MY175024A - Sputtering target for magnetic recording medium - Google Patents

Sputtering target for magnetic recording medium

Info

Publication number
MY175024A
MY175024A MYPI2015702496A MYPI2015702496A MY175024A MY 175024 A MY175024 A MY 175024A MY PI2015702496 A MYPI2015702496 A MY PI2015702496A MY PI2015702496 A MYPI2015702496 A MY PI2015702496A MY 175024 A MY175024 A MY 175024A
Authority
MY
Malaysia
Prior art keywords
sputtering target
main components
nonmagnetic material
recording medium
magnetic recording
Prior art date
Application number
MYPI2015702496A
Inventor
Atsushi Sato
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY175024A publication Critical patent/MY175024A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C33/00—Making ferrous alloys
    • C22C33/02—Making ferrous alloys by powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2202/00—Physical properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Powder Metallurgy (AREA)

Abstract

A sintered compact sputtering target having an Fe-Pt alloy and nonmagnetic material(s) as its main components, wherein the sintered compact sputtering target contains at least C (carbon) as the nonmagnetic material, and additionally contains trace additive element(s) other than the main components in an amount of 50 massppm to 5000 massppm, and a standard free energy ?G? for the formation of a carbide of each trace additive element is -5000 [cal/mol] or less per 1 mol of carbon in the carbide. The present invention aims to provide a sputtering target having an Fe-Pt-based alloy and nonmagnetic material(s) as its main components, which can considerably reduce the amount of particles to be generated during sputtering.
MYPI2015702496A 2013-06-06 2014-05-23 Sputtering target for magnetic recording medium MY175024A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013119818 2013-06-06
PCT/JP2014/063676 WO2014196377A1 (en) 2013-06-06 2014-05-23 Sputtering target for magnetic recording medium

Publications (1)

Publication Number Publication Date
MY175024A true MY175024A (en) 2020-06-03

Family

ID=52008028

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015702496A MY175024A (en) 2013-06-06 2014-05-23 Sputtering target for magnetic recording medium

Country Status (5)

Country Link
JP (1) JP5946922B2 (en)
MY (1) MY175024A (en)
SG (1) SG11201505307QA (en)
TW (1) TWI605143B (en)
WO (1) WO2014196377A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6692724B2 (en) * 2016-09-02 2020-05-13 Ｊｘ金属株式会社 Non-magnetic material dispersed Fe-Pt based sputtering target
JP7104001B2 (en) * 2019-06-28 2022-07-20 田中貴金属工業株式会社 Fe-Pt-BN-based sputtering target and its manufacturing method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9945026B2 (en) * 2010-12-20 2018-04-17 Jx Nippon Mining & Metals Corporation Fe-Pt-based sputtering target with dispersed C grains
US9683284B2 (en) * 2011-03-30 2017-06-20 Jx Nippon Mining & Metals Corporation Sputtering target for magnetic recording film
JP6108064B2 (en) * 2012-08-24 2017-04-05 三菱マテリアル株式会社 Sputtering target for forming a magnetic recording medium film and method for producing the same

Also Published As

Publication number Publication date
JPWO2014196377A1 (en) 2017-02-23
SG11201505307QA (en) 2015-08-28
TW201510257A (en) 2015-03-16
TWI605143B (en) 2017-11-11
JP5946922B2 (en) 2016-07-06
WO2014196377A1 (en) 2014-12-11

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