.
  • COB chip-on-board
  • the present invention relates to method of thermocompression bonding, which affects a direct bonding of copper antenna, which terminal pads are laser-etched within predefined window area, to COB module.
  • Radio-frequency identification has incredibly been used in wide range of applications, which includes identification and tracking of objects, such as persons, products, and animals.
  • RFID which comes in many different forms arid shapes like tag, board or card, communicates with a reader via electromagnetic waves.
  • RFID comprises a chip-on-board (COB) module for storing and processing data, and a coil antenna for radio-frequency communication purpose.
  • COB chip-on-board
  • US Patent Publication no. 2007/0193021 discloses a method for manufacturing RFID Tag.
  • the RFID tag comprises an antenna, an integrated circuit (IC) chip, and gold bumps wherein gold bumps are used as intermediate material to bond the antenna to the IC chip by means of heating and pressing.
  • the gold bumps are provided on the surface of the IC chip.
  • US Patent Publication No. 2007/0158804 discloses another method for manufacturing RFID Tag.
  • the method uses an anisotropic conductive paste or film, to serve as intermediate binder layer between IC chip and antenna in RFID Tag.
  • the anisotropic conductive paste or film contains either nickel or gold.
  • the IC chip is then pressure-bonded to the antenna.
  • an RFID board comprising a chip-on-board module having a lead frame and an antenna having terminals in a form of pads, wherein the terminal pads of the antenna are bonded to the lead frame of the chip-on-board module via thermocompression bonding, without the use of any intermediate electrically conductive materials.
  • the antenna and the lead frame of the chip on board module are made of any electrically conducted metals/alloys having similar melting points.
  • the antenna is made of copper and the lead frame of the chip-on-board module is made of copper alloy with silver plating
  • the antenna of the RFID board is a single-sided copper substrate antenna.
  • the antenna of the RFID board is a double-sided copper substrate antenna.
  • a bareback area is then defined underneath the terminal pads to expose the terminal pads plainly without any substrate or adhesive materials.
  • a method for fabricating RFID board via thermocompression bonding comprises providing an antenna with terminal pads, aligning the antenna with a chip-on board (COB) module, wherein lead frame of the COB module is positioned within terminal pads of the antenna, bringing the COB module towards the antenna, so that the lead frame of the COB module is in physical contact with the terminal pads of the antenna, and applying heat and pressure so as to weld and bond the terminal pads of the antenna to the lead frame of the chip-on-board module.
  • the method of fabricating the RFID board via thermocompression bonding might further comprises laser-etching area underneath the terminal pads to remove any substrate/adhesive materials away from the terminal pads.
  • non-conductive heat-reactive adhesive is used to align the antenna with the chip-on-board module
  • the antemia is a single-sided copper substrate antenna or a double-sided copper substrate antenna.
  • the lead frame of the COB module is made of copper alloy with silver plating.
  • the operating temperature for the thermocompression bonding is 300°C ⁇ 400°C and the operating pressure for the same is 340 ⁇ 680 atm.
  • Fig. 1 illustrates an exemplary RFID board 100 in accordance with one embodiment of the present invention
  • Fig. 2 is an exemplary cross-sectional view of the RFID board 100 across the line A-A' of Fig. 1 with a single sided copper antenna in accordance with one embodiment of the present invention
  • Fig. 3 A to 3C illustrate a flow diagram of thermocompression bonding process for fabricating the RFID board in accordance with one embodiment of the present invention
  • Fig. 4 is another exemplary cross-sectional view of the RFID board 100 across the line A-A' of Fig. I with a dual layer copper antenna in accordance with another embodiment of the present invention.
  • Figs. 5 A to 5C illustrate a flow diagram of thermocompression bonding process of the double-sided copper substrate antenna of Fig. 4 with a COB module in accordance with another embodiment of the present invention.
  • the present invention provides an FID board comprising an antenna and a chip on board (COB) module, wherein the antenna and the COB module is bonded by way of thermocompression bonding and no intermediate electrically conductive material is used therebetween. It is desired that the antenna and the COB module are made from any electrically conducted metals/alloys that have similar melting points. As such, when heat and pressure is applied, the antenna and the COB module are simultaneously softened and welded together, forming electrically non-intermittent connection therebetween.
  • COB chip on board
  • the RFID board 100 comprises copper antenna 101 having terminals in a form of terminal pads 104, 105 of specified thickness and a COB module 103 with lead frame 108.
  • a copper tracks 106 is etched or deposited onto a substrate 102.
  • the lead frame 108 of the COB module 103 in the present embodiment is made of copper alloy with silver plating, although other metal and/or plating may be desired.
  • the lead frame 108 is bonded to the terminal pads 104, 105 via thermocompression bonding.
