MY186859A - Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same - Google Patents

Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same

Info

Publication number
MY186859A
MY186859A MYPI2018703757A MYPI2018703757A MY186859A MY 186859 A MY186859 A MY 186859A MY PI2018703757 A MYPI2018703757 A MY PI2018703757A MY PI2018703757 A MYPI2018703757 A MY PI2018703757A MY 186859 A MY186859 A MY 186859A
Authority
MY
Malaysia
Prior art keywords
copper foil
treated
treated surface
copper
carrier
Prior art date
Application number
MYPI2018703757A
Inventor
Tsubasa Kato
Mitsuyoshi Matsuda
Hiroto Iida
Kazuhiro Yoshikawa
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY186859A publication Critical patent/MY186859A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

There is provided a surface-treated copper foil that can give a laminate a surface profile excellent not only in plating circuit adhesion but also in etchability to electroless copper plating and dry film resolution when used in SAP. This surface treated copper foil has at least one treated surface. This treated surface has an arithmetic mean peak curvature Spc of 55 mm-1 or more determined according to ISO 25178. When the surface profile of the treated surface is transferred to a surface of a resin film by thermocompression bonding of the resin film to the treated surface and thereafter the surface-treated copper foil was removed by etching to provide a remaining resin film, the surface of the remaining resin film has an arithmetic mean peak curvature Spc of 55 mm-1 or more determined in accordance with ISO 25178.
MYPI2018703757A 2016-04-14 2017-03-28 Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same MY186859A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016081447 2016-04-14
PCT/JP2017/012678 WO2017179416A1 (en) 2016-04-14 2017-03-28 Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same

Publications (1)

Publication Number Publication Date
MY186859A true MY186859A (en) 2021-08-26

Family

ID=60041506

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018703757A MY186859A (en) 2016-04-14 2017-03-28 Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same

Country Status (6)

Country Link
JP (1) JP6945523B2 (en)
KR (1) KR102338103B1 (en)
CN (1) CN109072472B (en)
MY (1) MY186859A (en)
TW (1) TWI711139B (en)
WO (1) WO2017179416A1 (en)

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CN111684869B (en) * 2018-03-28 2021-03-19 三井金属矿业株式会社 Manufacturing method of multilayer wiring board
KR102479331B1 (en) * 2018-04-25 2022-12-19 후루카와 덴키 고교 가부시키가이샤 Surface treated copper foil, copper clad laminate, and printed wiring board
CN112154525A (en) * 2018-05-29 2020-12-29 积水保力马科技株式会社 Metal contact members and rubber switch members
KR102646809B1 (en) 2018-06-22 2024-03-13 세키수이 폴리머텍 가부시키가이샤 thermal conductive sheet
WO2020009229A1 (en) * 2018-07-06 2020-01-09 タツタ電線株式会社 Adhesive film for printed wiring board
WO2020031721A1 (en) * 2018-08-10 2020-02-13 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board
TWI856026B (en) * 2018-09-26 2024-09-21 日商積水保力馬科技股份有限公司 Thermally conductive sheet
CN112586098B (en) * 2018-09-28 2021-09-21 三井金属矿业株式会社 Method for manufacturing multilayer wiring board
JP6895936B2 (en) 2018-09-28 2021-06-30 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminates and circuit boards using this
TWI768213B (en) * 2018-11-08 2022-06-21 日商拓自達電線股份有限公司 Electromagnetic wave shielding film, method for producing electromagnetic wave shielding film, and method for producing shielded printed wiring board
MY205472A (en) * 2018-11-19 2024-10-22 Mitsui Mining & Smelting Co Ltd Surface-treated copper foil, carrier-attached copper foil, copper-clad laminate, and printed wiring board
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
US12171067B2 (en) * 2019-03-26 2024-12-17 Mitsui Mining & Smelting Co., Ltd. Method of manufacturing printed wiring board
US11877397B2 (en) * 2019-05-15 2024-01-16 Sumitomo Electric Industries, Ltd. Printed circuit board
KR102932005B1 (en) * 2019-07-26 2026-03-03 도요 고한 가부시키가이샤 Harmonious nickel plating material and its manufacturing method
JP7300976B2 (en) * 2019-12-13 2023-06-30 Ｊｘ金属株式会社 Surface treated copper foil, copper clad laminate and printed wiring board
JP2021095596A (en) * 2019-12-13 2021-06-24 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
JP7421208B2 (en) * 2019-12-24 2024-01-24 日本電解株式会社 Surface treated copper foil and its manufacturing method
CN115038819B (en) * 2020-02-04 2024-12-17 三井金属矿业株式会社 Roughened copper foil, copper foil with carrier, copper-clad laminate, and printed wiring board
JP7177956B2 (en) * 2020-02-04 2022-11-24 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper clad laminate and printed wiring board
WO2022202541A1 (en) * 2021-03-26 2022-09-29 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper-cladded laminate board, and printed wiring board
WO2022202540A1 (en) * 2021-03-26 2022-09-29 三井金属鉱業株式会社 Roughened copper foil, copper foil equipped with carrier, copper-cladded laminate board, and printed wiring board
CN115226325A (en) * 2021-04-14 2022-10-21 鹏鼎控股(深圳)股份有限公司 Circuit board manufacturing method and circuit board
KR20230170898A (en) * 2021-04-20 2023-12-19 나믹스 가부시끼가이샤 Manufacturing system for composite copper members
CN117480282B (en) * 2021-06-03 2026-06-26 三井金属株式会社 Roughening treatment of copper foil, copper-clad laminates and printed circuit boards
JP7683428B2 (en) * 2021-08-31 2025-05-27 住友ベークライト株式会社 Microchannel chip and method for manufacturing same
JP7887029B2 (en) * 2023-03-23 2026-07-08 三井金属株式会社 Manufacturing method of printed circuit boards

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Also Published As

Publication number Publication date
WO2017179416A1 (en) 2017-10-19
KR20180133845A (en) 2018-12-17
JPWO2017179416A1 (en) 2019-02-21
JP6945523B2 (en) 2021-10-06
KR102338103B1 (en) 2021-12-10
TWI711139B (en) 2020-11-21
CN109072472A (en) 2018-12-21
TW201742212A (en) 2017-12-01
CN109072472B (en) 2020-10-16

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