MY176735A - Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method - Google Patents

Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method

Info

Publication number: MY176735A
Authority: MY; Malaysia
Prior art keywords: electroless plating; pretreatment; composition; provides; present
Prior art date: 2017-05-23

Application number

MYPI2019005194A

Other languages

English (en)

Inventor

Shingo Nagamine

Koji Kita

Original Assignee

Okuno Chem Ind Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-05-23

Filing date

2018-05-23

Publication date

2020-08-20

2018-05-23 Application filed by Okuno Chem Ind Co filed Critical Okuno Chem Ind Co

2020-08-20 Publication of MY176735A publication Critical patent/MY176735A/en

Links

238000007772 electroless plating Methods 0.000 title abstract 6
238000000034 method Methods 0.000 title abstract 2
238000002203 pretreatment Methods 0.000 title abstract 2
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 2
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 abstract 1
230000008021 deposition Effects 0.000 abstract 1
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 abstract 1
229910001437 manganese ion Inorganic materials 0.000 abstract 1
229910052763 palladium Inorganic materials 0.000 abstract 1
238000007747 plating Methods 0.000 abstract 1
229910052709 silver Inorganic materials 0.000 abstract 1
239000004332 silver Substances 0.000 abstract 1
-1 silver ions Chemical class 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Inorganic Chemistry (AREA)
Chemically Coating (AREA)
Coating With Molten Metal (AREA)

MYPI2019005194A 2017-05-23 2018-05-23 Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method MY176735A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2017102106		2017-05-23

Publications (1)

Publication Number	Publication Date
MY176735A true MY176735A (en)	2020-08-20

Family

ID=64395514

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
MYPI2019005194A MY176735A (en)	2017-05-23	2018-05-23	Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method

Country Status (10)

Country	Link
US (1)	US20200407854A1 (es)
EP (1)	EP3584352B1 (es)
JP (1)	JP6482049B1 (es)
KR (2)	KR102366687B1 (es)
CN (4)	CN110573657A (es)
ES (1)	ES2953783T3 (es)
MY (1)	MY176735A (es)
PL (1)	PL3584352T3 (es)
PT (1)	PT3584352T (es)
WO (1)	WO2018216714A1 (es)

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ES2708341T3 (es) *	2016-11-22	2019-04-09	Macdermid Enthone Gmbh	Grabado exento de cromo para un galvanizado sobre plástico
CN110172684A (zh) *	2019-06-06	2019-08-27	南通柏源汽车零部件有限公司	一种abs无铬粗化液及其制备方法与应用
JP7484389B2 (ja)	2020-04-28	2024-05-16	栗田工業株式会社	樹脂成形体のエッチング方法及び樹脂成形体用エッチング処理システム
CN116134175A (zh)	2020-08-25	2023-05-16	德国艾托特克有限两合公司	非金属衬底的金属化方法和预处理组合物
US12435273B2 (en) *	2021-02-26	2025-10-07	Atotech Deutschland GmbH & Co. KG	Method for etching at least one surface of a plastic substrate
EP4089201A1 (en) *	2021-05-10	2022-11-16	Atotech Deutschland GmbH & Co. KG	Method for treating a non-metallic substrate for subsequent metallization
JP7138880B1 (ja)	2021-08-06	2022-09-20	株式会社太洋工作所	無電解めっき方法
CN115125525A (zh) *	2022-07-05	2022-09-30	长沙理工大学	一种低成本六方氮化硼表面化学镀镍前无钯活化方法
KR102706672B1 (ko) *	2022-10-13	2024-09-25	주식회사 비투비	제조가 용이한 반도체 테스터보드 커넥터
US20250188349A1 (en) *	2023-12-11	2025-06-12	Macdermid Enthone Inc.	Suppression of manganese dioxide formation in manganese (iii)-based etching solutions