  • the thermocompression bonding is carried out without the use of any electrically conductive materials as intermediate bonding material between the lead frame 108 and the antenna pads 104, 105.
  • conventional thermocompression bonding require intermediate materials, such as gold, to bond the COB module 103 onto the copper antenna 101.
  • Fig. 2 is an exemplary cross-sectional view of the RFID board 100 across the line A-A' of Fig. 1 with a single sided copper substrate antenna 200 having terminal pads 204, 205 in accordance with one embodiment of the present invention.
  • COB module of the RFID board 100 is not shown herein.
  • the single sided copper antenna 200 is bonded onto the substrate 212 by a heat-reactive adhesive 201.
  • the substrate 212 may be made of PET or any other suitable materials.
  • the substrate 212 defines a punched hole 203 across the terminal pads 204, 205.
  • In the antenna 200 there is provided a bareback 202.
  • the bareback 202 implies a pre-defined window, in which bonding site within the terminal pads 204, 205 of the antenna 200 is exposed plainly without any substrate or adhesive materials. To form the bareback 202, it is desired that substrate and adhesive materials under the terminal pads 204, 205 are removed by laser-etching.
  • Figs. 3A to 3C illustrate a flow diagram of thermocompression bonding process for fabricating the RFID board in accordance with one embodiment of the present invention. In this process, a COB module 302 is to be bonded to a single sided copper substrate antenna 301. [0028] In Fig. 3A, the antenna 301 is flipped downwardly and aligned with the COB Module 302.
  • the bareback areas 320 of the terminal pads 304, 305 are upwardly facing.
  • the COB module 302 is also flipped with the lead frame 303 upwardly facing.
  • the lead frame 303 of the COB module 302 is positioned to align with the terminal pads 304, 305 of the antenna 301 within the bareback area 320.
  • the COB module 302 is brought towards the antenna 301 so that the lead frame 303 is in physical contact with the terminal pads 304, 305 within the bareback area 320.
  • a non-conductive heat-reactive adhesive (not shown) may be used to pre-hold the antenna 301 onto the COB module 302.
  • a heated tip 309 of a thermocompression bonder machine 310 comes into contact with one of the terminal pad 305 through the bareback area 320.
  • the heated tip 309 applies heat and pressure onto the terminal pad 305 to bond the terminal pads 305 of the copper antenna 301 with the lead frame 303 of the COB module 302 within the opening area 306.
  • the terminal 305 and the lead frame 303 are welded together to form an electrical connection therebetween, without any intermediate conductive materials. Same treatment is also applied to the terminal pads 304.
  • the operating temperature and pressure used in the process can be selected at 300°C ⁇ 400°C and 340 ⁇ 680 atm respectively.
  • the selected operating temperature and pressure is suitable for bonding copper antenna to lead frame of copper alloy with silver plating.
  • Fig. 4 is another exemplary cross-sectional view of the RFID board 100 across the line A-A' of Fig. 1 with a double sided copper substrate antenna 400 in accordance with another embodiment of the present invention.
  • the double sided copper substrate antenna 400 comprising a copper tracks and two groups of terminal pads 421, 422; one group of terminal pads 421 is formed and bonded on top of substrate 420, wherein another group of terminal pads 422 is formed and bonded on bottom of substrate 420.
  • the substrate 420 also defines a punched hole 423.
  • the two groups of terminal pads 421, 422 are electrically interconnected to each other by blind plated 424 through the punched hole 423.
  • Figs. 5A to 5C illustrate a flow diagram of thermocompression bonding process of the double-sided copper substrate antenna 400 of Fig. 4 with a COB module 502 in accordance with another embodiment of the present invention.
  • the antenna 400 is positioned so that the bottom group of terminal pads 422 is facing downwardly, whilst the lead frame 503 of the COB module 502 is upwardly facing.
  • the lead frame 503 of the COB module 502 is positioned to align with the bottom group of terminal pads 422.
  • the bottom group of the terminal pads 422 is laser-etched to remove any intermediate/adhesive materials away before it is bonded to the COB module 502. .
  • the COB module 502 is brought towards the antenna 400 so that the lead frame 503 is in physical contact with the bottom group of terminal pads 422.
  • a non-conductive heat-reactive adhesive (not shown) may be used to pre-hold the antenna 400 onto the COB module 502.
  • a heated tip 509 of a thermocompression bonder machine 510 comes into contact with top group of the terminal pads 421.
  • the heated tip 509 applies heat and pressure onto the top group of the terminal pads 421, which is electrically connected to the bottom group of the terminal pads 422, the heat and pressure are transferred to the bottom group of the terminal pads 422.
  • the bottom group of the terminal pads 422 is melted and welded together with the leadframe 503 of the COB module 502 aligned with the bottom group of the terminal pads 422, forming an electrical connection between the COB module 502 and the bottom group of the terminal pads 422.
  • the operating temperature and pressure used in the process can be selected at 300°C ⁇ 400°C and 340 ⁇ 680 atm respectively.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
  • Details Of Aerials (AREA)

