MY187481A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
MY187481A
MY187481A MYUI2017703393A MYUI2017703393A MY187481A MY 187481 A MY187481 A MY 187481A MY UI2017703393 A MYUI2017703393 A MY UI2017703393A MY UI2017703393 A MYUI2017703393 A MY UI2017703393A MY 187481 A MY187481 A MY 187481A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
resin composition
chemical solution
alkali
exposure
Prior art date
Application number
MYUI2017703393A
Inventor
Shinichi Kunimatsu
Takayuki Matsuda
Yuri Yamada
Yamato Tsutsui
Akira Fujiwara
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY187481A publication Critical patent/MY187481A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

A photosensitive resin composition comprises an alkali-soluble polymer, a compound with an ethylenically unsaturated bond, and a photopolymerization initiator, wherein after a photosensitive resin layer comprising the photosensitive resin composition has been formed on a substrate surface, exposure and development have been carried out and the obtained resist pattern has been treated with a chemical solution for evaluation of chemical solution resistance, the minimum line width of the cured resist lines is no greater than 17 ?m.
MYUI2017703393A 2015-04-08 2016-04-08 Photosensitive resin composition MY187481A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015079381 2015-04-08
JP2015166570 2015-08-26
PCT/JP2016/061610 WO2016163540A1 (en) 2015-04-08 2016-04-08 Photosensitive resin composition

Publications (1)

Publication Number Publication Date
MY187481A true MY187481A (en) 2021-09-23

Family

ID=57073148

Family Applications (2)

Application Number Title Priority Date Filing Date
MYUI2020000023A MY199471A (en) 2015-04-08 2016-04-08 Photosensitive resin composition
MYUI2017703393A MY187481A (en) 2015-04-08 2016-04-08 Photosensitive resin composition

Family Applications Before (1)

Application Number Title Priority Date Filing Date
MYUI2020000023A MY199471A (en) 2015-04-08 2016-04-08 Photosensitive resin composition

Country Status (6)

Country Link
JP (3) JPWO2016163540A1 (en)
KR (2) KR102286107B1 (en)
CN (2) CN114437251B (en)
MY (2) MY199471A (en)
TW (3) TWI620017B (en)
WO (1) WO2016163540A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI666518B (en) * 2016-12-30 2019-07-21 奇美實業股份有限公司 Photosensitive resin composition and uses thereof
JP6981864B2 (en) * 2017-01-30 2021-12-17 旭化成株式会社 A method for manufacturing a photosensitive resin composition, a photosensitive resin laminate, a substrate on which a resist pattern is formed, and a circuit board.
MY197134A (en) * 2017-03-01 2023-05-26 Asahi Chemical Ind Photosensitive resin composition
CN115524922B (en) * 2017-03-29 2025-02-18 旭化成株式会社 Photosensitive resin composition
CN109976092B (en) * 2017-12-27 2022-04-01 太阳油墨（苏州）有限公司 Curable resin composition, dry film, cured product, and printed wiring board
WO2019244724A1 (en) * 2018-06-22 2019-12-26 旭化成株式会社 Photosensitive resin composition and resist pattern formation method
KR102605003B1 (en) * 2018-06-22 2023-11-22 아사히 가세이 가부시키가이샤 Photosensitive resin composition and method of forming resist pattern
CN118311829A (en) * 2018-07-11 2024-07-09 富士胶片株式会社 Drug solution, drug solution container
CN120215208A (en) * 2018-08-09 2025-06-27 旭化成株式会社 Photosensitive resin composition and method for forming resist pattern
JP7300619B2 (en) * 2019-01-11 2023-06-30 太陽ホールディングス株式会社 Laminated structures, dry films, cured products thereof, and electronic components
EP4032522B1 (en) * 2019-09-19 2026-04-29 Kuraray Noritake Dental Inc. Curable composition for dentistry
WO2021070764A1 (en) * 2019-10-08 2021-04-15 東京応化工業株式会社 Negative-working photosensitive resin composition, photosensitive resist film, pattern formation method, cured film, cured film production method, and rolled body
JP7485692B2 (en) * 2019-11-11 2024-05-16 旭化成株式会社 Photosensitive resin composition and photosensitive resin laminate
CN116209571A (en) * 2020-08-07 2023-06-02 株式会社力森诺科 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
WO2022181485A1 (en) * 2021-02-26 2022-09-01 富士フイルム株式会社 Method for manufacturing laminate and method for manufacturing circuit wiring
JPWO2022181764A1 (en) * 2021-02-26 2022-09-01
JP2023046974A (en) * 2021-09-24 2023-04-05 Jsr株式会社 Method for manufacturing wiring board and wiring board
JP7890329B2 (en) * 2021-12-27 2026-07-14 富士フイルム株式会社 Method for manufacturing a resist pattern, method for manufacturing a laminate, and photosensitive transfer material for direct imaging exposure.
US20250344324A1 (en) * 2022-05-31 2025-11-06 Resonac Corporation Pattern formation method and pattern formation structure
JP2025514129A (en) * 2022-08-30 2025-05-02 三星エスディアイ株式会社 Photosensitive resin composition, photosensitive resin film produced using the same, and color filter
TW202525876A (en) * 2022-10-21 2025-07-01 日商旭化成股份有限公司 Photosensitive resin composition, photosensitive resin laminate, and method for forming photoresist pattern

