MY186027A - Cmp compositions and methods for polishing rigid disk surfaces - Google Patents

Cmp compositions and methods for polishing rigid disk surfaces

Info

Publication number
MY186027A
MY186027A MYPI2016002071A MYPI2016002071A MY186027A MY 186027 A MY186027 A MY 186027A MY PI2016002071 A MYPI2016002071 A MY PI2016002071A MY PI2016002071 A MYPI2016002071 A MY PI2016002071A MY 186027 A MY186027 A MY 186027A
Authority
MY
Malaysia
Prior art keywords
methods
polishing
rigid disk
disk surfaces
cmp compositions
Prior art date
Application number
MYPI2016002071A
Inventor
Chinnathambi Selvaraj Palanisamy
Lu Tian
Original Assignee
Cmc Mat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cmc Mat Inc filed Critical Cmc Mat Inc
Publication of MY186027A publication Critical patent/MY186027A/en

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

A chemical mechanical polishing (CMP) method for polishing a nickel phosphorus (NiP) substrate comprises abrading a surface of the substrate with an acidic CMP composition. The CMP composition comprises a colloidal silica abrasive suspended in an aqueous carrier containing a nickel complexing agent (e.g., glycine, N-hydroxyethylenediaminetriacetic acid), polyvinyl alcohol, polystyrenesulfonic acid-co-maleic acid, and optionally an oxidizing agent. (Fig.1)
MYPI2016002071A 2014-06-03 2015-06-03 Cmp compositions and methods for polishing rigid disk surfaces MY186027A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462007021P 2014-06-03 2014-06-03
PCT/US2015/033964 WO2015187820A1 (en) 2014-06-03 2015-06-03 Cmp compositions and methods for polishing rigid disk surfaces

Publications (1)

Publication Number Publication Date
MY186027A true MY186027A (en) 2021-06-15

Family

ID=54767312

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016002071A MY186027A (en) 2014-06-03 2015-06-03 Cmp compositions and methods for polishing rigid disk surfaces

Country Status (4)

Country Link
MY (1) MY186027A (en)
SG (1) SG11201610441SA (en)
TW (1) TWI563073B (en)
WO (1) WO2015187820A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017214185A1 (en) * 2016-06-07 2017-12-14 Cabot Microelectronics Corporation Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
EP3584298B1 (en) * 2017-02-17 2022-12-28 Fujimi Incorporated Polishing method using a polishing composition
CN110431209B (en) 2017-03-14 2022-06-28 福吉米株式会社 Polishing composition, its production method, polishing method using the same, and substrate production method
US11384253B2 (en) 2019-01-11 2022-07-12 Cmc Materials, Inc. Dual additive composition for polishing memory hard disks exhibiting edge roll off
WO2020196370A1 (en) * 2019-03-26 2020-10-01 株式会社フジミインコーポレーテッド Polishing composition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6299795B1 (en) * 2000-01-18 2001-10-09 Praxair S.T. Technology, Inc. Polishing slurry
US6821897B2 (en) * 2001-12-05 2004-11-23 Cabot Microelectronics Corporation Method for copper CMP using polymeric complexing agents
US8247326B2 (en) * 2008-07-10 2012-08-21 Cabot Microelectronics Corporation Method of polishing nickel-phosphorous
KR101359092B1 (en) * 2009-11-11 2014-02-05 가부시키가이샤 구라레 Slurry for chemical mechanical polishing and polishing method for substrate using same
KR20140019401A (en) * 2011-03-22 2014-02-14 바스프 에스이 A chemical mechanical polishing (cmp) composition comprising a polymeric polyamine
US9039914B2 (en) * 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks

Also Published As

Publication number Publication date
SG11201610441SA (en) 2017-01-27
TWI563073B (en) 2016-12-21
WO2015187820A1 (en) 2015-12-10
TW201546255A (en) 2015-12-16

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