MY196431A - Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring Board - Google Patents

Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring Board

Info

Publication number
MY196431A
MY196431A MYPI2018700383A MYPI2018700383A MY196431A MY 196431 A MY196431 A MY 196431A MY PI2018700383 A MYPI2018700383 A MY PI2018700383A MY PI2018700383 A MYPI2018700383 A MY PI2018700383A MY 196431 A MY196431 A MY 196431A
Authority
MY
Malaysia
Prior art keywords
barrier layer
forming
photosensitive element
resin composition
wiring board
Prior art date
Application number
MYPI2018700383A
Inventor
Kume Masakazu
Ono Hiroshi
Matsumura Ryo
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=57885609&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY196431(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of MY196431A publication Critical patent/MY196431A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

An object is to provide a photosensitive element capable of improving the releasability between a barrier layer and a support film without using a release accelerator, and provided is a photosensitive element comprising a support film, a barrier layer, and a photosensitive layer in this order, wherein the barrier layer contains a water-soluble resin, and a C3 or higher alcohol.
MYPI2018700383A 2015-07-30 2016-07-20 Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring Board MY196431A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015150530 2015-07-30
PCT/JP2016/071311 WO2017018299A1 (en) 2015-07-30 2016-07-20 Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for producing printed wiring board

Publications (1)

Publication Number Publication Date
MY196431A true MY196431A (en) 2023-04-10

Family

ID=57885609

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018700383A MY196431A (en) 2015-07-30 2016-07-20 Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring Board

Country Status (6)

Country Link
JP (1) JP6870612B2 (en)
KR (3) KR20240159011A (en)
CN (3) CN110161802B (en)
MY (1) MY196431A (en)
TW (1) TWI705307B (en)
WO (1) WO2017018299A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018180168A (en) * 2017-04-07 2018-11-15 ホヤ レンズ タイランド リミテッドＨＯＹＡ Ｌｅｎｓ Ｔｈａｉｌａｎｄ Ｌｔｄ Method of manufacturing optical member having processing pattern formed thereon
JP2019179135A (en) * 2018-03-30 2019-10-17 ホヤ レンズ タイランド リミテッドＨＯＹＡ Ｌｅｎｓ Ｔｈａｉｌａｎｄ Ｌｔｄ Spectacle lens, spectacles, and method of fabricating spectacle lens
WO2019215848A1 (en) * 2018-05-09 2019-11-14 日立化成株式会社 Photosensitive element, barrier layer forming resin composition, resist pattern forming method, and printed wiring board manufacturing method
US20200083154A1 (en) 2018-09-10 2020-03-12 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component Carrier With a Photoimageable Dielectric Layer and a Structured Conductive Layer Being Used as a Mask for Selectively Exposing the Photoimageable Dielectric Layer With Electromagnetic Radiation
EP3723459B1 (en) 2019-04-10 2026-06-10 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with high passive intermodulation (pim) performance
JPWO2020261523A1 (en) * 2019-06-27 2020-12-30
KR20220084015A (en) * 2019-10-16 2022-06-21 쇼와덴코머티리얼즈가부시끼가이샤 Photosensitive resin film, resist pattern formation method, and wiring pattern formation method
WO2022102101A1 (en) * 2020-11-13 2022-05-19 昭和電工マテリアルズ株式会社 Photosensitive element, method for producing cured article, method for producing cured article pattern, and method for producing wiring board
JP2022120464A (en) * 2021-02-05 2022-08-18 昭和電工マテリアルズ株式会社 Method for producing metal mask
KR102686422B1 (en) * 2021-03-31 2024-07-17 코오롱인더스트리 주식회사 Photosensitive laminate, and method of manufacturing a circuit board using the same
KR102687652B1 (en) * 2021-03-31 2024-07-22 코오롱인더스트리 주식회사 Photosensitive laminate, method of manufacturing a photosensitive laminate, and method of manufacturing a circuit board using the same
KR102693253B1 (en) * 2021-03-31 2024-08-07 코오롱인더스트리 주식회사 Photosensitive laminate, and method of manufacturing a circuit board using the same
KR102687653B1 (en) * 2021-03-31 2024-07-22 코오롱인더스트리 주식회사 Photosensitive laminate, and method of manufacturing a circuit board using the same
KR102897456B1 (en) * 2021-12-01 2025-12-08 코오롱인더스트리 주식회사 Dry film photoresist, resist pattern, and circuit board, display device using the same
KR102897457B1 (en) * 2021-12-01 2025-12-08 코오롱인더스트리 주식회사 Dry film photoresist, resist pattern, and circuit board, display device using the same
WO2024009432A1 (en) * 2022-07-06 2024-01-11 株式会社レゾナック Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing semiconductor package substate or printed wiring board
WO2026028349A1 (en) * 2024-07-31 2026-02-05 株式会社レゾナック Photosensitive element, method for forming resist pattern, and method for manufacturing wiring board