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3619852B2 (en) * 1999-06-08 2005-02-16 ニチゴー・モートン株式会社 Photosensitive resin composition and dry film resist using the same
CN1273867C (en) * 2001-11-12 2006-09-06 旭化成电子材料元件株式会社 Photosensitive resin composition and use thereof
US20070269738A1 (en) * 2004-07-30 2007-11-22 Hitachi Chemical Company, Ltd. Photosensitive Film, Photosensitive Film Laminate and Photosensitive Film Roll
JP4535851B2 (en) * 2004-11-19 2010-09-01 旭化成イーマテリアルズ株式会社 Photopolymerizable resin composition
JP4646759B2 (en) * 2005-09-20 2011-03-09 旭化成イーマテリアルズ株式会社 Pattern forming material, pattern forming apparatus and pattern forming method
JP2007133349A (en) * 2005-10-14 2007-05-31 Hitachi Chem Co Ltd Photosensitive film roll
JP4936848B2 (en) * 2006-10-16 2012-05-23 旭化成イーマテリアルズ株式会社 Photosensitive resin composition and laminate thereof
EP2096493A4 (en) * 2006-12-19 2010-11-17 Hitachi Chemical Co Ltd Photosensitive element
JP2008202022A (en) * 2007-01-23 2008-09-04 Fujifilm Corp Curable composition for optical nanoimprint lithography and pattern forming method using the same
CN101627339A (en) * 2007-06-18 2010-01-13 旭化成电子材料株式会社 Photosensitive resin composition, flexographic printing plate, and method for producing flexographic printing plate
JP5199282B2 (en) * 2007-12-18 2013-05-15 旭化成イーマテリアルズ株式会社 Method of producing resist cured product using negative photosensitive resin laminate, negative photosensitive resin laminate, and method of using negative photosensitive resin laminate
TWI536094B (en) * 2007-12-25 2016-06-01 旭化成電子材料元件股份有限公司 Photosensitive resin laminate
JP5396833B2 (en) * 2008-11-28 2014-01-22 Ｊｓｒ株式会社 Radiation-sensitive resin composition, spacer and protective film for liquid crystal display element, and method for forming them
WO2011013664A1 (en) * 2009-07-29 2011-02-03 旭化成イーマテリアルズ株式会社 Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern
KR20140069310A (en) * 2009-09-25 2014-06-09 아사히 가세이 이-매터리얼즈 가부시키가이샤 Photosensitive resin composition for resist material, and photosensitive resin laminate
JP5526868B2 (en) * 2010-03-03 2014-06-18 Ｊｓｒ株式会社 Radiation-sensitive resin composition, display element spacer and protective film, and method for forming them
JP5570275B2 (en) * 2010-03-31 2014-08-13 旭化成イーマテリアルズ株式会社 Dry film resist roll
KR20120002864A (en) * 2010-07-01 2012-01-09 동우 화인켐 주식회사 Black photosensitive resin composition, color filter, and liquid crystal display device having the same
CN102331684A (en) * 2010-07-13 2012-01-25 日立化成工业株式会社 Photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board, and printed wiring board
JP6022749B2 (en) * 2010-07-30 2016-11-09 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for producing resist pattern, method for producing lead frame, and method for producing printed wiring board
JP5771944B2 (en) * 2010-10-18 2015-09-02 Jsr株式会社 Manufacturing method of color filter
WO2012086371A1 (en) 2010-12-24 2012-06-28 旭化成イーマテリアルズ株式会社 Photosensitive resin composition
JP5835014B2 (en) * 2011-03-31 2015-12-24 Jsr株式会社 Pixel pattern forming method and color filter manufacturing method
JP6229256B2 (en) 2011-10-31 2017-11-15 日立化成株式会社 Photosensitive element, resist pattern forming method, and printed wiring board manufacturing method
KR20130047656A (en) * 2011-10-31 2013-05-08 히타치가세이가부시끼가이샤 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
JP5948539B2 (en) 2012-01-27 2016-07-06 旭化成株式会社 Photosensitive resin composition
JP2013195681A (en) * 2012-03-19 2013-09-30 Mitsubishi Chemicals Corp Photosensitive resin composition, color filter, liquid crystal display device, and organic el display
JP5853806B2 (en) * 2012-03-23 2016-02-09 Jsr株式会社 Radiation sensitive resin composition, cured film and method for forming cured film
JP6019791B2 (en) * 2012-06-19 2016-11-02 日立化成株式会社 Partition wall forming material, photosensitive element using the same, partition wall forming method, and image display device manufacturing method
JP5826135B2 (en) * 2012-08-23 2015-12-02 富士フイルム株式会社 Colored radiation-sensitive composition and color filter using the same
JP6063200B2 (en) 2012-10-15 2017-01-18 旭化成株式会社 Photosensitive resin composition
JP6135314B2 (en) * 2012-12-26 2017-05-31 Jsr株式会社 Coloring composition, color filter and display element
JP6120560B2 (en) * 2012-12-26 2017-04-26 第一工業製薬株式会社 Color filter, black matrix, or curable resin composition for circuit formation
JP6257164B2 (en) 2013-03-28 2018-01-10 旭化成株式会社 Method for forming resist pattern
JP2015007766A (en) * 2013-05-27 2015-01-15 富士フイルム株式会社 Method for producing color filter, composition for forming underlayer, organic EL display device
CN105393171B (en) 2013-07-23 2019-11-26 日立化成株式会社 Projection exposure photosensitive polymer combination, photosensitive element, the forming method of corrosion-resisting pattern, the manufacturing method of the manufacturing method of printing distributing board and lead frame
MY198993A (en) * 2014-05-21 2023-10-06 Asahi Chemical Ind Photosensitive resin composition and method for forming circuit pattern

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