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US4001372A (en) *	1972-02-19	1977-01-04	Mitsubishi Kinzoku Kogyo Kabushiki Kaisha	Removing oxides of nitrogen from gaseous mixtures with alkali manganate solutions
US4042729A (en) *	1972-12-13	1977-08-16	Kollmorgen Technologies Corporation	Process for the activation of resinous bodies for adherent metallization
DE3816494A1 (de) *	1988-05-10	1989-11-16	Schering Ag	Loesung und verfahren zum aetzen und aktivieren von isolierenden oberflaechen
GB9722028D0 (en) *	1997-10-17	1997-12-17	Shipley Company Ll C	Plating of polymers
DE502007001745D1 (de) *	2007-08-10	2009-11-26	Enthone	Chromfreie Beize für Kunststoffoberflächen
JP2009228083A (ja) *	2008-03-25	2009-10-08	Ebara-Udylite Co Ltd	プラスチック表面への金属めっき方法
KR101025856B1 (ko) *	2008-08-26	2011-03-30	연세대학교 산학협력단	표준 환원전위차를 이용한 은-산화망간 복합체 나노 로드 또는 튜브의 제조방법
SG188694A1 (en) *	2011-09-30	2013-04-30	Bayer Materialscience Ag	Aqueous ink formulation containing metal-based nanoparticles for usage in micro contact printing
US8603352B1 (en) *	2012-10-25	2013-12-10	Rohm and Haas Electroncis Materials LLC	Chrome-free methods of etching organic polymers
BR112015016031A2 (pt) *	2013-10-22	2017-07-11	Okuno Chem Ind Co	composição para tratamento de decapagem de material de resina
US10174250B2 (en) *	2014-04-01	2019-01-08	Atotech Deutschland Gmbh	Composition and process for metallizing nonconductive plastic surfaces
US11047052B2 (en) *	2014-07-10	2021-06-29	Okuno Chemical Industries Co., Ltd.	Resin plating method
US9506150B2 (en) *	2014-10-13	2016-11-29	Rohm And Haas Electronic Materials Llc	Metallization inhibitors for plastisol coated plating tools

2018
- 2018-05-23 CN CN201880028555.3A patent/CN110573657A/zh active Pending
- 2018-05-23 CN CN202410090911.1A patent/CN117904611A/zh active Pending
- 2018-05-23 KR KR1020207033666A patent/KR102366687B1/ko active Active
- 2018-05-23 EP EP18806217.8A patent/EP3584352B1/en active Active
- 2018-05-23 PT PT188062178T patent/PT3584352T/pt unknown
- 2018-05-23 CN CN202110654779.9A patent/CN113373432A/zh active Pending
- 2018-05-23 KR KR1020197033554A patent/KR20190137146A/ko not_active Ceased
- 2018-05-23 US US16/493,480 patent/US20200407854A1/en not_active Abandoned
- 2018-05-23 WO PCT/JP2018/019776 patent/WO2018216714A1/ja not_active Ceased
- 2018-05-23 CN CN202410208179.3A patent/CN118064879A/zh active Pending
- 2018-05-23 MY MYPI2019005194A patent/MY176735A/en unknown
- 2018-05-23 JP JP2018549365A patent/JP6482049B1/ja active Active
- 2018-05-23 ES ES18806217T patent/ES2953783T3/es active Active
- 2018-05-23 PL PL18806217.8T patent/PL3584352T3/pl unknown

Also Published As

Publication number	Publication date
US20200407854A1 (en)	2020-12-31
JP6482049B1 (ja)	2019-03-13
WO2018216714A1 (ja)	2018-11-29
KR20190137146A (ko)	2019-12-10
CN113373432A (zh)	2021-09-10
JPWO2018216714A1 (ja)	2019-06-27
PL3584352T3 (pl)	2023-09-25
ES2953783T3 (es)	2023-11-16
CN117904611A (zh)	2024-04-19
EP3584352B1 (en)	2023-06-21
EP3584352A1 (en)	2019-12-25
PT3584352T (pt)	2023-07-26
CN110573657A (zh)	2019-12-13
KR102366687B1 (ko)	2022-02-23
CN118064879A (zh)	2024-05-24
KR20200134345A (ko)	2020-12-01
EP3584352A4 (en)	2021-01-06

Publication	Publication Date	Title
MY176735A (en)	2020-08-20	Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method
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