MY183124A - Lead frame - Google Patents

Lead frame

Info

Publication number
MY183124A
MY183124A MYPI2017702498A MYPI2017702498A MY183124A MY 183124 A MY183124 A MY 183124A MY PI2017702498 A MYPI2017702498 A MY PI2017702498A MY PI2017702498 A MYPI2017702498 A MY PI2017702498A MY 183124 A MY183124 A MY 183124A
Authority
MY
Malaysia
Prior art keywords
leads
linking
lead frames
unit lead
lead frame
Prior art date
Application number
MYPI2017702498A
Inventor
Ishibashi Takahiro
Original Assignee
Mitsui High Tec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui High Tec filed Critical Mitsui High Tec
Publication of MY183124A publication Critical patent/MY183124A/en

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

Provided is a lead frame (1, 1A to 1H) including: a plurality of unit lead frames (10); and a connecting bar (15) for linking the unit lead frames with each other. Each of the unit lead frames includes a die pad (11), a plurality of leads, and a linking portion (13) for linking tip end portions (12a) of adjacent leads of the plurality of leads with each other, and the unit lead frames are arrayed in matrix; the connecting bar includes a lead support bar (15a) for supporting base end portions (12b) of the leads; and a region in the lead support bar, the region facing the linking portion, is cut out in a direction away from the linking portion. (Figure 1)
MYPI2017702498A 2016-07-12 2017-07-07 Lead frame MY183124A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016137817A JP6738676B2 (en) 2016-07-12 2016-07-12 Lead frame

Publications (1)

Publication Number Publication Date
MY183124A true MY183124A (en) 2021-02-15

Family

ID=60995768

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017702498A MY183124A (en) 2016-07-12 2017-07-07 Lead frame

Country Status (4)

Country Link
JP (1) JP6738676B2 (en)
CN (1) CN107611113B (en)
MY (1) MY183124A (en)
TW (1) TWI703695B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12027450B2 (en) 2019-06-28 2024-07-02 Rohm Co., Ltd. Electronic device and electronic device mounting structure

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03296254A (en) * 1990-02-06 1991-12-26 Dainippon Printing Co Ltd Lead frame
CA2035857A1 (en) * 1990-02-06 1991-08-07 Kikuo Ichigi Leadframe
JP2866816B2 (en) * 1995-03-31 1999-03-08 日鉄セミコンダクター株式会社 Lead frame
JP3483994B2 (en) * 1995-08-31 2004-01-06 ローム株式会社 Molding apparatus for molding resin package type semiconductor device, and resin packaging method for semiconductor device
JP2000188366A (en) * 1998-12-24 2000-07-04 Hitachi Ltd Semiconductor device
US7489021B2 (en) * 2003-02-21 2009-02-10 Advanced Interconnect Technologies Limited Lead frame with included passive devices
JP2005026466A (en) * 2003-07-02 2005-01-27 Renesas Technology Corp Semiconductor device and lead frame
JP2005166695A (en) * 2003-11-28 2005-06-23 Mitsui High Tec Inc Lead frame and manufacturing method of semiconductor device
TWI280399B (en) * 2004-10-01 2007-05-01 Yamaha Corp Physical amount sensor and lead frame used therein
JP5467506B2 (en) * 2009-10-05 2014-04-09 大日本印刷株式会社 Resin-sealed semiconductor device and manufacturing method thereof

Also Published As

Publication number Publication date
JP6738676B2 (en) 2020-08-12
TW201803061A (en) 2018-01-16
CN107611113A (en) 2018-01-19
TWI703695B (en) 2020-09-01
JP2018010935A (en) 2018-01-18
CN107611113B (en) 2022-02-08

Similar Documents

Publication Publication Date Title
USD782031S1 (en) Face mask cushion and frame assembly
MX2016009178A (en) Dual function shoe upper printing jig.
MX2016002606A (en) A METHOD AND SYSTEM TO PRODUCE A VIDEO PRODUCTION.
MY192355A (en) Lead frame and manufacturing method thereof, and semiconductor package
BR112014003697A2 (en) boom structure
GB0611979D0 (en) Coordinate positioning machine
MX354994B (en) Wipe for application of at least one active principle on the skin.
GB201916135D0 (en) Extracellular matrix gels, and organoid cultures comprising the same
IN2015DN07856A (en)
MX359220B (en) Machine tool.
MX388404B (en) VERTICAL ELECTROLYSIS DEVICE
MX2020014167A (en) Bed frame assembly.
MX2017005722A (en) Roller cage for a profiling line.
CN203817646U (en) Feeding supporting frame
PH12018000306B1 (en) Method for producing lead frame and lead frame
MY174745A (en) Lead frame
MX2018010746A (en) A method and a tool for assembling a female mould and a female mould arrangement.
EA201291406A1 (en) FORM FOR CONSTRUCTION OF PROTECTIVE AND FASTING ELEMENT OF THE PROMETING TYPE AND RELATED TO IT METHOD
IT202000000112A1 (en) Tablet press machine.
CN103949782B (en) A kind of feeding bracing frame
EP2966202A3 (en) Core yarn supplying unit and spinning machine
FR2977180B1 (en) PROCESS FOR ABOUTEMENT OF PARTS AT LEAST PARTIALLY IN THE FORM OF HOLLOW PROFILES
SE0700395L (en) Delivery furniture
MX2014008419A (en) Plate element for guiding a rail and method for producing said plate element.
MY205828A (en) Table