Abstract

La présente invention concerne une carte RFID comportant une antenne et un module à montage direct sur carte (COB), l'antenne étant munie de deux bornes sous la forme de plages et soudée à un cadre de connexion du module à montage direct sur carte au moyen d'une soudure par thermocompression, sans utiliser aucun matériau intermédiaire électriquement conducteur. L'invention concerne également un procédé de fabrication de la carte RFID au moyen d'une soudure par thermocompression.
PCT/MY2012/000116 2011-06-10 2012-06-08 Procédé de soudure par thermocompression de plages en cuivre gravées par laser à un module cob Ceased WO2012169873A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
MYPI2011002669A MY164922A (en) 2011-06-10 2011-06-10 Method of thermocompression bonding of laser-etched copper pads to cob module
MYPI2011002669 2011-06-10

Publications (2)

Publication Number Publication Date
WO2012169873A2 true WO2012169873A2 (fr) 2012-12-13
WO2012169873A3 WO2012169873A3 (fr) 2013-04-04

Family

ID=47296656

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/MY2012/000116 Ceased WO2012169873A2 (fr) 2011-06-10 2012-06-08 Procédé de soudure par thermocompression de plages en cuivre gravées par laser à un module cob

Country Status (3)

Country Link
MY (1) MY164922A (fr)
TW (1) TW201316865A (fr)
WO (1) WO2012169873A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025262574A1 (fr) * 2024-06-19 2025-12-26 Avery Dennison Retail Information Services Llc Procédé de fabrication de dispositifs rfid

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1544787A1 (fr) * 2003-12-19 2005-06-22 Axalto SA Carte sans contact avec un interrupteur d'antenne
CN101160597A (zh) * 2005-04-18 2008-04-09 哈里斯股份有限公司 电子零件及该电子零件的制造方法
US7980477B2 (en) * 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
CN101971194A (zh) * 2007-12-19 2011-02-09 谢玉莲 非接触式和双界面嵌体及其生产方法
DE102008037817B4 (de) * 2008-08-14 2019-09-05 Infineon Technologies Ag Transponderinlay für ein Dokument zur Personenidentifikation und ein Verfahren zur Herstellung eines Transponderinlays

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025262574A1 (fr) * 2024-06-19 2025-12-26 Avery Dennison Retail Information Services Llc Procédé de fabrication de dispositifs rfid

Also Published As

Publication number Publication date
WO2012169873A3 (fr) 2013-04-04
MY164922A (en) 2018-02-15
TW201316865A (zh) 2013-04-16

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