MY181305A - Metal substrate - Google Patents

Metal substrate

Info

Publication number
MY181305A
MY181305A MYPI2016703535A MYPI2016703535A MY181305A MY 181305 A MY181305 A MY 181305A MY PI2016703535 A MYPI2016703535 A MY PI2016703535A MY PI2016703535 A MYPI2016703535 A MY PI2016703535A MY 181305 A MY181305 A MY 181305A
Authority
MY
Malaysia
Prior art keywords
film
metal substrate
substrate
less
metal sheet
Prior art date
Application number
MYPI2016703535A
Inventor
Hirano Yasuo
Iwa Tatsuhiko
Watase Takeshi
Mizuno Masao
Shida Yoko
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Publication of MY181305A publication Critical patent/MY181305A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H10F77/1694—Thin semiconductor films on metallic or insulating substrates the films including Group I-III-VI materials, e.g. CIS or CIGS
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/402—Coloured
    • B32B2307/4026—Coloured within the layer by addition of a colorant, e.g. pigments, dyes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/541—CuInSe2 material PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photovoltaic Devices (AREA)

Abstract

Provided is a metal substrate in which, by laminating a predetermined film on a metal sheet, the surface of the film is smoothed out, and the film has insulating properties. In the metal substrate, which is used in substrate-type thin-film solar cells or top-emission-type organic EL elements, one layer of a thermoplastic resin film is laminated on the surface of a metal sheet via an adhesive, the film is obtained from a composition having a volume fraction of solid pigment of 20% or less and has a thickness of 12 ?m to 250 ?m, and a surface roughness Ra of the film surface after lamination is 30 nm or less.
MYPI2016703535A 2014-03-31 2015-03-16 Metal substrate MY181305A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014073359A JP6510760B2 (en) 2014-03-31 2014-03-31 Metal substrate

Publications (1)

Publication Number Publication Date
MY181305A true MY181305A (en) 2020-12-21

Family

ID=54240105

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016703535A MY181305A (en) 2014-03-31 2015-03-16 Metal substrate

Country Status (6)

Country Link
JP (1) JP6510760B2 (en)
KR (2) KR20160129870A (en)
CN (1) CN106165112B (en)
MY (1) MY181305A (en)
TW (1) TWI598464B (en)
WO (1) WO2015151773A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5946578B1 (en) * 2015-12-09 2016-07-06 尾池工業株式会社 Method for producing surface smooth laminate
JP6742268B2 (en) * 2017-03-31 2020-08-19 富士フイルム株式会社 Thermoplastic resin film manufacturing method, conductive film manufacturing method, thermoplastic resin film, and conductive film
SG11202106641PA (en) 2018-12-28 2021-07-29 Jfe Steel Corp Film-laminated metal sheet, substrate for flexible device, and substrate for organic el device
CN112877592B (en) * 2019-11-29 2022-06-28 宝山钢铁股份有限公司 Thermoformed part with excellent paint film adhesion and method of making the same
JP7435802B2 (en) * 2021-03-23 2024-02-21 Ｊｆｅスチール株式会社 Film laminated metal plate and its manufacturing method, flexible electronics substrate and organic EL substrate
JPWO2024075738A1 (en) * 2022-10-03 2024-04-11

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1110724A (en) 1997-06-25 1999-01-19 Toray Ind Inc Polyester film for metal plate lamination
JP2002025763A (en) * 2000-07-11 2002-01-25 Nisshin Steel Co Ltd Insulating board for organic el element
JP3942017B2 (en) * 2002-03-25 2007-07-11 富士フイルム株式会社 Light emitting element
JP2011222779A (en) * 2010-04-09 2011-11-04 Dainippon Printing Co Ltd Method of manufacturing substrate for thin film element, method of manufacturing thin film element, method for thin film transistor
JP2011108883A (en) * 2009-11-18 2011-06-02 Mitsubishi Chemicals Corp Solar cell
US8945972B2 (en) * 2010-02-10 2015-02-03 Tata Steel Nederland Technology Bv Layered system for producing a solar cell on a metal substrate, method for producing said layered system
CN101805578B (en) * 2010-03-19 2012-07-25 苏州赛伍应用技术有限公司 Back protection film of solar cell
WO2012048888A1 (en) * 2010-10-14 2012-04-19 Tata Steel Nederland Technology B.V. Preparation of a polyetherimide intermediate and its application on metal substrates
JP2012146413A (en) 2011-01-07 2012-08-02 Teijin Dupont Films Japan Ltd Polyester film for organic electroluminescent illumination substrate
JP5853567B2 (en) * 2011-10-11 2016-02-09 日新製鋼株式会社 ORGANIC EL ELEMENT SUBSTRATE, ITS MANUFACTURING METHOD, AND ORGANIC EL ELEMENT
CN107571572B (en) * 2013-03-28 2019-10-18 株式会社神户制钢所 Metal substrate, substrate-type thin-film solar cells and top emission type organic EL element using it
CN103522658B (en) * 2013-09-18 2017-02-15 东莞市安派电子有限公司 Backboard for metal perforation type solar battery and preparation method of backboard

Also Published As

Publication number Publication date
JP2015195315A (en) 2015-11-05
KR20160129870A (en) 2016-11-09
CN106165112B (en) 2019-05-10
KR20180135122A (en) 2018-12-19
JP6510760B2 (en) 2019-05-08
WO2015151773A1 (en) 2015-10-08
TWI598464B (en) 2017-09-11
TW201602411A (en) 2016-01-16
CN106165112A (en) 2016-11-23

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