MY177723A - Surface-treated copper foil, laminate using same, printed wiring board, electronic device, and method for fabricating printed wiring board - Google Patents

Surface-treated copper foil, laminate using same, printed wiring board, electronic device, and method for fabricating printed wiring board

Info

Publication number
MY177723A
MY177723A MYPI2014002419A MYPI2014002419A MY177723A MY 177723 A MY177723 A MY 177723A MY PI2014002419 A MYPI2014002419 A MY PI2014002419A MY PI2014002419 A MYPI2014002419 A MY PI2014002419A MY 177723 A MY177723 A MY 177723A
Authority
MY
Malaysia
Prior art keywords
wiring board
copper foil
printed wiring
roughened
laminate
Prior art date
Application number
MYPI2014002419A
Inventor
Nagaura Tomota
Fukuchi Ryo
Arai Hideta
Miki Atsushi
Arai Kohsuke
Nakamuro Kaichiro
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY177723A publication Critical patent/MY177723A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Provided is a surface-treated copper foil, and a laminate using the same which has good adhesion with a resin, excellent resin transparency after removal of the copper foil by etching, and a small signal transmission loss. A surface-treated copper foil, wherein roughened particles are formed by a roughening treatment on one and/or both copper foil surfaces, for the roughened particles of the roughened surface, 50 or more roughened particles/?m2, the roughened particles having a long diameter of 100 nm or less, are formed per unit area, a 60? gloss in an MD of the roughened surface is 76 to 350%, the roughened surface includes any one or more elements selected from the group consisting of Ni and Co, if the roughened surface includes Ni, an amount of Ni deposited is 1,400 ?g/dm2 or less, and if the roughened surface includes Co, an amount of Co deposited is 2,400 ?g/dm2 or less.
MYPI2014002419A 2013-08-20 2014-08-19 Surface-treated copper foil, laminate using same, printed wiring board, electronic device, and method for fabricating printed wiring board MY177723A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013186668 2013-08-20

Publications (1)

Publication Number Publication Date
MY177723A true MY177723A (en) 2020-09-23

Family

ID=52821354

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014002419A MY177723A (en) 2013-08-20 2014-08-19 Surface-treated copper foil, laminate using same, printed wiring board, electronic device, and method for fabricating printed wiring board

Country Status (5)

Country Link
JP (1) JP5885790B2 (en)
KR (1) KR101632792B1 (en)
CN (1) CN104427757B (en)
MY (1) MY177723A (en)
TW (1) TWI563888B (en)

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* Cited by examiner, † Cited by third party
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JP6343205B2 (en) * 2013-08-21 2018-06-13 Ｊｘ金属株式会社 Copper foil with carrier and laminate manufacturing method using the same, printed wiring board, electronic device, printed wiring board manufacturing method, and electronic device manufacturing method
WO2017051897A1 (en) * 2015-09-24 2017-03-30 Ｊｘ金属株式会社 Metal foil, metal foil with mold release layer, laminate, printed wiring board, semiconductor package, electronic device and method for producing printed wiring board
WO2017149810A1 (en) * 2016-02-29 2017-09-08 三井金属鉱業株式会社 Copper foil with carrier, production method for same, production method for coreless support with wiring layer, and production method for printed circuit board
KR102274906B1 (en) * 2016-09-12 2021-07-09 후루카와 덴키 고교 가부시키가이샤 Copper foil and copper clad laminate having the same
JP7492807B2 (en) 2016-12-06 2024-05-30 Ｊｘ金属株式会社 Surface-treated copper foil, carrier-attached copper foil, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
JP6462961B2 (en) * 2016-12-14 2019-01-30 古河電気工業株式会社 Surface treated copper foil and copper clad laminate
JP2018122590A (en) * 2017-02-02 2018-08-09 Ｊｘ金属株式会社 Metal foil with release layer, metal foil, laminate, printed wiring board, semiconductor package, electronic device, and method for manufacturing printed wiring board
CN108419363A (en) * 2017-02-07 2018-08-17 Ｊｘ金属株式会社 The manufacturing method of surface treatment copper foil, the copper foil with carrier, layered product, the manufacturing method of printing distributing board and e-machine
JP7033905B2 (en) 2017-02-07 2022-03-11 Ｊｘ金属株式会社 Manufacturing method of surface-treated copper foil, copper foil with carrier, laminate, printed wiring board and manufacturing method of electronic equipment
WO2018181726A1 (en) * 2017-03-30 2018-10-04 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminate and printed wiring board using same
JP7356209B2 (en) 2017-03-31 2023-10-04 Ｊｘ金属株式会社 Surface-treated copper foil, surface-treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring boards, and method for manufacturing electronic devices
JP7492808B2 (en) 2017-03-31 2024-05-30 Ｊｘ金属株式会社 Surface-treated copper foil, surface-treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
CN108696987B (en) * 2017-03-31 2021-11-30 Ｊｘ金属株式会社 Surface-treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
KR102340473B1 (en) * 2017-04-25 2021-12-16 후루카와 덴키 고교 가부시키가이샤 surface treatment copper foil
WO2018211951A1 (en) * 2017-05-19 2018-11-22 三井金属鉱業株式会社 Roughened copper foil, carrier-attached copper foil, copper clad laminate, and printed wiring board
WO2019021895A1 (en) * 2017-07-24 2019-01-31 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminate sheet and printed wiring board using same
KR102390417B1 (en) * 2017-12-05 2022-04-22 후루카와 덴키 고교 가부시키가이샤 Surface-treated copper foil and copper clad laminate and printed wiring board using the same
WO2020039987A1 (en) * 2018-08-22 2020-02-27 株式会社豊田自動織機 Power storage module
US11770904B2 (en) 2019-02-04 2023-09-26 Panasonic Intellectual Property Management Co., Ltd. Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same
KR102349377B1 (en) 2019-12-19 2022-01-12 일진머티리얼즈 주식회사 Surface-treated copper foil, preparing method thereof, copper foil laminate including the same, and printed wiring board including the same
CN110996557A (en) * 2020-01-15 2020-04-10 深圳市聚永能科技有限公司 Method and apparatus for laser roughening copper foil surface of printed circuit board
JP7314841B2 (en) * 2020-03-12 2023-07-26 Dic株式会社 Conductive laminate and conductive laminated tape
WO2021220524A1 (en) * 2020-04-27 2021-11-04 ナミックス株式会社 Composite copper member
JP7427044B2 (en) * 2022-03-31 2024-02-02 古河電気工業株式会社 Surface treated copper foil, copper foil roll, copper clad laminate and printed wiring board