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5551255Y2 (en) 1976-04-12 1980-11-28
JPS5483734U (en) 1977-11-26 1979-06-13
US4374190A (en) * 1978-09-28 1983-02-15 Am International, Inc. Erasable intermediate diazo-type paper
JPS59137948A (en) * 1983-01-27 1984-08-08 Mitsubishi Chem Ind Ltd Dry film photoresist material
JPS59137948U (en) * 1983-03-07 1984-09-14 コ−リツエンジニアリング株式会社 coke oven lid
US4835086A (en) * 1988-02-12 1989-05-30 Hoechst Celanese Corporation Polysulfone barrier layer for bi-level photoresists
JP2687187B2 (en) * 1990-12-01 1997-12-08 富士写真フイルム株式会社 Image forming method and transfer material
JPH11288095A (en) * 1998-03-31 1999-10-19 Nippon Paper Industries Co Ltd Oxygen intercepting film forming material and oxygen intercepting film
KR20040073286A (en) * 2001-12-13 2004-08-19 후지 샤신 필름 가부시기가이샤 Image forming material
CN1580953A (en) * 2003-08-15 2005-02-16 富士胶片株式会社 Light-sensitive transfer sheet, light-sensitive layers, picture pattern forming method and layout pattern forming method
JP2005202066A (en) * 2004-01-14 2005-07-28 Fuji Photo Film Co Ltd Light-sensitive transfer sheet, light-sensitive laminate, image pattern forming method, and wiring pattern forming method
JP2006058864A (en) * 2004-07-22 2006-03-02 Fuji Photo Film Co Ltd Pattern forming material, and pattern forming device and pattern forming method
CN101432661B (en) * 2006-04-28 2012-09-05 旭化成电子材料株式会社 Photosensitive resin laminate
JP4979391B2 (en) * 2007-01-17 2012-07-18 旭化成イーマテリアルズ株式会社 Photosensitive resin laminate
US7799504B2 (en) * 2007-06-05 2010-09-21 Eastman Kodak Company Mask film to form relief images and method of use
JP2010085552A (en) * 2008-09-30 2010-04-15 Fujifilm Corp Photomask blanks and photomask
JP5481339B2 (en) * 2009-09-30 2014-04-23 富士フイルム株式会社 Planographic printing plate precursor and plate making method
JP5814667B2 (en) 2011-07-15 2015-11-17 旭化成イーマテリアルズ株式会社 Photosensitive element
JP5743783B2 (en) * 2011-07-27 2015-07-01 富士フイルム株式会社 Photosensitive composition, planographic printing plate precursor, and polyurethane
EP2937731A4 (en) * 2012-12-12 2016-06-15 Hitachi Chemical Co Ltd Photosensitive resin composition and photosensitive film using same
JP6205925B2 (en) * 2013-07-12 2017-10-04 日立化成株式会社 Photosensitive conductive film, conductive pattern forming method using the same, and conductive pattern substrate
JP6284849B2 (en) * 2013-08-23 2018-02-28 富士フイルム株式会社 Laminate

Also Published As

Publication number Publication date
KR102721994B1 (en) 2024-10-28
TW201710796A (en) 2017-03-16
KR20230129587A (en) 2023-09-08
WO2017018299A1 (en) 2017-02-02
CN110161802B (en) 2022-08-23
KR102572426B9 (en) 2025-08-12
KR20240159011A (en) 2024-11-05
CN110225665B (en) 2021-04-06
CN107924130B (en) 2022-01-14
KR102572426B1 (en) 2023-08-30
CN110225665A (en) 2019-09-10
KR20180035827A (en) 2018-04-06
JPWO2017018299A1 (en) 2018-05-17
CN107924130A (en) 2018-04-17
JP6870612B2 (en) 2021-05-12
TWI705307B (en) 2020-09-21
CN110161802A (en) 2019-08-23

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