Family Cites Families (15)

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JP2849059B2 (en) 1995-09-28 1999-01-20 日鉱グールド・フォイル株式会社 Processing method of copper foil for printed circuit
CN1301046C (en) 2002-05-13 2007-02-14 三井金属鉱业株式会社 Chip-on-film flexible printed circuit board
JP2004098659A (en) 2002-07-19 2004-04-02 Ube Ind Ltd Copper-clad laminate and its manufacturing process
JP2004244656A (en) 2003-02-12 2004-09-02 Furukawa Techno Research Kk Copper foil for high frequency applications and its manufacturing method
US20080174016A1 (en) * 2006-12-28 2008-07-24 Mitsui Mining & Smelting Co., Ltd. Flexible Printed Wiring Board and Semiconductor Device
JP5588607B2 (en) * 2007-10-31 2014-09-10 三井金属鉱業株式会社 Electrolytic copper foil and method for producing the electrolytic copper foil
JP5318886B2 (en) * 2008-11-25 2013-10-16 Ｊｘ日鉱日石金属株式会社 Copper foil for printed circuit
JP5379528B2 (en) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil, method for producing electrolytic copper foil with carrier foil, and copper-clad laminate obtained using the electrolytic copper foil with carrier foil
WO2011090044A1 (en) * 2010-01-25 2011-07-28 Jx日鉱日石金属株式会社 Copper foil for secondary battery negative electrode power collector
JP5885054B2 (en) * 2010-04-06 2016-03-15 福田金属箔粉工業株式会社 A treated copper foil for a copper clad laminate, a copper clad laminate obtained by bonding the treated copper foil to an insulating resin substrate, and a printed wiring board using the copper clad laminate.
JP5676749B2 (en) 2011-03-30 2015-02-25 Jx日鉱日石金属株式会社 Copper foil for printed circuit
JP5497808B2 (en) * 2012-01-18 2014-05-21 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil and copper-clad laminate using the same
JP5475897B1 (en) * 2012-05-11 2014-04-16 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil and laminate using the same, copper foil, printed wiring board, electronic device, and method for manufacturing printed wiring board
JP5417538B1 (en) * 2012-06-11 2014-02-19 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil, laminate using the same, printed wiring board, electronic device, and method for manufacturing printed wiring board
JP5228130B1 (en) * 2012-08-08 2013-07-03 Ｊｘ日鉱日石金属株式会社 Copper foil with carrier

Also Published As

Publication number Publication date
TWI563888B (en) 2016-12-21
KR20150021474A (en) 2015-03-02
JP5885790B2 (en) 2016-03-15
JP2015061934A (en) 2015-04-02
CN104427757A (en) 2015-03-18
CN104427757B (en) 2018-08-28
KR101632792B1 (en) 2016-06-22
TW201515533A (en) 2015-04-16

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